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    • 31. 发明授权
    • Method of locating common electrode shorts in an imager assembly
    • 在成像器组件中定位公共电极短路的方法
    • US5463322A
    • 1995-10-31
    • US161037
    • 1993-12-03
    • Robert F. KwasnickJoseph M. Pimbley
    • Robert F. KwasnickJoseph M. Pimbley
    • G09G3/00G01R31/08
    • G09G3/006
    • A process for locating common electrode shorts in an electronic array, such as an x- y- addressed imager assembly having a short circuit between an address line and an overlying common electrode layer, includes the steps of applying a test voltage to the addressed line shorted to the common electrode, measuring current at each of a plurality of common electrode contact points disposed at selected intervals along selected edges of the common electrode, and processing the respective measured currents in accordance with a selected relationship to localize a short circuit location along the length of the shorted address line. In imager assembly arrangements in which it is possible to measure currents on opposite sides of the common electrode disposed substantially perpendicular to the orientation of the shorted address line, the selected relationship is I.sub.A-N /I.sub.a-n =(L-X)/X, wherein: I.sub.A-N are the measured currents from common electrode contact points along one common electrode opposite edge; I.sub.a-n are the measured currents from common electrode contact points along the the other common electrode opposite edge; L represents the length of the shorted address line; and X represents the point of the short circuit as distance from the common electrode first opposite edge. An x- y- addressed imager assembly adapted for use of this method includes a common electrode having more than two electrical contact points disposed at selected intervals along each edge of the common electrode that corresponds to a lateral boundary of the imager assembly.
    • 用于定位电子阵列中的公共电极短路的方法,例如在地址线和上覆的公共电极层之间具有短路的x-y寻址的成像器组件,包括将测试电压施加到寻址的线路短路 在公共电极上测量沿着公共电极的选定边缘以选定间隔设置的多个公共电极接触点中的每一个处的电流,以及根据所选择的关系处理各个测量电流以沿着长度定位短路位置 的短路地址线。 在成像器组合装置中,其中可以测量基本上垂直于短路地址线的取向设置的公共电极的相对侧上的电流,所选择的关系是IA-N / Ia-n =(LX)/ X,其中 :IA-N是沿着一个公共电极相对边缘的公共电极接触点的测量电流; Ia-n是沿着另一个公共电极相对边缘的公共电极接触点的测量电流; L表示短路地址线的长度; X表示作为与公共电极第一相对边缘的距离的短路点。 适于使用该方法的x面寻址的成像器组件包括具有多于两个电接触点的公共电极,该电接触点沿着对应于成像器组件的横向边界的公共电极的每个边缘以选定的间隔设置。
    • 32. 发明授权
    • Method for reduction of off-current in thin film transistors
    • 降低薄膜晶体管截止电流的方法
    • US5384271A
    • 1995-01-24
    • US130807
    • 1993-10-04
    • Robert F. KwasnickGeorge E. Possin
    • Robert F. KwasnickGeorge E. Possin
    • H01L21/324H01L21/336H01L29/78H01L29/786H01L21/24
    • H01L29/66765Y10S438/958
    • A method of fabricating a thin film transistor having reduced off-current leakage includes the steps of forming a TFT body with a channel region disposed between a source electrode and a drain electrode and then passivating the exposed portion of the channel region. The passivation includes the steps of wet etching the exposed portions of the channel region in an hydrofluoric acid etchant for a first selected etch time; dry etching the exposed channel region in a reactive ion etching procedure for a second selected etch time; wet etching the channel region again with hydrofluoric acid for a third selected etch time; and then treating the channel region with a cleansing agent, such as photoresist stripper; and annealing the exposed portion of the channel region.
    • 制造具有减少的截止电流泄漏的薄膜晶体管的方法包括以下步骤:形成具有设置在源极和漏极之间的沟道区,然后钝化沟道区的暴露部分的TFT体。 钝化包括在第一选择的蚀刻时间内在氢氟酸蚀刻剂中湿蚀刻沟道区的暴露部分的步骤; 在反应离子蚀刻过程中对第二选择的蚀刻时间的暴露的沟道区进行干蚀刻; 用氢氟酸再次湿蚀刻通道区域进行第三选择的蚀刻时间; 然后用清洁剂如光致抗蚀剂剥离剂处理通道区域; 以及对通道区域的暴露部分进行退火。
    • 33. 发明授权
    • Method of making a thin film transistor structure with improved
source/drain contacts
    • 制造具有改善的源极/漏极触点的薄膜晶体管结构的方法
    • US5362660A
    • 1994-11-08
    • US977967
    • 1992-11-18
    • Robert F. KwasnickGeorge E. PossinDavid E. HoldenRichard J. Saia
    • Robert F. KwasnickGeorge E. PossinDavid E. HoldenRichard J. Saia
    • H01L21/3213H01L21/336H01L29/45H01L21/265
    • H01L29/66765H01L21/32139H01L29/458Y10S438/97
    • Minimum line spacing is reduced and line spacing uniformity is increased in thin film transistors by employing source/drain metallization having a first relatively thin layer of a first conductor and a second relatively thick layer of a second conductor. The second conductor is selected to be one which may be preferentially etched in the presence of the first conductor whereby the first conductor acts as an etch stop for the etchant used to pattern the second conductor portion of the source/drain metallization. This etching is preferably done using dry etching. Dry etching typically provides substantially better control of line width than wet etching. The etching of the second conductor can be done with a dry etch process which etches the photoresist at substantially the same rate as the second conductor whereby the second conductor is provided with a sidewall slope of substantially 45.degree. which improves the quality of passivation provided by subsequent deposition of a conformal passivating layer.
