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31. 发明授权

US07492596B1 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07492596B1
公开(公告)日：2009-02-17
申请号：US11836712
申请日：2007-08-09
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/427 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat dissipation unit attached to a top surface of the electronic component of an add-on card and defining a channel therein, a heat pipe, and a second heat dissipation unit. The second heat dissipation unit includes a first portion located at a lateral side of the add-on card, a second portion extending from the first portion to a bottom side of the add-on card, and a joint portion formed between the first portion and the second portion and located at the lateral side of the add-on card. The heat pipe includes an evaporating portion received in the channel of the first heat dissipation unit, and a condensing portion extended through the second heat dissipation unit at the joint portion.
摘要翻译：散热装置包括附接到附加卡的电子部件的上表面并且在其中限定通道的第一散热单元，热管和第二散热单元。第二散热单元包括位于附加卡的侧面的第一部分，从附加卡的第一部分延伸到底侧的第二部分，以及形成在第一部分和第二部分之间的接合部分第二部分并位于附加卡的侧面。热管包括容纳在第一散热单元的通道中的蒸发部分和在接合部分处延伸穿过第二散热单元的冷凝部分。

32. 发明授权

US07369412B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07369412B2
公开(公告)日：2008-05-06
申请号：US11308775
申请日：2006-05-02
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-dissipating members. The heat-absorbing member is bound to the heat generating electronic components for absorbing heat generated by the electronic components. The heat-dissipating members are disposed within the computer case and located at one peripheral side edge of the graphics card. The heat-absorbing member and the heat-dissipating members are connected by the heat pipes so as to transfer the heat received by the heat-absorbing member to the heat-dissipating members for further dissipating.
摘要翻译：用于散热装置的散热装置包括：吸热构件，一对热管和一对热交换器，所述散热装置用于从安装在接口卡上的发热电子部件散热，消散部件。吸热构件与用于吸收电子部件产生的热量的发热电子部件结合。散热构件设置在计算机外壳内并且位于显卡的一个周边侧边缘处。吸热构件和散热构件通过热管连接，以将由吸热构件接收的热量传递到散热构件以进一步消散。

33. 发明申请

US20080080143A1 VIDEO GRAPHICS ARRAY (VGA) CARD ASSEMBLY 失效
标题翻译：视频图形阵列（VGA）卡组件
公开(公告)号：US20080080143A1
公开(公告)日：2008-04-03
申请号：US11309818
申请日：2006-10-03
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A VGA card assembly includes a VGA card (90) having a heat-generating electronic component (94) mounted thereon and a heat dissipating device thermally connecting with the electronic component. The assembly includes a flow director (50) defining a receiving room (57) therein. A thermal module (10) is received in the receiving room. A bottom of the thermal module contacts with the heat-generating electronic component. A cover (80) is movably mounted on the flow director to cover the thermal module in the flow director. The cover is capable of rotating or sliding relative to the flow director to facilitate open or close of the receiving room. When the receiving room is opened, the thermal module is exposed.
摘要翻译： VGA卡组件包括具有安装在其上的发热电子部件（94）的VGA卡（90）和与电子部件热连接的散热装置。组件包括在其中限定接收室（57）的导流器（50）。一个热模块（10）被接收在接收室中。热模块的底部与发热电子部件接触。盖（80）可移动地安装在导流器上以覆盖导流器中的热模块。盖子能够相对于导流器旋转或滑动以便于接收室的打开或关闭。当接收室打开时，散热模块被暴露。

