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    • 31. 发明授权
    • Memory system with two clock lines and a memory device
    • 具有两个时钟线和存储器件的存储器系统
    • US07173877B2
    • 2007-02-06
    • US10955177
    • 2004-09-30
    • Hermann RuckerbauerChristian SichertDominique SavignacPeter GregoriusPaul Wallner
    • Hermann RuckerbauerChristian SichertDominique SavignacPeter GregoriusPaul Wallner
    • G11C8/00
    • G11C5/04G11C5/063G11C7/22G11C7/222G11C11/4076
    • The present invention relates to a memory system having a memory device with two clock lines. One embodiment of the present invention provides a memory system comprising at least one memory device, a memory controller to control operation of the memory device, a first clock line which extends from a write clock output of the memory controller to a clock port of the memory device to provide a clock signal to the memory device, and a second clock line which extends from the clock port of the memory device to a read clock input of the memory controller to forward the clock signal applied to the clock port of the memory device back to a read clock input of the memory controller. The memory device may further comprise a synchronization circuit adapted to receive the clock signal from the memory controller and to, provide an output data synchronized to the forwarded clock signal.
    • 本发明涉及一种具有两条时钟线的存储器件的存储器系统。 本发明的一个实施例提供了一种存储器系统,其包括至少一个存储器件,用于控制存储器件的操作的存储器控​​制器,从存储器控制器的写时钟输出延伸到存储器的时钟端口的第一时钟线 向存储器件提供时钟信号的第二时钟线,以及从存储器件的时钟端口延伸到存储器控制器的读时钟输入端的第二时钟线,以将施加到存储器件的时钟端口的时钟信号转发回 到存储器控制器的读时钟输入。 存储器件还可以包括同步电路,其适于从存储器控制器接收时钟信号,并提供与转发的时钟信号同步的输出数据。
    • 32. 发明申请
    • Semiconductor memory module and system
    • 半导体存储器模块和系统
    • US20070025131A1
    • 2007-02-01
    • US11192335
    • 2005-07-29
    • Hermann RuckerbauerSimon MuffChristian WeissPeter Gregorius
    • Hermann RuckerbauerSimon MuffChristian WeissPeter Gregorius
    • G11C5/06
    • G11C5/04G11C5/06H05K1/142
    • The present invention includes a semiconductor memory modules and semiconductor memory systems using the same. The modules divide a conventional DIMM into a series of separate, smaller memory modules. Each memory module includes at least one semiconductor memory chip arranged on a substrate; CAwD signal input lines arranged on the substrate in a first predetermined line number and connecting one of the semiconductor memory chips to CAwD input signal pins on the substrate; and rD signal output lines arranged on the substrate in a second predetermined line number and connecting the one or a last semiconductor memory to a second number of rD output signal pins of the substrate. In a semiconductor memory system including the semiconductor memory modules, each memory module is separately connected to a memory controller by the CAwD signal input linesand the rD signal output lines in a respective point-to-point fashion.
    • 本发明包括半导体存储器模块和使用其的半导体存储器系统。 这些模块将常规DIMM分成一系列独立的较小内存模块。 每个存储器模块包括布置在衬底上的至少一个半导体存储器芯片; CAwD信号输入线,以第一预定行号排列在基板上,并将半导体存储器芯片之一连接到基板上的CAwD输入信号引脚; 和rD信号输出线,以第二预定行号排列在基板上,并将一个或最后一个半导体存储器连接到基板的第二数量的rD输出信号引脚。 在包括半导体存储器模块的半导体存储器系统中,每个存储器模块通过CAwD信号输入线和rD信号输出线分别以点对点的方式连接到存储器控制器。
    • 36. 发明申请
    • Semiconductor memory system and memory module
    • 半导体存储器系统和存储器模块
    • US20070079057A1
    • 2007-04-05
    • US11239829
    • 2005-09-30
    • Hermann RuckerbauerPeter Gregorius
    • Hermann RuckerbauerPeter Gregorius
    • G06F12/00G06F13/00
    • G06F13/1673G06F13/1684
    • A semiconductor memory system is disclosed. In one embodiment, the semiconductor memory system and memory module of the present invention provides a buffer, wherein at least one write buffer chip on the memory module is only buffering and registering write data, command and address signals written from a memory controller to the memory chips. As read data are written back from each memory chip directly to the memory controller through unidirectional point-to-point read data lines the present semiconductor memory system achieves a low latency as compared with a fully buffered DIMM concept. As read data are only unidirectional a high transmission bandwidth can be achieved.