    • 通过采用具有第一相对薄的第一导体层和第二相对较厚的第二导体层的源极/漏极金属化,薄膜晶体管中的最小线间距减小,并且线间隔均匀性增加。 第二导体被选择为可以在第一导体存在的情况下优先蚀刻的导体,由此第一导体充当用于图案化源极/漏极金属化的第二导体部分的蚀刻剂的蚀刻停止。 该蚀刻优选使用干蚀刻进行。 干蚀刻通常比湿式蚀刻提供对线宽度的更好的控制。 第二导体的蚀刻可以通过干法蚀刻工艺进行,该蚀刻工艺以基本上与第二导体相同的速率蚀刻光致抗蚀剂,由此第二导体设置有大致为45°的侧壁斜率,这提高了后续提供的钝化质量 共形钝化层的沉积。
    • 36. 发明授权
    • Forming organic light emitting device displays
    • 形成有机发光装置显示
    • US06822256B2
    • 2004-11-23
    • US09954882
    • 2001-09-18
    • Robert F. KwasnickMary E. Swallow
    • Robert F. KwasnickMary E. Swallow
    • H01L3300
    • H01L51/5253
    • An organic light emitting device display may be formed that is suitably passivated while still permitting electrical access to cathodes and anodes via electrical contacts. In one embodiment, a barrier layer may be formed over the light emitting material to prevent moisture or other ambient attack. The barrier layer may be covered with other layers to form an outer and inner via down to the cathode or anode to be contacted. A contact metal may be provided to the anode or cathode. The layers over the barrier layer permit patterning and contact formation while the barrier layer adequately protects the light emitting material during those steps and thereafter.
    • 可以形成适当钝化的有机发光器件显示器,同时允许通过电触点电接入阴极和阳极。 在一个实施例中,阻挡层可以形成在发光材料上方以防止水分或其它环境侵袭。 阻挡层可以被其它层覆盖,以形成下接到阴极或阳极的外部和内部通孔。 可以向阳极或阴极提供接触金属。 阻挡层上方的层允许图案化和接触形成,而阻挡层在这些步骤和之后充分保护发光材料。
    • 38. 发明授权
    • Lift-off fabrication method for self-aligned thin film transistors
    • 自对准薄膜晶体管的剥离制造方法
    • US5391507A
    • 1995-02-21
    • US115973
    • 1993-09-03
    • Robert F. KwasnickGeorge E. Possin
    • Robert F. KwasnickGeorge E. Possin
    • H01L29/78H01L21/336H01L29/786H01L21/265
    • H01L29/78696H01L29/66765Y10S148/10
    • A method of fabricating a self-aligned thin film transistor (TFT) with a lift-off technique includes the steps of forming a multi-tier island on a semiconductive layer such that the island structure is disposed in a desired alignment over the gate electrode. The island structure includes a base layer portion, an intermediate body portion, and an upper cap portion, which overhangs the intermediate body portion by an amount between about 0.5 .mu.m and 1.5 .mu.m. Source and drain electrodes are formed such that the source/drain material is disposed over the semiconductive material up to the sidewalls of the base portion of the island structure, which base portion is patterned such that the source and drain electrodes are self-aligned with and extend a selected overlap distance over the gate to provide desired TFT performance characteristics. The upper cap layer is removed in a lift-off technique and the intermediate body portion of the island is removed to complete fabrication oft the TFT.
    • 利用剥离技术制造自对准薄膜晶体管(TFT)的方法包括以下步骤:在半导体层上形成多层岛,使得岛状结构以栅极电极的所需对准方式设置。 岛结构包括基底层部分,中间体部分和上盖部分,其以约0.5μm和1.5μm之间的量伸出中间体部分。 源极和漏极形成为使得源极/漏极材料设置在半导体材料上方直到岛状结构的基部的侧壁,该基极部分被图案化,使得源极和漏极电极自对准, 在栅极上延伸选定的重叠距离,以提供所需的TFT性能特征。 在剥离技术中去除上盖层,去除岛的中间体部分以完成TFT的制造。