34. 发明申请

US20070211432A1 HEAT DISSIPATING DEVICE FOR COMPUTER ADD-ON CARDS 失效
标题翻译：用于计算机附加卡的散热装置
公开(公告)号：US20070211432A1
公开(公告)日：2007-09-13
申请号：US11308134
申请日：2006-03-08
申请人： Xue-Wen Peng , Rui-Hua Chen , Jun-Hai Li
发明人： Xue-Wen Peng , Rui-Hua Chen , Jun-Hai Li
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecting the cover and the base. The base defines a slot (222) above the GPU. A fan (28) is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.
摘要翻译：安装在VGA卡（10）上的散热装置包括与安装在VGA卡上的GPU（12）接触的基座（22），安装在基座上的盖（21）和多个翅片（24）在盖和基座之间进行热连接。基座定义GPU上方的槽（222）。风扇（28）位于基座上用于驱动气流，其中气流的一部分流过翅片，另一部分气流流过狭槽并吹过靠近GPU的其它电子部件。因此，气流的反弹降低，散热装置具有更好的散热效率。

35. 发明申请

US20070171611A1 VIDEO GRAPHICS ARRAY (VGA) CARD ASSEMBLY 有权
标题翻译：视频图形阵列（VGA）卡组件
公开(公告)号：US20070171611A1
公开(公告)日：2007-07-26
申请号：US11307109
申请日：2006-01-24
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A VGA card assembly comprises a VGA card (10) having a socket (13) thereon. A GPU (11) is attached on the socket. A base plate (22) is located on the VGA card and contacts with the GPU, for dissipating heat generated by the GPU. A back plate (30) is located below the VGA card, for supporting the VGA card. The back plate has studs extend upwardly through the VGA card. Fasteners extend downwardly through the socket to threadedly engage with the studs. Screws extend downwardly through the base plate to threadedly engage with the fasteners. A heat dissipation device including a fan, a heat pipe, fins and a lid is removably mounted on the base plate.
摘要翻译： VGA卡组件包括其上具有插座（13）的VGA卡（10）。 GPU（11）连接在插座上。基板（22）位于VGA卡上并与GPU接触，以消散由GPU产生的热量。背板（30）位于VGA卡下方，用于支持VGA卡。后板有螺柱向上延伸穿过VGA卡。紧固件通过插座向下延伸以与螺柱螺纹接合。螺钉向下延伸穿过底板以与紧固件螺纹接合。包括风扇，热管，翅片和盖的散热装置可拆卸地安装在基板上。

36. 发明申请

US20070147006A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20070147006A1
公开(公告)日：2007-06-28
申请号：US11306411
申请日：2005-12-27
申请人： Xue-Wen Peng
发明人： Xue-Wen Peng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28D15/0275 , F28F1/32 , F28F3/02 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat spreader (100), a fin assembly (300) located above the heat spreader and a heat pipe (400). The heat spreader has a bottom (110) for contacting a heat-generating component (500) and an upper surface (120) with a groove (122) defined therein. The fin assembly includes a plurality of horizontal fins stacked on each other. The heat pipe includes a first section (410) accommodated in the groove of the heat spreader, a pair of first legs (422) extending from opposite ends of the first section, respectively, and away from the heat spreader, and a second leg (424) bent from each of the first legs towards the heat spreader. The first and second legs pass through the horizontal fins and are fixed to and thermally connected with the horizontal fins.
摘要翻译：散热装置包括散热器（100），位于散热器上方的散热片组件（300）和热管（400）。散热器具有用于使发热部件（500）和上表面（120）与限定在其中的凹槽（122）接触的底部（110）。翅片组件包括彼此堆叠的多个水平翅片。热管包括容纳在散热器的凹槽中的第一部分（410），分别从第一部分的相对端延伸并远离散热器的一对第一腿部（422）和第二腿部（422） 424）从每个第一腿朝向散热器弯曲。第一和第二支腿穿过水平翅片并固定并与水平翅片热连接。

37. 发明授权

US07019974B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07019974B2
公开(公告)日：2006-03-28
申请号：US10892846
申请日：2004-07-16
申请人： Hsieh-Kun Lee , Xue-Wen Peng , Rui-Hua Chen
发明人： Hsieh-Kun Lee , Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50′) thermally connected to the first heat sink, a second heat pipe (60, 60′) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80′) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.
摘要翻译：散热装置包括安装在视频图形适配器（VGA）卡（70）的一侧上的第一散热器（10），其上安装有发热元件（74）以散发由发热元件产生的热量，安装在所述卡的相对侧上的第二散热器（30），与所述第一散热器热连接的第一热管（50,50'），与所述第一热管分离的第二热管（60,60'），连接到第二散热器，以及连接在第一和第二热管之间的连接构件（80,80'），用于将热量从第一热管传递到第二热管。

