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31. 发明授权

US08167094B2 Elevator apparatus 失效
标题翻译：电梯设备
公开(公告)号：US08167094B2
公开(公告)日：2012-05-01
申请号：US12532414
申请日：2007-04-26
申请人： Takaharu Ueda , Takehiko Kubota , Akihiro Chida , Satoru Takahashi , Rikio Kondo
发明人： Takaharu Ueda , Takehiko Kubota , Akihiro Chida , Satoru Takahashi , Rikio Kondo
IPC分类号： B66B1/32
CPC分类号： B66B1/32 , B66B5/0031
摘要： Provided is an elevator apparatus including a first electromagnetic switch and a second electromagnetic switch provided between a first electromagnetic coil and a second electromagnetic coil of a first brake device and a second brake device and a power source. The brake control section includes: a first electromagnetic coil control switch provided between the first electromagnetic coil and a ground section; a second electromagnetic coil control switch provided between the second electromagnetic coil and the ground section; a first processing section for opening and closing the first electromagnetic switch and the first electromagnetic coil control switch in response to a braking operation command issued from an operation control section; and a second processing section for opening and closing the second electromagnetic switch and the second electromagnetic coil control switch in response to the braking operation command.
摘要翻译：本发明提供一种电梯装置，包括设置在第一制动装置的第一电磁线圈和第二电磁线圈之间的第一电磁开关和第二电磁开关，以及第二制动装置和电源。制动控制部包括：设置在第一电磁线圈与接地部之间的第一电磁线圈控制开关; 设置在第二电磁线圈和接地部之间的第二电磁线圈控制开关; 第一处理部分，用于响应于从操作控制部分发出的制动操作命令来打开和关闭第一电磁开关和第一电磁线圈控制开关; 以及第二处理部，其响应于制动操作命令来打开和关闭第二电磁开关和第二电磁线圈控制开关。

32. 发明申请

US20120097982A1 Lighting Device 有权
标题翻译：照明装置
公开(公告)号：US20120097982A1
公开(公告)日：2012-04-26
申请号：US13275522
申请日：2011-10-18
申请人： Kenichi Wakimoto , Akihiro Chida , Kohei Yokohama
发明人： Kenichi Wakimoto , Akihiro Chida , Kohei Yokohama
IPC分类号： H01L33/62 , H01L33/58
CPC分类号： H01L33/20 , H01L33/36 , H01L33/62 , H01L51/5203 , H01L51/5212 , H01L51/5237 , H01L51/524 , H01L51/5243 , H01L51/5246 , H01L51/5253 , H01L51/5259 , H01L51/5275 , H01L2251/5361
摘要： A lighting device including an electroluminescent (EL) material is connected to an external power supply easily and the convenience is improved. In a lighting device having a light-emitting element including an electroluminescence (EL) layer, a housing including a light-emitting element has a terminal electrode electrically connected to the light-emitting element on a peripheral end portion. The terminal electrode provided on the housing so as to be exposed to the outside is in contact with a terminal electrode for the external power supply, so that the external power supply and the light-emitting element are electrically connected to each other and power can be supplied to the lighting device.
摘要翻译：包括电致发光（EL）材料的照明装置容易地连接到外部电源，并且便利性得到改善。在具有包含电致发光（EL）层的发光元件的照明装置中，包括发光元件的壳体具有在外周端部与发光元件电连接的端子电极。设置在壳体上以暴露于外部的端子电极与用于外部电源的端子电极接触，使得外部电源和发光元件彼此电连接，并且电力可以是提供给照明装置。

33. 发明授权

US07883939B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07883939B2
公开(公告)日：2011-02-08
申请号：US12613552
申请日：2009-11-06
申请人： Akihiro Chida
发明人： Akihiro Chida
IPC分类号： H01L21/60
CPC分类号： H01L21/6835 , H01L21/76802 , H01L21/76898 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/83 , H01L25/0657 , H01L2221/68372 , H01L2224/0401 , H01L2224/0554 , H01L2224/1147 , H01L2224/13009 , H01L2224/13099 , H01L2224/1601 , H01L2224/16147 , H01L2224/16237 , H01L2224/29076 , H01L2224/29499 , H01L2224/81191 , H01L2224/83851 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/0101 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/05042 , H01L2924/10253 , H01L2924/10329 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/00
摘要： A method for manufacturing a thin but robust stack of electrically connected thin film semiconductor elements includes the steps of forming a first element to be stacked: forming a separation layer and a semiconductor element layer over a substrate, forming a wiring connected to the semiconductor element layer, forming a protective material over the semiconductor layer and the wiring, forming a conductive region electrically connected to the wiring in the protective layer, and separating the semiconductor element layer from the substrate along the separation layer. A second element is formed according to the aforementioned process, and the first element is stacked thereon, before separating the second element from its substrate. The first element is bonded to the protective layer of the second element so that the semiconductor element layers of the first and the second element are electrically connected to each other through the protective layer, without damaging the protective layer.
摘要翻译：一种制造薄而坚固的电连接薄膜半导体元件堆叠的方法包括以下步骤：形成要堆叠的第一元件：在衬底上形成分离层和半导体元件层，形成连接到半导体元件层在所述半导体层和所述布线之上形成保护材料，形成与所述保护层中的布线电连接的导电区域，以及沿着所述分离层将所述半导体元件层与所述基板分离。根据上述方法形成第二元件，并且在将第二元件与基板分离之前，将第一元件堆叠在其上。第一元件被结合到第二元件的保护层，使得第一和第二元件的半导体元件层通过保护层彼此电连接，而不损坏保护层。

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