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31. 发明授权

US07779895B2 Protective device for protecting thermal interface material and fasteners of heat dissipation device 有权
标题翻译：用于保护散热装置的热界面材料和紧固件的保护装置
公开(公告)号：US07779895B2
公开(公告)日：2010-08-24
申请号：US12102016
申请日：2008-04-14
申请人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu
发明人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu
IPC分类号： F28F7/00
CPC分类号： F28D15/0275 , F28F2265/02 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported.
摘要翻译：散热装置组件包括用于从电子元件散发热量的散热装置和保护装置组件。所述散热装置包括具有贯穿其中的紧固件的基座，布置在所述基座的顶部上的多个翅片以及附接在所述基座的底部上的导热板。热界面材料散布在导热板的底表面上。保护装置组件包括附接到导热板的底部的第一盖和与第一盖分离并连接到基部的侧面的第二盖。当散热装置运输时，第一盖保护热界面材料免受污染，并且第二盖保护紧固件免于从基座掉落。

32. 发明申请

US20100155023A1 HEAT DISSIPATION APPARATUS HAVING HEAT PIPES INSERTED THEREIN 审中-公开
标题翻译：具有其中的热管的散热装置
公开(公告)号：US20100155023A1
公开(公告)日：2010-06-24
申请号：US12423816
申请日：2009-04-15
申请人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
IPC分类号： F28F7/00 , F28D15/00
CPC分类号： F28D15/0233 , F28D15/0266 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus includes a base, a heat sink on the base, two heat pipes thermally connecting the base and the heat sink and a fan mounted in the heat sink. The heat sink comprises a first fin group placed on the base and a second fin group located on the first fin group. Each heat pipe comprises an evaporation section connected to the base, a condensation section and an adiabatic section interconnecting the evaporation section and the condensation section. The condensation sections of the heat pipes are sandwiched between the first and second fin groups and surround the fan.
摘要翻译：散热装置包括底座，基座上的散热器，热连接底座和散热器的两个热管和安装在散热器中的风扇。散热器包括放置在基座上的第一翅片组和位于第一翅片组上的第二翅片组。每个热管包括连接到基座的蒸发部分，冷凝部分和互连蒸发部分和冷凝部分的绝热部分。热管的冷凝部分夹在第一和第二翅片组之间并围绕风扇。

33. 发明申请

US20090301694A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20090301694A1
公开(公告)日：2009-12-10
申请号：US12200874
申请日：2008-08-28
申请人： SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F24H3/02 , F28F13/12 , F28F7/00
CPC分类号： H01L23/467 , F28D15/0233 , F28D15/0275 , F28F1/20 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device dissipating heat from a heat-generating electronic element, includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing, an impeller comprising a driving member received in the housing and an axle which extends through a centre of the driving member. The axle has a lower end extending downwardly through a bottom of the housing to a centre of the top of the canister and an upper end extending upwardly through a top of the housing to engage the fan. The working fluid is heated by the heat-generating electronic element and vaporized into the housing to engage the driving member to rotate and drive the fan to rotate synchronously.
摘要翻译：从发热电子元件散热的散热装置包括：填充有相变工作流体的罐;密封地固定在罐顶部并与罐连通的外壳;位于罐顶部上方的风扇; 壳体，包括容纳在壳体中的驱动构件和延伸穿过驱动构件的中心的轴的叶轮。轴具有向下延伸穿过壳体的底部的下端到罐的顶部的中心，并且上端向上延伸穿过壳体的顶部以接合风扇。工作流体被发热电子元件加热并蒸发到壳体中以与驱动构件接合以旋转并驱动风扇同步旋转。

34. 发明申请

US20090129018A1 HEAT DISSIPATION DEVICE ASSEMBLY WITH A FAN DUCT HAVING GUIDING MEMBERS FOR GUIDING A SCREWDRIVER TO ASSEMBLE THE HEAT DISSIPATION DEVICE ASSEMBLY TO A PRINTED CIRCUIT BOARD 失效
标题翻译：具有导向构件的风扇盖的散热装置组件用于引导螺丝刀组装散热装置组件到印刷电路板
公开(公告)号：US20090129018A1
公开(公告)日：2009-05-21
申请号：US11940937
申请日：2007-11-15
申请人： SHI-WEN ZHOU , JUN CAO , JIE-CHENG DENG
发明人： SHI-WEN ZHOU , JUN CAO , JIE-CHENG DENG
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink (10) contacting one of the electronic components, a pair of fans (20) attached on a lateral side of the heat sink, and a fan duct (30) fixed on the fans. A plurality of guiding members (322, 346) are formed inwardly from the fan duct to be located in an interior of the fan duct. The guiding members are used for guiding a screwdriver (40) to accurately fit with screws (50) preassembled to the heat sink. Thus, the screws can be quickly and easily fastened by the screwdriver to mount the heat dissipation device assembly on the printed circuit board.
摘要翻译：一种用于从安装在印刷电路板上的多个电子部件散热的散热装置组件，包括接触电子部件之一的散热片（10），一对安装在热源外侧的风扇（20）水槽和固定在风扇上的风扇导管（30）。多个引导构件（322,346）从风扇通道向内形成以位于风扇通道的内部。引导构件用于引导螺丝刀（40）以精确地配合预先组装到散热器的螺钉（50）。因此，可以通过螺丝刀快速方便地固定螺钉，以将散热装置组件安装在印刷电路板上。