    • 公开了半导体存储器系统。 在一个实施例中,本发明的半导体存储器系统和存储器模块提供了缓冲器,其中存储器模块上的至少一个写入缓冲器芯片仅缓冲并将从存储器控制器写入的写数据,命令和地址信号注册到存储器 筹码 由于读取数据通过单向点对点读取数据线直接从每个存储器芯片写回存储器控制器,与全缓冲DIMM概念相比,本半导体存储器系统实现了低延迟。 由于读取数据只是单向的,所以可以实现高传输带宽。
    • 37. 发明申请
    • Memory system and method of accessing memory chips of a memory system
    • 存储器系统和访问存储器系统的存储器芯片的方法
    • US20060291263A1
    • 2006-12-28
    • US11128789
    • 2005-05-13
    • Paul WallnerRalf SchledzPeter GregoriusHermann Ruckerbauer
    • Paul WallnerRalf SchledzPeter GregoriusHermann Ruckerbauer
    • G11C5/06
    • G11C5/063
    • A memory system and method is disclosed. In one embodiment, the memory system includes a memory controller and at least one memory module on which a certain number of semiconductor memory chips and connecting lines are arranged in a respectively specified topology. The connecting lines include first connecting lines forming transfer channels for a protocol based transfer of data and command signal streams from the memory controller to at least one of the memory chips on the memory module and from there to the memory controller, respectively. Second connecting lines are routed separately from the memory controller directly to at least one of the memory chips on the memory module for transferring select information to the at least one memory chip separately from the data and command signal streams.
    • 公开了一种存储器系统和方法。 在一个实施例中,存储器系统包括存储器控制器和至少一个存储器模块,其中一定数量的半导体存储器芯片和连接线被布置在分别指定的拓扑中。 连接线包括形成传输通道的第一连接线,用于基于协议的数据传输和命令信号流从存储器控制器分别存储到存储器模块上的存储器芯片和存储器控制器中的至少一个。 将第二连接线从存储器控制器直接路由到存储器模块上的至少一个存储器芯片,用于将选择信息与数据和命令信号流分离地传送到至少一个存储器芯片。
    • 39. 发明授权
    • High-speed interface circuit for semiconductor memory chips and memory system including the same
    • 用于半导体存储器芯片的高速接口电路和包含相同的存储器系统
    • US07475187B2
    • 2009-01-06
    • US11226457
    • 2005-09-15
    • Peter GregoriusHermann RuckerbauerPaul Wallner
    • Peter GregoriusHermann RuckerbauerPaul Wallner
    • G06F15/17
    • G11C7/1006G11C2207/107H03M9/00
    • In a semiconductor memory system, the memory chips are linked to a memory module in a shared loop forward architecture and connected in a point-to-point connection to a memory controller. Each memory chip includes a high-speed interface circuit including: a read and write data/command-and-address signal re-driver/transmitter path for re-driving serial read data and write data/command-and-address signals not destined for the semiconductor memory chip; and a main signal path which includes a serial-to-parallel converter and a synchronizer for serial-to-parallel converting and synchronizing with a reference clock signal write data/command-and-address signals destined for the semiconductor memory chip as well as a parallel-to-serial converter for parallel-to-serial converting read data signals read from a memory core of the memory chips, and a switch for inserting the parallel-to-serial converted read data signals into the re-driver/transmitter path. Optionally the high-speed interface circuit additionally includes a transparent re-driver/transmitter path not including any synchronizing circuitry.
    • 在半导体存储器系统中,存储器芯片被链接到共享回路前向架构中的存储器模块,并且以点对点连接连接到存储器控制器。 每个存储器芯片包括一个高速接口电路,包括:用于重新驱动串行读取数据的读取和写入数据/命令和地址信号重新驱动器/发送器路径,并且写入不预定的数据/命令和地址信号 半导体存储芯片; 以及主信号路径,其包括串行到并行转换器和用于串行到并行转换并与参考时钟信号同步的同步器,写入用于半导体存储器芯片的数据/命令和地址信号以及一个 并行到串行转换器,用于并行到串行转换从存储器芯片的存储器核心读取的读取数据信号,以及用于将并行到串行转换的读取数据信号插入重新驱动器/发送器路径的开关。 可选地,高速接口电路还包括不包括任何同步电路的透明重新驱动器/发射器路径。
    • 40. 发明授权
    • Memory system and method of accessing memory chips of a memory system
    • 存储器系统和访问存储器系统的存储器芯片的方法
    • US07339840B2
    • 2008-03-04
    • US11128789
    • 2005-05-13
    • Paul WallnerRalf SchledzPeter GregoriusHermann Ruckerbauer
    • Paul WallnerRalf SchledzPeter GregoriusHermann Ruckerbauer
    • G11C7/00
    • G11C5/063
    • A memory system and method is discussed. The memory system includes a memory controller and at least one memory module on which a certain number of semiconductor memory chips and connecting lines are arranged in a respectively specified topology. The connecting lines include first connecting lines forming transfer channels for a protocol based transfer of data and command signal streams from the memory controller to at least one of the memory chips on the memory module and from there to the memory controller, respectively. Second connecting lines are routed separately from the memory controller directly to at least one of the memory chips on the memory module for transferring select information to the at least one memory chip separately from the data and command signal streams.
    • 讨论了存储器系统和方法。 存储器系统包括存储器控制器和至少一个存储器模块,其中一定数量的半导体存储器芯片和连接线路布置在分别指定的拓扑中。 连接线包括形成传输通道的第一连接线,用于基于协议的数据传输和命令信号流从存储器控制器分别存储到存储器模块上的存储器芯片和存储器控制器中的至少一个。 将第二连接线从存储器控制器直接路由到存储器模块上的至少一个存储器芯片,用于将选择信息与数据和命令信号流分离地传送到至少一个存储器芯片。