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    • 32. 发明授权
    • Piezoelectric resonance component
    • 压电谐振分量
    • US5621263A
    • 1997-04-15
    • US285233
    • 1994-08-03
    • Hiroaki Kaida
    • Hiroaki Kaida
    • H03H9/05H01L41/08
    • H03H9/1035H03H9/0595
    • A piezoelectric resonance component includes spacer plates located on both side surfaces of a piezo-resonator so as to form through clearances for allowing vibration of a vibrating part. Case substrates are located on both major surfaces of the piezo-resonator and the spacer plates through spacer frame members for defining clearances for allowing vibration of the vibrating part of the piezo-resonator. Dynamic dampers are located between the vibrating part of the piezo-resonator and ends of a piezoelectric substrate for suppressing vibration received from the vibrating part and for preventing vibration from being transmitted to a holding part.
    • 压电共振部件包括位于压电谐振器的两个侧表面上的间隔板,以形成通过间隙以允许振动部件的振动。 壳体基板位于压电谐振器的两个主表面上,隔离板通过间隔框架构件限定间隙,以允许压电谐振器的振动部分振动。 动压阻尼器位于压电谐振器的振动部分和压电基片的端部之间,用于抑制从振动部分接收的振动并防止振动传递到保持部分。
    • 35. 发明授权
    • Piezoelectric tuning fork resonator and method of manufacturing the same
    • 压电音叉谐振器及其制造方法
    • US5302880A
    • 1994-04-12
    • US64944
    • 1993-05-20
    • Hiroaki Kaida
    • Hiroaki Kaida
    • H03H9/21H01L41/08
    • H03H9/21Y10T29/42
    • A piezoelectric tuning fork resonator having a piezoelectric substrate provided with a stepped portion on its end and a tuning fork arm portion formed in the stepped portion. A dummy substrate is arranged adjacent to a side of the piezoelectric substrate and a pair of sealing substrates are pasted onto upper and lower portions of the piezoelectric substrate and the dummy substrate to form a chip type piezoelectric tuning fork resonator. In another embodiment piezoelectric substrate includes a resin sealing portion having a hollow portion defined around the tuning fork arm portion so as to form a resin-coated piezoelectric tuning fork resonator.
    • 一种压电音叉谐振器,具有在其端部设置有阶梯部的压电基板和形成在台阶部的音叉臂部。 虚设基板与压电基板的一侧相邻配置,并且一对密封基板被粘贴在压电基板和虚设基板的上部和下部,以形成芯片型压电音叉谐振器。 在另一实施例中,压电基片包括树脂密封部分,该树脂密封部分具有围绕音叉臂部分限定的中空部分,以形成树脂涂覆的压电音叉谐振器。