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31. 发明专利

JP2010012784A Plastic article and method for making the same 审中-公开
标题翻译：塑料制品及其制造方法
公开(公告)号：JP2010012784A
公开(公告)日：2010-01-21
申请号：JP2009155861
申请日：2009-06-30
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： KYO TETSUGEN , SU CHENG-WEN , HUANG GANG , WANG YAN-MIN , O TSUTOMU
IPC分类号： B32B3/24 , B29C45/14
CPC分类号： B44C5/0453 , B44C3/10 , Y10T428/24851 , Y10T428/24884
摘要： PROBLEM TO BE SOLVED: To provide a plastic article wherein combinations of pattern colors and background colors are rich, and a boundary of the pattern and the background is clear, and to provide a method for making the same. SOLUTION: The plastic article having a pattern on the surface includes a thin film formed with a plurality of through-holes, a substrate which is laminated on one side of the thin film and fills in the plurality of through-holes, and a background layer positioned between the thin film and the substrate. Since a color of the substrate is different from that of the background layer, a pattern is formed on a surface of the substrate. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种塑料制品，其中图案颜色和背景颜色的组合丰富，并且图案和背景的边界是清楚的，并且提供一种制造它的方法。解决方案：具有在表面上具有图案的塑料制品包括形成有多个通孔的薄膜，层压在薄膜的一侧并填充多个通孔的基板，以及位于薄膜和基底之间的背景层。由于基板的颜色与背景层的颜色不同，因此在基板的表面上形成图案。版权所有（C）2010，JPO＆INPIT

32. 发明专利

JP2009220569A Injection mold and method for making housing using the injection mold 审中-公开
标题翻译：注射模具和使用注射模具制造住房的方法
公开(公告)号：JP2009220569A
公开(公告)日：2009-10-01
申请号：JP2009053839
申请日：2009-03-06
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： WU KUN-TSAN , TIEN LI-WEN , HONG CHUAN-BAO
IPC分类号： B29C45/26 , B29C33/18 , B29C45/14 , B29L9/00 , B29L12/00
CPC分类号： B29C45/14221 , B29C2045/14188
摘要： PROBLEM TO BE SOLVED: To provide an injection mold in which a working process is easy and the manufacturing cost of a housing is low, and to provide a method for making a housing by the injection mold.
SOLUTION: The injection mold comprises a female mold and a male mold matching with the female mold, wherein a cutting portion is positioned on either the female mold or the male mold positioning, and a receiving slot is defined in the another mold for accommodating the cutting portion.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种注塑模具，其中工作过程容易并且壳体的制造成本低，并且提供通过注射模具制造壳体的方法。解决方案：注射模具包括阴模和与阴模匹配的阳模，其中切割部分位于阴模或阳模定位上，并且在另一模具中限定接收槽容纳切割部分。版权所有（C）2010，JPO＆INPIT

33. 发明专利

JP2009216247A Hinge structure and portable electronic device using this hinge structure 有权
标题翻译：使用此铰链结构的铰链结构和便携式电子设备
公开(公告)号：JP2009216247A
公开(公告)日：2009-09-24
申请号：JP2009055327
申请日：2009-03-09
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： DUAN CHAO , CHEN CHIA-HUA
IPC分类号： F16C11/10 , F16C11/04 , H04M1/02
CPC分类号： H04M1/0216 , G06F1/1616 , G06F1/1681 , Y10T16/538 , Y10T16/5387 , Y10T16/540255
摘要： PROBLEM TO BE SOLVED: To provide a hinge structure which is easily processed and attached, and a portable electronic device using the hinge structure. SOLUTION: The hinge structure 100 includes a sleeve 20, main axis 10 fitted inside the sleeve 20, follower 30 one end of which is provided with cam surface 322 and which is fitted to slide on the main axis 10 and held inside the sleeve, and spring 40. One piece molding of the engaging part with cam surface 322 is carried out inside the sleeve 20, follower cam surface carries out connection to sleeve the engaging part with the spring 40. In the portable electronic device equipped with body and lid body, hinge structure is provided with sleeve 20 which is loaded on one side of the body and lid body, main axis 10 which is inserted into the sleeve 20 and fitted to the other side of the body and lid body, the follower 30 one end of which is cam surface 322 which is loaded on main axis 10 to slide by the cam surface 322, and is held inside the sleeve 20, spring 40. With resiliency of the spring 40, cam surface 322 of follower 30 carries out connection to engaging part by which one piece profiling has been carried out inside the sleeve 20. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供易于加工和附接的铰链结构以及使用铰链结构的便携式电子设备。解决方案：铰链结构100包括套筒20，主轴10装配在套筒20的内部，从动件30的一端设有凸轮表面322，并被装配成在主轴线10上滑动并保持在套筒和弹簧40.在套筒20内部进行具有凸轮表面322的接合部件的一个模制件，从动凸轮表面执行与弹簧40套住接合部件的连接。在装备有本体和盖体，铰链结构设置有套筒20，其装载在主体和盖体的一侧上，主轴线10插入到套筒20中并装配到主体和盖体的另一侧，从动件30一体其端部是凸轮表面322，其被装载在主轴线10上以由凸轮表面322滑动，并被保持在套筒20内弹簧40内。随着弹簧40的弹性，跟随器30的凸轮表面322执行连接参与其中一件p 袖子已经在袖子20内进行了滚动。版权所有（C）2009，JPO＆INPIT

