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    • 31. 发明公开
    • 수직 단면 발광 레이저 및 그 제조 방법
    • 垂直孔表面发射激光及其制作方法
    • KR1020080024910A
    • 2008-03-19
    • KR1020060089663
    • 2006-09-15
    • 삼성전자주식회사
    • 김영현김인이도영
    • H01S5/10G02B17/02G02B17/08
    • H01S5/18375H01S5/026H01S5/18311H01S5/18377H01S5/18388H01S2301/166
    • A vertical cavity surface emitting laser and a manufacturing method thereof are provided to generate a laser beam at a desired mode by using a reflective lens having a curvature which becomes smaller from a center to an edge of the lens. A vertical cavity surface emitting laser includes a reflective laser(260) and an upper electrode(202). The reflective laser is formed at a center of a contact layer. The upper electrode is apart from the reflective laser by a predetermined distance and encloses an edge of the reflective laser. The vertical cavity surface emitting laser includes a lower reflective mirror(220), an upper reflective mirror(240), and an oscillation region(230). The lower reflective mirror is formed on a substrate. The upper reflective mirror is formed on the lower reflective mirror. The oscillation region is formed between the upper and lower reflective mirrors, generates the laser beam, and outputs the laser beam toward the upper reflective mirror.
    • 提供垂直腔面发射激光器及其制造方法,以通过使用具有从透镜的中心到边缘变小的曲率的反射透镜在期望的模式下产生激光束。 垂直腔表面发射激光器包括反射激光器(260)和上电极(202)。 反射激光器形成在接触层的中心。 上电极与反射激光器隔开预定的距离并且包围反射激光器的边缘。 垂直腔表面发射激光器包括下反射镜(220),上反射镜(240)和振荡区(230)。 下反射镜形成在基板上。 上反射镜形成在下反射镜上。 振荡区域形成在上反射镜和下反射镜之间,产生激光束,并向上反射镜输出激光束。
    • 37. 发明公开
    • 무선 통신 시스템에서 패킷 재전송을 요청하는 장치 및방법
    • 使用无线电通信系统中ARQ和HARQ方案的分组重新请求的装置和方法
    • KR1020080080962A
    • 2008-09-05
    • KR1020080019822
    • 2008-03-03
    • 삼성전자주식회사
    • 이도영김성훈김혜정
    • H04L1/18H04L1/16H04L29/06
    • H04L1/1822H04L1/1812H04L1/1848
    • An apparatus and a method for re-transmission request of a packet using ARQ(Automatic Retransmission Request) and HARQ(Hybrid Automatic Retransmission Request) scheme in a radio communication system are provided to improve speed of high speed packet service by preventing transmission delay due to the re-transmission request. A method for re-transmission request includes the steps of: detecting whether a missing packet exists by checking serial numbers of received packets and driving a timer 1 related to the missing packet(700,702); stopping driving of the timer 1 by receiving an HARQ receiving failure indicator corresponding to the missing packet from a receiving HARQ layer(706); and stopping generation of a state report message corresponding to the missing packet and standing by receiving of an ARQ packet re-transmitted from a transmission ARQ layer corresponding to the missing packet.
    • 提供了一种在无线电通信系统中使用ARQ(自动重发请求)和HARQ(混合自动重传请求)方案的分组的重传请求的装置和方法,以通过防止由于 重传请求。 一种重传请求的方法包括以下步骤:通过检查接收到的分组的序列号和驱动与丢失的分组相关的定时器1来检测是否存在丢失分组(700,702); 通过从接收HARQ层(706)接收对应于丢失分组的HARQ接收失败指示来停止定时器1的驱动; 并且停止生成与丢失的分组相对应的状态报告消息,并且通过接收从与丢失分组相对应的传输ARQ层重新发送的ARQ分组来站立。
    • 38. 发明公开
    • 플립칩 본딩 소자 및 그 제조방법
    • 卷芯片粘合装置及其制造方法
    • KR1020080069015A
    • 2008-07-25
    • KR1020070006586
    • 2007-01-22
    • 삼성전자주식회사
    • 이도영이은화
    • H01L21/30
    • H01L21/563H01L23/522H01L24/28
    • A flip chip bonding device and a method for manufacturing the same are provided to embody a metal/insulation layer interface or a metal/semiconductor interface by removing only polyimide under a metal contact of a p-contact and an n-contact. A flip chip bonding device includes a semiconductor substrate(101), a flip chip boding pad(116), a planarizing polyimide, an insulation layer(110), and a metal contact. The flip chip bonding pad is formed on the semiconductor substrate, and other devices are optically coupled with the flip chip boding pad. The insulation layer is formed on the semiconductor substrate. The metal contact is formed on the insulation layer. The flip chip bonding pad is formed on the metal contact. The semiconductor substrate is a semi-insulating substrate. The flip chip bonding device is a vertical resonance surface release laser device.
    • 提供了一种倒装芯片接合装置及其制造方法,以通过在p-接触和n-接触的金属接触下仅去除聚酰亚胺来体现金属/绝缘层界面或金属/半导体界面。 倒装芯片接合装置包括半导体衬底(101),倒装芯片焊盘(116),平坦化聚酰亚胺,绝缘层(110)和金属接触。 倒装芯片接合焊盘形成在半导体衬底上,其它器件与倒装芯片焊盘进行光耦合。 绝缘层形成在半导体衬底上。 在绝缘层上形成金属接触。 在金属触头上形成倒装焊盘。 半导体衬底是半绝缘衬底。 倒装芯片接合装置是垂直共振表面释放激光装置。
    • 39. 发明公开
    • 코드 분할 다중 접속 시스템에서 역방향 부가 채널 요청 방법 및 장치
    • 用于在代码分类多路访问系统中传输数据的装置和方法
    • KR1020080036898A
    • 2008-04-29
    • KR1020060103720
    • 2006-10-24
    • 삼성전자주식회사
    • 이도영이현구
    • H04B7/26H04B1/69
    • H04B7/2628H04W72/14
    • An apparatus and a method for transmitting data in a CDMA(Code Division Multiple Access) system are provided to transmit the data dynamically, according to the amount of the data. A terminal of a CDMA system uses an R-SCH(Reverse-Supplemental channel). The terminal comprises a data management unit(713) and an SCRM(Supplemental Channel Request Message) management unit(711). The data management unit stores data, which are to be transmitted to a base station, and calculates the amount of the data. The SCRM management unit calculates a transmission period based on the amount of the data, considering an RTT(Round Trip Time) in consideration of a round tip delay time and a start time. The SCRM management unit transmits an SCRM including the calculated transmission period to the base station.
    • 提供了一种在CDMA(码分多址)系统中发送数据的装置和方法,用于根据数据量动态地发送数据。 CDMA系统的终端使用R-SCH(反向补充信道)。 该终端包括数据管理单元(713)和SCRM(补充信道请求消息)管理单元(711)。 数据管理单元存储要发送到基站的数据,并计算数据量。 考虑到圆头延迟时间和开始时间考虑RTT(往返时间),SCRM管理单元基于数据量来计算传输周期。 SCRM管理单元将包括计算出的发送周期的SCRM发送到基站。