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    • 38. 发明授权
    • Measuring characteristics of ultra-shallow junctions
    • 超浅结点的测量特性
    • US08120776B1
    • 2012-02-21
    • US12545015
    • 2009-08-20
    • Alex SalnikLena Nicolaides
    • Alex SalnikLena Nicolaides
    • G01N21/55
    • G01N21/1717G01N2021/1725
    • Carrier activation and end-of-range defect density of ultra-shallow junctions in integrated circuits are determined using modulated optical reflectance signals, DC reflectances of pump or probe laser beams, and in-phase and quadrature signal processing. A method for determining characteristics of an ultra-shallow junction includes periodically exciting a region of the substrate using a pump laser beam, and reflecting a probe laser beam from the excited region. A modulated optical reflectance signal is measured along with DC reflectance of the probe laser beam. The modulated optical reflectance signal and DC reflectance are compared with reference signals generated from calibration substrates to determine carrier activation and end-of-range defect density in the junction.
    • 使用调制的光反射信号,泵浦或探针激光束的直流反射以及同相和正交信号处理来确定集成电路中超浅结的载流子激活和终端缺陷密度。 用于确定超浅结的特性的方法包括使用泵浦激光束周期性地激励基板的区域,并且反射来自激发区域的探测激光束。 测量调制的光反射信号与探测激光束的直流反射率一起测量。 将调制的光反射信号和DC反射率与从校准基板产生的参考信号进行比较,以确定接合处的载流子激活和端部范围缺陷密度。