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31. 发明授权

US06452789B1 Packaging architecture for 32 processor server 有权
标题翻译： 32处理器服务器的包装架构
公开(公告)号：US06452789B1
公开(公告)日：2002-09-17
申请号：US09562593
申请日：2000-04-29
申请人： Lisa Heid Pallotti , Eric C. Peterson , Christian L Belady , Terrel L. Morris , Michael C. Day
发明人： Lisa Heid Pallotti , Eric C. Peterson , Christian L Belady , Terrel L. Morris , Michael C. Day
IPC分类号： G06F1200
CPC分类号： G06F15/16
摘要： The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components on the cell board. A mechanical subassembly provides support for the cell board, as well as ventilation passages for cooling. Controller chips are connected to one side of the backplane, while the cell boards are connected to the other side. The controller chips manage cell board to cell board communications, and communications between the backplane and the computer system. The cell boards are arranged in back to back pairs, with the outer most cell boards having their components extend beyond the height of the backplane. This allows for an increase of spacing between the front to front interface of adjacent cell boards.
摘要翻译：本发明的系统使用背板来互连多个模块化单元板。每个单元板包括多个处理器，处理器控制器芯片，存储器子系统和电源子系统。处理器控制器芯片管理单元板上的组件之间的通信。机械子组件为电池板提供支撑，以及用于冷却的通风通道。控制器芯片连接到背板的一侧，而单元板连接到另一侧。控制器芯片管理单元板到单元板通信，以及背板和计算机系统之间的通信。单元板布置成背靠背对，其中最外面的单元板具有其组件延伸超出背板的高度。这允许相邻电池板的前面与前面之间的间隔增加。

32. 发明授权

US09069103B2 Localized weather prediction through utilization of cameras 有权
标题翻译：通过利用摄像机进行本地化天气预报
公开(公告)号：US09069103B2
公开(公告)日：2015-06-30
申请号：US12970972
申请日：2010-12-17
申请人： Charles Joseph Williams , Gabriel Kliot , Chia-Chi Lin , Shaun L. Harris , Christian L. Belady , Eric C. Peterson
发明人： Charles Joseph Williams , Gabriel Kliot , Chia-Chi Lin , Shaun L. Harris , Christian L. Belady , Eric C. Peterson
IPC分类号： G01D3/00 , G01W1/00 , G06K9/00
CPC分类号： G05F1/66 , G01W1/00 , G06K9/0063 , G06N5/048
摘要： Described herein are various technologies pertaining to predicting an amount of electrical power that is to be generated by a power system at a future point in time, wherein the power system utilizes a renewable energy resource to generate electrical power. A camera is positioned to capture an image of sky over a geographic region of interest. The image is analyzed to predict an amount of solar radiation that is to be received by the power source at a future point in time. The predicted solar radiation is used to predict an amount of electrical power that will be output by the power system at the future point in time. A computational resource of a data center that is powered by way of the power source is managed as a function of the predicted amount of power.
摘要翻译：这里描述的是关于预测在未来时间点由电力系统产生的电力量的各种技术，其中电力系统利用可再生能源来产生电力。相机被定位成在感兴趣的地理区域上捕获天空的图像。分析图像以预测未来时间点将由电源接收的太阳辐射量。预测的太阳辐射用于预测未来时间点将由电力系统输出的电力量。通过电源供电的数据中心的计算资源根据预测的功率量进行管理。

33. 发明授权

US08749986B1 Flexible midplane and architecture for a multi-processor computer system 有权
标题翻译：适用于多处理器计算机系统的灵活中平面和架构
公开(公告)号：US08749986B1
公开(公告)日：2014-06-10
申请号：US11314479
申请日：2005-12-21
申请人： Eric C. Peterson , Christian L. Belady
发明人： Eric C. Peterson , Christian L. Belady
IPC分类号： H05K1/00
CPC分类号： H05K3/368 , H05K1/0278 , H05K1/117 , H05K3/361 , H05K3/366 , H05K7/1444 , H05K7/1492 , H05K2201/042 , H05K2201/047 , H05K2201/052
摘要： A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the middle section and each side section; wherein each flexible region permits the corresponding side section to be bent in relation to the middle section.
摘要翻译：柔性中平面包括：印刷电路板，包括：中间部分和至少一个侧部分; 以及设置在中间部分和每个侧部分之间的柔性区域; 其中每个柔性区域允许相应的侧部部分相对于中间部分弯曲。

