会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 33. 发明申请
    • Thin-Film Devices Formed From Solid Group IIIA Particles
    • 由固体IIIA族颗粒形成的薄膜器件
    • US20130034932A1
    • 2013-02-07
    • US13571685
    • 2012-08-10
    • Matthew R. RobinsonChris EberspacherJeroen K.J. Van Duren
    • Matthew R. RobinsonChris EberspacherJeroen K.J. Van Duren
    • H01L31/18
    • H01L31/0322Y02E10/541
    • Methods and devices are provided for forming thin-films from solid group IIIA-based particles. In one embodiment of the present invention, a method is described comprising of providing a first material comprising an alloy of a) a group IIIA-based material and b) at least one other material. The material may be included in an amount sufficient so that no liquid phase of the alloy is present within the first material in a temperature range between room temperature and a deposition or pre-deposition temperature higher than room temperature, wherein the group IIIA-based material is otherwise liquid in that temperature range. The other material may be a group IA material. A precursor material may be formulated comprising a) particles of the first material and b) particles containing at least one element from the group consisting of: group IB, IIIA, VIA element, alloys containing any of the foregoing elements, or combinations thereof. The temperature range described above may be between about 20° C. and about 200° C. It should be understood that the alloy may have a higher melting temperature than a melting temperature of the IIIA-based material in elemental form.
    • 提供了用于从基于固体IIIA的颗粒形成薄膜的方法和装置。 在本发明的一个实施方案中,描述了一种方法,其包括提供包含a)基于IIIA族的材料和b)至少一种其它材料的合金的第一材料。 可以以足够的量包含材料,使得在室温和高于室温的沉积或预沉积温度之间的温度范围内,第一材料中不存在液相,其中基于IIIA族的材料 在该温度范围内为液体。 另一种材料可以是IA族材料。 可以配制前体材料,其包括:a)第一材料的颗粒,和b)含有至少一种元素的颗粒,所述元素包括:IB,IIIA族,VIA族元素,含有任何上述元素的合金,或其组合。 上述温度范围可以在约20℃至约200℃之间。应当理解,该合金可以具有比基于IIIA的材料以元素形式的熔融温度更高的熔融温度。
    • 34. 发明申请
    • THIN-FILM DEVICES FORMED FROM SOLID GROUP IIIA PARTICLES
    • 从固体IIIA颗粒形成的薄膜装置
    • US20110114182A1
    • 2011-05-19
    • US12776353
    • 2010-05-07
    • Matthew R. RobinsonChris EberspacherJeroen K. J. Van Duren
    • Matthew R. RobinsonChris EberspacherJeroen K. J. Van Duren
    • H01L31/0264H01L31/18
    • H01L31/0322Y02E10/541
    • Methods and devices are provided for forming thin-films from solid group IIIA-based particles. In one embodiment of the present invention, a method is described comprising of providing a first material comprising an alloy of a) a group IIIA-based material and b) at least one other material. The material may be included in an amount sufficient so that no liquid phase of the alloy is present within the first material in a temperature range between room temperature and a deposition or pre-deposition temperature higher than room temperature, wherein the group IIIA-based material is otherwise liquid in that temperature range. The other material may be a group IA material. A precursor material may be formulated comprising a) particles of the first material and b) particles containing at least one element from the group consisting of: group IB, IIIA, VIA element, alloys containing any of the foregoing elements, or combinations thereof. The temperature range described above may be between about 20° C. and about 200° C. It should be understood that the alloy may have a higher melting temperature than a melting temperature of the IIIA-based material in elemental form.
    • 提供了用于从基于固体IIIA的颗粒形成薄膜的方法和装置。 在本发明的一个实施方案中,描述了一种方法,其包括提供包含a)基于IIIA族的材料和b)至少一种其它材料的合金的第一材料。 可以以足够的量包含材料,使得在室温和高于室温的沉积或预沉积温度之间的温度范围内,第一材料中不存在液相,其中基于IIIA族的材料 在该温度范围内为液体。 另一种材料可以是IA族材料。 可以配制前体材料,其包括:a)第一材料的颗粒,和b)含有至少一种元素的颗粒,所述元素包括:IB,IIIA族,VIA族元素,含有任何上述元素的合金,或其组合。 上述温度范围可以在约20℃至约200℃之间。应当理解,该合金可以具有比基于IIIA的材料以元素形式的熔融温度更高的熔融温度。
    • 36. 发明申请
    • Thin-Film Devices Formed From Solid Particles
    • 固体颗粒形成的薄膜器件
    • US20100291758A1
    • 2010-11-18
    • US12304683
    • 2007-06-12
    • Matthew R. RobinsonChris EberspacherJeroen K.J. Van Duren
    • Matthew R. RobinsonChris EberspacherJeroen K.J. Van Duren
    • H01L21/18C09D1/00
    • H01L31/0322Y02E10/541
    • Methods and devices are provided for forming thin-films from solid group IIIA-based particles. In one embodiment of the present invention, a method is described comprising of providing a first material comprising an alloy of a) a group IIIA-based material and b) at least one other material. The material may be included in an amount sufficient so that no liquid phase of the alloy is present within the first material in a temperature range between room temperature and a deposition or pre-deposition temperature higher than room temperature, wherein the group IIIA-based material is otherwise liquid in that temperature range. The other material may be a group IA material. A precursor material may be formulated comprising a) particles of the first material and b) particles containing at least one element from the group consisting of: group IB, IIIA, VIA element, alloys containing any of the foregoing elements, or combinations thereof. The temperature range described above may be between about 20° C. and about 200° C. It should be understood that the alloy may have a higher melting temperature than a melting temperature of the IIIA-based material in elemental form.
    • 提供了用于从基于固体IIIA的颗粒形成薄膜的方法和装置。 在本发明的一个实施方案中,描述了一种方法,其包括提供包含a)基于IIIA族的材料和b)至少一种其它材料的合金的第一材料。 可以以足够的量包含材料,使得在室温和高于室温的沉积或预沉积温度之间的温度范围内,第一材料中不存在液相,其中基于IIIA族的材料 在该温度范围内为液体。 另一种材料可以是IA族材料。 可以配制前体材料,其包括:a)第一材料的颗粒,和b)含有至少一种元素的颗粒,所述元素包括:IB,IIIA族,VIA族元素,含有任何上述元素的合金,或其组合。 上述温度范围可以在约20℃至约200℃之间。应当理解,该合金可以具有比基于IIIA的材料以元素形式的熔融温度更高的熔融温度。