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    • 32. 发明授权
    • Probe apparatus
    • 探头设备
    • US07741837B2
    • 2010-06-22
    • US12120569
    • 2008-05-14
    • Tadashi ObikaneShuji Akiyama
    • Tadashi ObikaneShuji Akiyama
    • G01R31/02G01R31/00
    • G01R31/2893
    • A probe apparatus includes a load port for mounting therein a carrier having therein a plurality of substrates; a plurality of probe apparatus main bodies, each having a probe card having probes on its bottom surface; a substrate transfer mechanism for transferring the substrates between the load port and the probe apparatus main bodies, the substrate transfer mechanism being rotatable about a vertical axis and movable up and down. The substrate transfer mechanism has at least three substrates capable of moving back and forth independently. Further, at least two wafers are received from the carrier by the substrate transfer mechanism, and then are sequentially loaded into the probe apparatus main bodies. The prove apparatus a high throughput increasing a wafer transfer efficiency.
    • 探针装置包括用于在其中安装其中具有多个基板的载体的负载端口; 多个探针装置主体,各自具有在其底面上具有探针的探针卡; 用于在所述负载端口和所述探针装置主体之间传送所述衬底的衬底传送机构,所述衬底传送机构可以围绕垂直轴线旋转并可上下移动。 基板传送机构具有能够独立地来回移动的至少三个基板。 此外,通过基板传送机构从载体接收至少两个晶片,然后依次装载到探针装置主体中。 证明设备的高吞吐量提高了晶片传输效率。
    • 35. 发明申请
    • CONVEYANCE METHOD FOR TRANSPORTING OBJECTS
    • 运输对象的输送方法
    • US20070150085A1
    • 2007-06-28
    • US11550433
    • 2006-10-18
    • Shuji AkiyamaToshihiko IijimaHiroki Hosaka
    • Shuji AkiyamaToshihiko IijimaHiroki Hosaka
    • G06F19/00
    • H01L21/67276H01L21/67775H01L21/67778Y10S414/135
    • The present invention relates to conveyance method for transporting a plurality of unprocessed/processed objects between an automatic transporting device (AGV) and a semiconductor manufacturing device (prober). The prober has a load port to/from which the objects are delivered from/to the AGV. The method comprises the steps of: making a communication between the AGV and the prober to decide respective timings of deliveries of the objects to/from the load port; and transporting the objects between the AGV and the prober via the load port, with the timings of the deliveries of the objects to/from the load port shifted from each other by using a holding site for provisionally holding the object. The holding site is at least one of components of the AGV and the prober other than the load port.
    • 本发明涉及用于在自动传送装置(AGV)和半导体制造装置(探测器)之间传送多个未处理物体的传送方法。 探测器具有一个负载端口,从该对象从AGV传送对象。 该方法包括以下步骤:在AGV与探测器之间进行通信,以确定与负载端口之间传送物体的相应定时; 并且经由装载端口在AGV和探测器之间传送对象,其中通过使用用于临时保持物体的保持位置,物体到/从装载端口的传送的定时彼此偏移。 持有站点至少是AGV的组件和负载端口以外的探测器。