34. 发明授权

US08582302B2 Modular equipment rack system for data center 有权
公开(公告)号：US08582302B2
公开(公告)日：2013-11-12
申请号：US13296266
申请日：2011-11-15
申请人： Eric C. Peterson , Shaun L. Harris , Mark Edward Shaw , Matthew Allen Faist , Christian L. Belady , Darren Shakib
发明人： Eric C. Peterson , Shaun L. Harris , Mark Edward Shaw , Matthew Allen Faist , Christian L. Belady , Darren Shakib
IPC分类号： H05K7/14
CPC分类号： H05K7/14 , H05K7/1492 , Y10T29/49716
摘要： Various technologies described herein pertain to racking equipment in a data center. A modular equipment rack system can include an upper track, a lower track, a vertical support, a power and network distribution unit, and a tray. The upper track and the lower track can respectively include incrementally spaced mounting locations at which the vertical support and the power and network distribution unit can be attachable. The tray can be attachable to the vertical support and the power and network distribution unit when the vertical support is attached to the upper track at a first upper mounting location and attached to the lower track at a corresponding first lower mounting location, and the power and network distribution unit is attached to the upper track at a second upper mounting location and attached to the lower track at a corresponding second lower mounting location.

35. 发明授权

US08487473B2 Hierarchical power smoothing 有权
标题翻译：分层功率平滑
公开(公告)号：US08487473B2
公开(公告)日：2013-07-16
申请号：US12822949
申请日：2010-06-24
申请人： Eric C. Peterson , Shaun L. Harris , Christian L. Belady , Frank J. Wirtz
发明人： Eric C. Peterson , Shaun L. Harris , Christian L. Belady , Frank J. Wirtz
IPC分类号： H02J1/10 , H02J3/00 , H02J3/14
CPC分类号： G06F1/263 , G06F1/3206 , G06F1/3234 , H02J9/06 , Y10T307/305 , Y10T307/391 , Y10T307/615 , Y10T307/696
摘要： Power is provided to one or more devices in a system that includes a hierarchical power smoothing environment having multiple tiers. In response to a peak in power usage by the one or more devices, power is provided from a first power smoothing component in a first tier of the multiple tiers. Additionally, power is provided to the one or more devices from power smoothing components in each of other tiers of the multiple tiers if the power smoothing component in a next lower tier of the multiple tiers is unable to provide sufficient power for the peak in power usage. If the power smoothing components in the multiple tiers are unable to provide sufficient power for the peak in power usage, then performance of at least one of the one or more devices is reduced in response to the peak in power usage.
摘要翻译：电力被提供给系统中的一个或多个设备，该系统包括具有多个层的分层功率平滑环境。响应于一个或多个设备的电力使用的峰值，从多层的第一层中的第一功率平滑组件提供功率。此外，如果多层下一层较低层中的功率平滑分量不能为功率使用中的峰值提供足够的功率，则向多个设备中的功率平滑组件提供功率平滑组件给多个层的每个其他层中的功率平滑组件。如果多层中的功率平滑分量不能为功率使用中的峰值提供足够的功率，则响应于功率使用的峰值来降低一个或多个设备中的至少一个的性能。

36. 发明授权

US08384244B2 Rack-based uninterruptible power supply 有权
标题翻译：机架式不间断电源
公开(公告)号：US08384244B2
公开(公告)日：2013-02-26
申请号：US12797497
申请日：2010-06-09
申请人： Eric C. Peterson , Shaun L. Harris , Christian L. Belady , Darren A. Shakib , Sompong Paul Olarig , Frank J. Wirtz
发明人： Eric C. Peterson , Shaun L. Harris , Christian L. Belady , Darren A. Shakib , Sompong Paul Olarig , Frank J. Wirtz
IPC分类号： H02J7/00
CPC分类号： H02J9/08 , G06F1/263 , G06F1/30 , H05K7/1457 , H05K7/1492 , Y10T307/25 , Y10T307/50 , Y10T307/527 , Y10T307/615 , Y10T307/62 , Y10T307/625
摘要： A rack power unit is configured to be inserted into a device rack of a data center. The rack power unit includes one or more power supplies and one or more battery packs. The one or more power supplies are each configured to receive power (e.g., AC power) when the apparatus is in the device rack, and convert the received power to a DC power. The one or more power supplies are further configured to output the DC power to a DC power bus of the device rack. The one or more battery packs are each configured to provide, in response to an interruption in the received power, DC power to the DC power bus of the device rack.
摘要翻译：机架电源单元被配置为插入到数据中心的设备机架中。机架电源单元包括一个或多个电源和一个或多个电池组。一个或多个电源被配置为当设备在设备机架中时接收电力（例如，AC电力），并将接收的功率转换为DC电力。一个或多个电源还被配置为将DC电力输出到设备机架的DC电源总线。所述一个或多个电池组被配置为响应于接收到的功率的中断而提供到设备机架的DC电源总线的DC电力。