34. 发明专利

JP2009182962A Housing, method of manufacturing housing, and electronic apparatus using the same 审中-公开
标题翻译：住房，制造住房的方法和使用该住房的电子设备
公开(公告)号：JP2009182962A
公开(公告)日：2009-08-13
申请号：JP2009008213
申请日：2009-01-16
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： YANG FU-KENG , CHO HEI , ZENG YI-PING , ZHAN JIAN-JUN
IPC分类号： H01Q1/38 , H01Q1/24 , H01Q1/42 , H05K1/16 , H05K3/00 , H05K3/12 , H05K3/28
CPC分类号： H01Q1/243 , H01Q1/40
摘要： PROBLEM TO BE SOLVED: To provide a housing which has a simple structure, a small volume and an antenna installed inside, and to provide a method of manufacturing the housing and an electronic device using the same.
SOLUTION: The housing includes a thin film layer, a substrate layer, and an antenna. The substrate layer is connected with the film layer by injection molding. The antenna is a conductive ink coating formed on the film layer. The film layer includes a first surface and a second surface opposite each other. On the second surface, an antenna connecting part is formed, and the antenna is formed at the antenna connecting part.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种外壳结构简单，体积小，安装在内部的天线，并提供一种制造外壳的方法和使用该外壳的电子设备。解决方案：壳体包括薄膜层，基底层和天线。衬底层通过注射成型与膜层连接。天线是形成在薄膜层上的导电油墨涂层。膜层包括彼此相对的第一表面和第二表面。在第二表面上形成天线连接部，天线形成于天线连接部。版权所有（C）2009，JPO＆INPIT

35. 发明专利

JP2009174716A Hinge structure and portable electronic device using this hinge structure 有权
标题翻译：使用此铰链结构的铰链结构和便携式电子设备
公开(公告)号：JP2009174716A
公开(公告)日：2009-08-06
申请号：JP2009008215
申请日：2009-01-16
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , 富士康(香港)有限公司 , 深▲セン▼富泰宏精密工業有限公司
发明人： DUAN CHAO , CHEN CHIA-HUA
IPC分类号： F16C11/04 , F16C11/10 , H04M1/02
CPC分类号： H04M1/0216 , Y10T16/538 , Y10T16/5387 , Y10T16/53888 , Y10T16/53988 , Y10T16/540255 , Y10T16/5535
摘要： PROBLEM TO BE SOLVED: To provide a hinge structure which is easily processible while having a long activity life, and a fold-up formula portable electronic device which adopts this hinge structure. SOLUTION: In a portable electronic device which involves a body, a lid body, and a hinge structure where the lid body is fixed to the body in a movable manner, and a shank part which is loaded on one side of the body and the lid body, a follower which is loaded on the other side of the body and the lid body, on one side of the shank part and the follower, a screw mountain part is provided which is connected with it, and cast separately. At least one pressing part is provided on the other side, screw which carries out fit to the pressing part is provided in the screw mountain part. One side of the shank and the follower, slides and revolves to the other side due to that the screw mountain part and the pressing part carry out fit mutually. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有长寿命的易加工的铰链结构，以及采用该铰链结构的折叠式便携式电子装置。解决方案：一种便携式电子设备，其包括主体，盖体和铰链结构，其中盖体以可移动的方式固定到主体，以及装在主体一侧的柄部并且盖体，在柄部和从动件的一侧上装载在主体和盖体的另一侧的从动件，设置有与其连接的螺钉山部分，并分别浇铸。在另一侧设置有至少一个按压部，在螺钉山部设置有与按压部配合的螺钉。由于螺钉山部分和按压部分相互配合，所以柄和从动件的一侧滑动并旋转到另一侧。版权所有（C）2009，JPO＆INPIT

