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    • 32. 发明授权
    • Method for programming a memory structure
    • 用于编程存储器结构的方法
    • US07952934B2
    • 2011-05-31
    • US12943937
    • 2010-11-11
    • Riichiro ShirotaChing-Hsiang HsuCheng-Jye Liu
    • Riichiro ShirotaChing-Hsiang HsuCheng-Jye Liu
    • G11C11/34
    • G11C16/3418
    • A memory structure includes a first memory cell and a second memory cell located at an identical bit line and adjacent to the first memory cell. Each memory cell includes a substrate, a source, a drain, a charge storage device, and a gate. A method for programming the memory structure includes respectively providing a first gate biasing voltage and a second gate biasing voltage to the gates of the first memory cell and the second memory cell, boosting an absolute value of a channel voltage of the first memory cell to generate electron and hole pairs at the drain of the second memory cell through gate-induced drain leakage or band-to-band tunneling, and injecting the hole of the generated electron and hole pairs into the charge storage device of the first memory cell to program the first memory cell.
    • 存储器结构包括位于相同位线并与第一存储器单元相邻的第一存储器单元和第二存储器单元。 每个存储单元包括衬底,源极,漏极,电荷存储器件和栅极。 用于对存储器结构进行编程的方法包括:分别向第一存储单元和第二存储单元的栅极提供第一栅极偏置电压和第二栅极偏置电压,提升第一存储单元的沟道电压的绝对值以产生 电子和空穴对,通过栅极引起的漏极泄漏或带对带通隧道在第二存储单元的漏极处,并且将所产生的电子和空穴对的空穴注入到第一存储器单元的电荷存储装置中以对 第一个存储单元
    • 33. 发明申请
    • METHOD FOR PROGRAMMING A MEMORY STRUCTURE
    • 编程存储器结构的方法
    • US20110051526A1
    • 2011-03-03
    • US12943937
    • 2010-11-11
    • Riichiro ShirotaChing-Hsiang HsuCheng-Jye Liu
    • Riichiro ShirotaChing-Hsiang HsuCheng-Jye Liu
    • G11C16/12G11C17/08G11C11/40
    • G11C16/3418
    • A memory structure includes a first memory cell and a second memory cell located at an identical bit line and adjacent to the first memory cell. Each memory cell includes a substrate, a source, a drain, a charge storage device, and a gate. A method for programming the memory structure includes respectively providing a first gate biasing voltage and a second gate biasing voltage to the gates of the first memory cell and the second memory cell, boosting an absolute value of a channel voltage of the first memory cell to generate electron and hole pairs at the drain of the second memory cell through gate-induced drain leakage or band-to-band tunneling, and injecting the hole of the generated electron and hole pairs into the charge storage device of the first memory cell to program the first memory cell.
    • 存储器结构包括位于相同位线并与第一存储器单元相邻的第一存储器单元和第二存储器单元。 每个存储单元包括衬底,源极,漏极,电荷存储器件和栅极。 用于对存储器结构进行编程的方法包括:分别向第一存储单元和第二存储单元的栅极提供第一栅极偏置电压和第二栅极偏置电压,提升第一存储单元的沟道电压的绝对值以产生 电子和空穴对,通过栅极引起的漏极泄漏或带对带通隧道在第二存储单元的漏极处,并且将所产生的电子和空穴对的空穴注入到第一存储器单元的电荷存储装置中以对 第一个存储单元
    • 35. 发明授权
    • Non-volatile memory with a stable threshold voltage on SOI substrate
    • 在SOI衬底上具有稳定阈值电压的非易失性存储器
    • US07855417B2
    • 2010-12-21
    • US11833235
    • 2007-08-03
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • H01L29/786H01L29/792
    • H01L27/115
    • A non-volatile memory disposed in a SOI substrate is provided. The non-volatile memory includes a memory cell and a first conductive type doped region. The memory cell includes a gate, a charge storage structure, a bottom dielectric layer, a second conductive type drain region, and a second conductive type source region. The gate is disposed on the SOI substrate. The charge storage structure is disposed between the gate and the SOI substrate. The bottom dielectric layer is disposed between the charge storage layer and the SOI substrate. The second conductive type drain region and the second conductive type source region are disposed in a first conductive type silicon body layer next to the two sides of the gate. The first conductive type doped region is disposed in the first conductive type silicon body layer and electrically connected to the conductive type silicon body layer beneath the gate.