37. 发明申请

US20110304211A1 Rack-Based Uninterruptible Power Supply 有权
标题翻译：机架式不间断电源
公开(公告)号：US20110304211A1
公开(公告)日：2011-12-15
申请号：US12797497
申请日：2010-06-09
申请人： Eric C. Peterson , Shaun L. Harris , Christian L. Belady , Darren A. Shakib , Sompong Paul Olarig , Frank J. Wirtz
发明人： Eric C. Peterson , Shaun L. Harris , Christian L. Belady , Darren A. Shakib , Sompong Paul Olarig , Frank J. Wirtz
IPC分类号： H02J7/34 , H02J9/08
CPC分类号： H02J9/08 , G06F1/263 , G06F1/30 , H05K7/1457 , H05K7/1492 , Y10T307/25 , Y10T307/50 , Y10T307/527 , Y10T307/615 , Y10T307/62 , Y10T307/625
摘要： A rack power unit is configured to be inserted into a device rack of a data center. The rack power unit includes one or more power supplies and one or more battery packs. The one or more power supplies are each configured to receive power (e.g., AC power) when the apparatus is in the device rack, and convert the received power to a DC power. The one or more power supplies are further configured to output the DC power to a DC power bus of the device rack. The one or more battery packs are each configured to provide, in response to an interruption in the received power, DC power to the DC power bus of the device rack.
摘要翻译：机架电源单元被配置为插入到数据中心的设备机架中。机架电源单元包括一个或多个电源和一个或多个电池组。一个或多个电源被配置为当设备在设备机架中时接收电力（例如，AC电力），并将接收的功率转换为DC电力。一个或多个电源还被配置为将DC电力输出到设备机架的DC电源总线。所述一个或多个电池组被配置为响应于接收到的功率的中断而提供到设备机架的DC电源总线的DC电力。

38. 发明申请

US20080101020A1 COMPUTER SYSTEM HAVING MULTI-DIRECTION BLOWER 有权
标题翻译：具有多方向风机的计算机系统
公开(公告)号：US20080101020A1
公开(公告)日：2008-05-01
申请号：US11552707
申请日：2006-10-25
申请人： Robert B. CURTIS , Eric C. Peterson , Christian L. Belady
发明人： Robert B. CURTIS , Eric C. Peterson , Christian L. Belady
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , G06F1/20
摘要： A computer system comprises a chassis and first and second electronic components disposed within the chassis. The computer system also comprises a multi-direction blower module having a blower housing connected to the chassis The blower housing comprises an inlet, a first outlet, and a second outlet. A centrifugal blower is rotatably mounted within the blower housing. An internal wall is disposed within the blower housing and partially surrounds the blower The airflow into the inlet is passed in thermal communication with the first electronic component. The airflow from the first outlet is passed in thermal communication with the second electronic device. The airflow from the second outlet is exhausted from the chassis.
摘要翻译：计算机系统包括底盘以及设置在底盘内的第一和第二电子部件。计算机系统还包括具有连接到底盘的鼓风机壳体的多向鼓风机模块。鼓风机壳体包括入口，第一出口和第二出口。离心鼓风机可旋转地安装在鼓风机壳体内。内壁设置在鼓风机壳体内并且部分地围绕鼓风机进入入口的气流与第一电子部件热连通地通过。来自第一出口的气流通过与第二电子设备热连通。来自第二出口的气流从底盘排出。

39. 发明授权

US07327569B2 Processor module with thermal dissipation device 有权
标题翻译：带散热装置的处理器模块
公开(公告)号：US07327569B2
公开(公告)日：2008-02-05
申请号：US11011328
申请日：2004-12-13
申请人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson
发明人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , G06F1/189 , G06F1/20 , H01L25/105 , H01L25/162 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device extends between the processor and the system board. The second portion connects on top of the first portion and has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
摘要翻译：实施例包括用于系统板的处理器模块的装置，方法和系统。电子模块可拆卸地连接到系统板。电子模块具有第一和第二部分。第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。散热装置在处理器和系统板之间延伸。第二部分连接在第一部分的顶部，并且具有用于向处理器提供电力的电力系统板。电源系统板相邻并平行于PCB的第二侧延伸。

40. 发明授权

US07289328B2 Multi-chip module with power system and pass-thru holes 有权
标题翻译：带电源系统和通孔的多芯片模块
公开(公告)号：US07289328B2
公开(公告)日：2007-10-30
申请号：US11021500
申请日：2004-12-21
申请人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
发明人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
IPC分类号： H05K7/20
CPC分类号： H05K7/20436 , H05K1/0204 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.
摘要翻译：实施例包括具有电源系统和通孔的多芯片模块的装置，方法和系统。示例性电子模块包括具有带存储器的第一印刷电路板（PCB）和多个处理器的第一部分。第二部分具有动力系统和散热装置。散热装置具有多个延伸部，电力系统具有多个通过孔。当多个延伸部延伸穿过电力系统的多个通孔并且通过设置在第一和第二部分之间的第二PCB的多个通过孔时，第一部分电耦合到第二部分以形成电子模块。

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