36. 发明专利

JP2009149070A Method for making molded article 审中-公开
标题翻译：制作模制品的方法
公开(公告)号：JP2009149070A
公开(公告)日：2009-07-09
申请号：JP2008307639
申请日：2008-12-02
申请人： Sutech Trading Ltd , 富士康(香港)有限公司
发明人： WU KUN-TSAN , TIEN LI-WEN
IPC分类号： B29C45/14 , B29K23/00 , B29K25/00 , B29K27/06 , B29K55/02 , B29K67/00 , B29K69/00 , B29K71/00 , B29K81/00 , B29K105/20 , B29L9/00
CPC分类号： B29C45/14016 , B29C45/14311 , B29C2045/14803 , B29K2711/08 , B29K2713/00 , B29K2995/002
摘要： PROBLEM TO BE SOLVED: To provide a method for making a molded article by which production time is shortened and production efficiency is improved.
SOLUTION: The method for making the molded article includes: a step of providing a soft material which is supplied by a soft material supply device; a step of providing a metallic mold for injection molding including a female mold and a male mold mating with the female mold; a step of inserting the soft material between the female mold and the male mold by driving the soft material supply device; a step of forming a cavity between the female mold and the male mold by mating the molds with each other so as to hold the soft material between them; a step of injecting a molten material into the cavity to form a substrate and simultaneously to form a semi-molded article where the soft material and the substrate are integrally bonded; a step of moving the semi-molded article obtained by integrally molding the soft material and the substrate, outside the metallic mold by driving the soft material supply device after mold releasing; and a step of cutting off the soft material remaining around the semi-molded article to form the molded article which has a prescribed size and a prescribed shape, and which is obtained by integrally bonding the soft material and the substrate.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：待解决的问题：提供一种缩短生产时间并提高生产效率的模塑制品的制造方法。制造成形品的方法包括：提供由软质材料供给装置供给的软质材料的工序; 提供一种用于注射成型的金属模具的步骤，包括阴模和与阴模配合的阳模; 通过驱动软材供给装置将软材料插入阴模和阳模之间的步骤; 通过将模具彼此配合来在阴模和阳模之间形成空腔以将软材料保持在它们之间的步骤; 将熔融材料注入到空腔中以形成基材并同时形成软质材料和基材一体结合的半成品的步骤; 通过在脱模之后驱动软质材料供给装置，使在金属模具的外侧一体成型软化材料和基材而得到的半成品的移动步骤; 以及切断残留在半成型品周围的软质材料的步骤，形成规定尺寸和规定形状的成型体，并且通过将软质材料与基材一体接合而得到。版权所有（C）2009，JPO＆INPIT

37. 发明专利

JP2009067592A Chain conveyer 有权
标题翻译：链式输送机
公开(公告)号：JP2009067592A
公开(公告)日：2009-04-02
申请号：JP2008146241
申请日：2008-06-03
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , スーテック・トレーディング・リミテッド , 深▲セン▼富泰宏精密工業有限公司
发明人： ZHANG LI-HUA , ZHOU KE , FENG JUN-ZHEN , ZHANG SHENG-QUAN
IPC分类号： B65G17/32
CPC分类号： B65G17/42 , B65G17/46
摘要： PROBLEM TO BE SOLVED: To provide a chain conveyer requiring a small occupying space, stably moving, and suppressing wear.
SOLUTION: The chain conveyer composed of a plurality of coupling units 10 successively coupled by coupling pins 19, is provided. In the chain conveyer, each coupling unit 10 includes a chain 11, a coupling portion 12 successively coupling the chain, two wheels 13, a placing portion 18 fixed on the coupling portion to carry components, and a coupling pin 19.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种需要较小占用空间的链式输送机，稳定地移动并抑制磨损。解决方案：提供由连接销19连续耦合的多个联接单元10组成的链式输送机。在链式输送机中，每个联接单元10包括链条11，连续地联接链条的联接部分12，两个轮子13，固定在联接部分上以承载部件的放置部分18以及联接销19. COPYRIGHT （C）2009，JPO＆INPIT

38. 发明专利

JP2008254428A Enclosure for mobile electronic devices, and its manufacturing process 审中-公开
标题翻译：移动电子设备外壳及其制造工艺
公开(公告)号：JP2008254428A
公开(公告)日：2008-10-23
申请号：JP2008051161
申请日：2008-02-29
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , スーテック・トレーディング・リミテッド , 深▲セン▼富泰宏精密工業有限公司
发明人： KYO TETSUGEN , HANSEN KEN-HOLM
IPC分类号： B41M3/06 , B05D1/36 , B05D7/00 , B41M1/12 , B41M1/30 , H04M1/23 , H05K5/03
CPC分类号： B32B38/145 , B05D5/065 , B05D7/04 , B05D7/56 , B32B37/24 , B32B2037/243 , B32B2309/027 , B32B2309/105 , H05K5/0243 , Y10T428/26
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing process of an enclosure for a mobile electronic device in which a manufacturing process is simple, and which can bring about a 3D image on the surface of a cover. SOLUTION: The enclosure for the mobile electronic device contains a substrate including a surface, an ink layer formed on the surface of the substrate, a top coating layer formed on the surface of the substrate and the ink layer. This manufacturing process contains the step of preparing the substrate, the step of carrying out three-dimensional printing to form an ink layer on the surface of the substrate, and the step of carrying out a coating step to form an upper coating layer on the surface of the substrate and the ink layer. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于移动电子设备的外壳的制造工艺，其中制造过程简单，并且可以在盖的表面上产生3D图像。解决方案：用于移动电子设备的外壳包含基材，其包括表面，形成在基材表面上的油墨层，形成在基材表面上的顶涂层和油墨层。该制造方法包括准备基板的步骤，在基板的表面上进行三维印刷以形成油墨层的步骤，以及进行涂布步骤以在表面上形成上涂层的步骤的基底和油墨层。版权所有（C）2009，JPO＆INPIT