38. 发明申请

US20050045311A1 Heat dissipating device incorporating clip 失效
标题翻译：散热装置结合夹子
公开(公告)号：US20050045311A1
公开(公告)日：2005-03-03
申请号：US10900553
申请日：2004-07-27
申请人： Chun-Chi Chen , Xue-Wen Peng , Hsieh Lee , Cheng-Tien Lai , Zhi-Yong Zhou
发明人： Chun-Chi Chen , Xue-Wen Peng , Hsieh Lee , Cheng-Tien Lai , Zhi-Yong Zhou
IPC分类号： H05K7/20 , H01L23/40 , H01L23/467 , F28D15/00
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.
摘要翻译：散热装置包括散热器（50）和用于将散热器安装到围绕电子部件（65）的保持模块（60）的两个夹子（10）。散热器提供两个肩部（72）。每个夹子包括支撑在一个肩部上的带子（21），具有枢转地连接到带子上的凸轮的杠杆（40），可枢转地连接到带子的相对端部的两个腿部（30），以及两个弹簧指从带的相对端延伸。在组装中，带子被向下按压，并且保持模块推动腿部以便将脚从原始状态转移到强制状态。当腿部到达保持模块的开口时，手指推动腿进入开口。然后，杠杆枢转以推动带子向上移动，从而使腿部牢固地接合在开口中。

39. 发明授权

US07782617B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07782617B2
公开(公告)日：2010-08-24
申请号：US12423817
申请日：2009-04-15
申请人： Jun-Hai Li , Xue-Wen Peng
发明人： Jun-Hai Li , Xue-Wen Peng
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D15/0233 , F28D15/0266
摘要： A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink.
摘要翻译：用于消散附加卡产生的热量的散热装置。散热装置包括两个散热器和两个连接两个散热片的热管。每个散热器包括安装在基座顶表面上的底座和翅片组。每个热管包括连接部分和从连接部分的相对端延伸的两个导热部分。每个热管的两个导热部分之一被夹在基座和一个散热器的翅片组之间，另外两个导热部分夹在基座和另一个散热片的翅片组之间。

40. 发明授权

US07640968B2 Heat dissipation device with a heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US07640968B2
公开(公告)日：2010-01-05
申请号：US11695434
申请日：2007-04-02
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base (10), a heat radiator (40) mounted on the base (10), and two heat pipes (20) connecting the base (10) and the heat radiator (40). The base (10) has a bottom face adapted for contacting with a heat-generating electronic component. The heat pipes (20) each comprise an evaporating portion (22) embedded in the base (10) and a condensing portion (24) extending from an end of the evaporating portion (22). The heat radiator (40) comprises first and second fin assemblies (42, 44) each having two contacting faces (43, 45), the condensing portions (24) of the heat pipes (20) are sandwiched between the contacting faces (43, 45) by the first and second fin assemblies (42, 44), and an opening is enclosed by the first and second fin assemblies (42, 44) and receives an electric fan (50) therein.
摘要翻译：散热装置包括基座（10），安装在基座（10）上的散热器（40）和连接基座（10）和散热器（40）的两根热管（20）。基座（10）具有适于与发热电子部件接触的底面。热管（20）各自包括嵌入在基座（10）中的蒸发部分（22）和从蒸发部分（22）的端部延伸的冷凝部分（24）。散热器（40）包括分别具有两个接触面（43,45）的第一和第二翅片组件（42,44），热管（20）的冷凝部分（24）夹在接触面并且第一和第二翅片组件（42,44）封闭开口，并且在其中容纳电风扇（50）。

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