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31. 发明授权

KR100800214B1 반도체 조립용 접착 필름 조성물 및 접착 필름 有权
标题翻译：用于半导体组件的粘合膜组合物及其粘合膜
公开(公告)号：KR100800214B1
公开(公告)日：2008-02-01
申请号：KR1020060127293
申请日：2006-12-13
申请人： 제일모직주식회사
发明人： 정기성 , 김완중 , 홍용우 , 정창범 , 정철 , 편아람 , 임수미 , 하경진
IPC分类号： C09J123/00 , C09J163/00 , C09J7/02
CPC分类号： H01L21/6836 , C08K3/013 , C08K5/34922 , C08K5/50 , C08K5/5435 , C08K5/548 , C08K5/55 , C08L61/04 , C08L63/00 , C09D167/02 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8388 , H01L2224/83885 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01067 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31786 , C08L2666/14 , H01L2924/00 , H01L2924/01083 , C09J167/02 , C09J7/00 , C09J163/00 , C09J2203/326
摘要： An adhesive film composition for the assembly of semiconductor, an adhesive film formed form the composition, and an adhesive containing the film are provided to improve adhesive strength to a wafer and to minimize the generation of bubble during attaching process. An adhesive film composition comprises a polyester-based adhesion improving resin; an elastomer resin containing a hydroxyl group, a carboxyl group or an epoxy group; an epoxy group; a phenolic epoxy resin curing agent; at least one material selected from the group consisting of a latent catalytic curing agent and a curing catalyst; a silane coupling agent; and a filler. Preferably the polyester-based adhesion improving resin has a softening point of 0-200 deg.C and a weight average molecular weight of 200-1,000,000; and the elastomer has a weight average molecular weight of 500-5,000,000.
摘要翻译：提供用于组装半导体的粘合剂膜组合物，由组合物形成的粘合剂膜和包含该膜的粘合剂，以提高对晶片的粘合强度并且在附着过程中最小化气泡的产生。粘合膜组合物包含聚酯类粘合改善树脂; 含有羟基，羧基或环氧基的弹性体树脂; 环氧基; 酚醛环氧树脂固化剂; 选自由潜催化固化剂和固化催化剂组成的组中的至少一种材料; 硅烷偶联剂; 和填料。优选地，聚酯类粘合改进树脂的软化点为0-200℃，重均分子量为200-1,000,000; 弹性体的重均分子量为500〜500,000。

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