39. 发明专利

JP2008126657A Electronic device casing and its manufacturing method 审中-公开
标题翻译：电子装置及其制造方法
公开(公告)号：JP2008126657A
公开(公告)日：2008-06-05
申请号：JP2007269164
申请日：2007-10-16
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , Sutech Trading Ltd , スーテック・トレーディング・リミテッド , 深▲セン▼富泰宏精密工業有限公司
发明人： GAO JIN-FENG , KYO TETSUGEN , HANSEN KEN-HOLM
IPC分类号： B29C45/14 , B29K101/12 , B29L31/34 , H05K5/02
CPC分类号： B29C45/14467 , B29C45/14344 , B29L2011/0016 , B29L2031/26 , B29L2031/3431 , B29L2031/3437 , B29L2031/3475
摘要： PROBLEM TO BE SOLVED: To provide an electronic device casing manufactured in high productivity at a high ratio of qualification and capable of extending the life of the electronic device, and to provide its manufacturing method.
SOLUTION: The manufacturing method of the electronic device casing 20 includes a step of preparing a display device 24, a step of preparing an injection-molding mold containing a female mold having a molding vessel and a male mold inserted in the female mold and having the recessed vessel mounted on the attached mold core and having the same dimension and shape as a display device 24, a step of mounting the display device 24 in the recessed vessel of the male mold, a step of inserting the female mold in the female mold so that a cavity having the same dimension and shape as the resin casing 24 is made between the forming vessel and the mold core, a step of injecting a thermoplastic resin in the cavity to shape the resin casing 22 so that the display device 24 and the resin casing 22 are integrated into one body, and a step of cooling the injection-molding mold and then taking out the shaped body.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供以高生产率以高比率制造并能够延长电子设备寿命的电子设备外壳，并提供其制造方法。电子设备壳体20的制造方法包括准备显示装置24的步骤，制备包含具有成型容器的阴模和插入阴模中的阳模的注塑模具的步骤并且将凹陷容器安装在附着的模芯上并具有与显示装置24相同的尺寸和形状;将显示装置24安装在阳模的凹槽中的步骤，将阴模插入到阴模，使得在成形容器和模芯之间形成具有与树脂壳体24相同的尺寸和形状的空腔，在空腔中注入热塑性树脂以使树脂壳体22成形以使显示装置24 并且树脂壳体22被集成到一体中，并且冷却注射成型模具然后取出成形体的步骤。版权所有（C）2008，JPO＆INPIT

40. 发明专利

JP2014049757A Protective structure and electronic apparatus including the same 审中-公开
标题翻译：保护结构和电子设备，包括它们
公开(公告)号：JP2014049757A
公开(公告)日：2014-03-17
申请号：JP2013172029
申请日：2013-08-22
申请人： Shenzhen Futaihong Precision Industrial Co Ltd , 深▲セン▼富泰宏精密工業有限公司 , Sutech Trading Ltd , 富士康(香港)有限公司
发明人： NIU PENG
IPC分类号： H05K5/02
摘要： PROBLEM TO BE SOLVED: To provide a protective structure which achieves excellent dustproof performance, and to provide an electronic apparatus including the protective structure.SOLUTION: A protective structure according to this invention is used in an electronic apparatus and includes a body part and an attachment part attached to the body part. Multiple dustproof ribs are provided at the body part, and multiple dustproof grooves which are arranged parallel with each other are provided at the attachment part. Each dustproof rib is housed in the dustproof groove so as to contact with an inner surface of the dustproof groove and is formed between the attachment part and the body part.
摘要翻译：要解决的问题：提供一种具有优异防尘性能的保护结构，并提供一种包括保护结构的电子设备。解决方案：根据本发明的保护结构用于电子设备中，并且包括主体部分和附件部分附着在身体部位。主体部设有多个防尘肋，在安装部设有多个彼此平行配置的防尘槽。每个防尘肋容纳在防尘槽中，以与防尘槽的内表面接触并形成在安装部和主体部之间。

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