    • 设置在SOI衬底中的非易失性存储器。 非易失性存储器包括存储单元和第一导电类型掺杂区域。 存储单元包括栅极,电荷存储结构,底部电介质层,第二导电类型漏极区域和第二导电型源极区域。 栅极设置在SOI衬底上。 电荷存储结构设置在栅极和SOI衬底之间。 底部电介质层设置在电荷存储层和SOI衬底之间。 第二导电型漏极区域和第二导电型源极区域设置在栅极的两侧旁边的第一导电型硅体层中。 第一导电型掺杂区域设置在第一导电型硅体层中,并且电连接到栅极下方的导电型硅体层。
    • 37. 发明申请
    • FIELD COLOR SEQUENTIAL DISPLAY CONTROL SYSTEM
    • 现场颜色顺序显示控制系统
    • US20100289834A1
    • 2010-11-18
    • US12775585
    • 2010-05-07
    • Yung Ching LEEChing-Hsiang Hsu
    • Yung Ching LEEChing-Hsiang Hsu
    • G09G5/10
    • G09G3/3607G09G3/3413G09G5/39G09G2310/0235G09G2360/18
    • Field color sequential (FCS) control system applied for an FCS display device is provided. The FCS control system includes an input system, a memory and an output system. The input system, including a plurality of buffers respectively corresponding to different color channels, receives different color channel components of pixels in parallel such that components of a same color channel are stored in a same buffer. The memory, including a plurality of partitions respectively corresponding to different color channels, stores components of a same color channel to a same partition in association with triggering of rising and falling edges of a clock, respectively. The output system sequentially buffers and outputs color channel components of corresponding partitions.
    • 提供了应用于FCS显示设备的场彩色顺序(FCS)控制系统。 FCS控制系统包括输入系统,存储器和输出系统。 包括分别对应于不同颜色通道的多个缓冲器的输入系统并行地接收像素的不同颜色通道分量,使得相同颜色通道的组件被存储在相同的缓冲器中。 包括分别对应于不同颜色通道的多个分区的存储器分别将时钟的上升沿和下降沿的触发相关联地存储到相同分区中的相同颜色通道的分量。 输出系统顺序地缓冲并输出相应分区的色彩通道分量。
    • 39. 发明申请
    • METHOD FOR PROGRAMMING A MEMORY STRUCTURE
    • 编程存储器结构的方法
    • US20090168531A1
    • 2009-07-02
    • US12144645
    • 2008-06-24
    • Riichiro ShirotaChing-Hsiang HsuCheng-Jye Liu
    • Riichiro ShirotaChing-Hsiang HsuCheng-Jye Liu
    • G11C16/04
    • G11C16/3418
    • A memory structure includes a first memory cell and a second memory cell located at an identical bit line and adjacent to the first memory cell. Each memory cell includes a substrate, a source, a drain, a charge storage device, and a gate. A method for programming the memory structure includes respectively providing a first gate biasing voltage and a second gate biasing voltage to the first memory cell and the second memory cell, boosting the absolute value of a channel voltage of the first memory cell to generate electron and hole pairs at the drain of the second memory cell through gate-induced drain leakage or band-to-band tunneling, and injecting the electron of the generated electron and hole pairs into the charge storage device of the first memory cell to program the first memory cell.
    • 存储器结构包括位于相同位线并与第一存储器单元相邻的第一存储器单元和第二存储器单元。 每个存储单元包括衬底,源极,漏极,电荷存储器件和栅极。 一种用于对存储器结构进行编程的方法包括分别向第一存储单元和第二存储单元提供第一栅极偏置电压和第二栅极偏置电压,提高第一存储单元的沟道电压的绝对值以产生电子和空穴 通过栅极引起的漏极泄漏或带对带隧穿在第二存储单元的漏极处对,并将所产生的电子和空穴对的电子注入到第一存储单元的电荷存储装置中,以对第一存储单元 。