35. 发明授权

US07495913B1 Heat dissipating assembly having a fan duct 失效
标题翻译：具有风扇导管的散热组件
公开(公告)号：US07495913B1
公开(公告)日：2009-02-24
申请号：US11836718
申请日：2007-08-09
申请人： Peng Liu , Jun Cao , Shi-Wen Zhou
发明人： Peng Liu , Jun Cao , Shi-Wen Zhou
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： G06F1/20
摘要： A heat dissipating assembly for dissipating heat from a CPU and a VRM simultaneously includes a base (10) contacting the CPU, a heat sink (20) mounted on the base, a pair of fans (30) attached on a front side of the heat sink, and a fan duct (40) secured to the fans. The fan duct has a first inlet (440) through which a part of airflow flows into the fan duct, a second inlet (460) through which another part of the airflow flowing into the fan duct. The another part of the airflow also flows through the VRM so it can cool the VRM. The fan duct further has an outlet (480) for allowing the airflow generated by the fans to blow to the heat sink.
摘要翻译：用于从CPU和VRM中散热的散热组件同时包括接触CPU的基座（10），安装在基座上的散热器（20），安装在热源正面上的一对风扇（30）水槽和固定到风扇的风扇导管（40）。风扇管道具有第一入口（440），气流的一部分通过该第一入口流入风扇管道;第二入口（460），流过风扇管道的气流的另一部分穿过第二入口。气流的另一部分也流经VRM，因此可以对VRM进行冷却。风扇导管还具有用于允许由风扇产生的气流吹向散热器的出口（480）。

36. 发明授权

US07493940B2 Heat dissipation device having mounting brackets 失效
标题翻译：具有安装支架的散热装置
公开(公告)号：US07493940B2
公开(公告)日：2009-02-24
申请号：US11309841
申请日：2006-10-10
申请人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen , Li He , Peng Liu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen , Li He , Peng Liu
IPC分类号： F24H3/02 , F28F9/00 , H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device (100) includes a heat sink (10) having a plurality of fins (14) and a plurality of mounting brackets (20) buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate (22) mounted on a top of the heat sink and a baffle plate (26) extending from one side of the mounting plate to a bottom of the heat sink. The baffle plate terminates with a retaining plate (28). A plurality of fasteners (50) extends through the retaining plates to mount the heat dissipation device onto a printed circuit board. Self-tapping screws (40) are used to extend through the fan and the mounting plates of the mounting brackets and threadedly engage with the fins thereby mounting the fan on the heat sink.
摘要翻译：散热装置（100）包括散热片（10），散热片（10）具有多个散热片（14）和多个与散热片的翅片相互扣合的安装支架（20）。每个安装支架包括安装在散热器顶部的安装板（22）和从安装板的一侧延伸到散热器底部的挡板（26）。挡板终止于保持板（28）。多个紧固件（50）延伸穿过保持板以将散热装置安装到印刷电路板上。自攻螺钉（40）用于延伸通过风扇和安装支架的安装板，并与翅片螺纹接合，从而将风扇安装在散热器上。

37. 发明申请

US20080314556A1 HEAT DISSIPATION DEVICE HAVING A FAN FOR DISSIPATING HEAT GENERATED BY AT LEAST TWO ELECTRONIC COMPONENTS 有权
标题翻译：具有散热风扇的散热装置，用于消除最少两个电子元件产生的热量
公开(公告)号：US20080314556A1
公开(公告)日：2008-12-25
申请号：US11767032
申请日：2007-06-22
申请人： Shi-Wen ZHOU , Peng LIU , Jun CAO
发明人： Shi-Wen ZHOU , Peng LIU , Jun CAO
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for at least two heat-generating electronic components, includes a base, a fin set and a plurality of heat pipes. The base includes a supporting frame and at least two plates attached to a bottom of the frame for contacting with the at least two heat-generating electronic components. The fin set includes a plurality of fins on the base. The heat pipes respectively and thermally connect the at least two plates and the fin set together. A single fan is attached to the heat dissipation device for generating an airflow through the fin set to dissipate heat in the fin set absorbed from the at least two heat-generating electronic components.
摘要翻译：一种用于至少两个发热电子部件的散热装置，包括基座，翅片组和多个热管。基座包括支撑框架和附接到框架的底部的至少两个板，用于与至少两个发热电子部件接触。翅片组包括在基座上的多个翅片。热管分别将至少两个板和翅片组热连接在一起。单个风扇附接到散热装置，用于产生通过散热片组的气流，以散发从至少两个发热电子部件吸收的散热片组中的热量。

38. 发明申请

US20080142194A1 HEAT DISSIPATION DEVICE WITH A HEAT PIPE 失效
标题翻译：带散热管的散热装置
公开(公告)号：US20080142194A1
公开(公告)日：2008-06-19
申请号：US11752902
申请日：2007-05-23
申请人： SHI-WEN ZHOU , GUO CHEN , PENG LIU , CHUN-CHI CHEN
发明人： SHI-WEN ZHOU , GUO CHEN , PENG LIU , CHUN-CHI CHEN
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： F28D15/0233 , F28D1/0472 , F28F1/20 , H01L23/367 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device comprises a radiator comprising a collar, a core received in the collar and a helical heat pipe embedded in a circumferential face of the core. The collar has a receiving hole and a plurality of fins extending radially and outwardly from an outer face of the collar. The core together with the heat pipe is received in the receiving hole of the radiator. The core has a flat bottom face and a top face opposite to the bottom face. The heat pipe is located between the radiator and the core and thermally contacts the collar of the radiator and the core. The heat pipe extends from the bottom face of the core to the top face of the core, and has a flattened bottom face coplanar with the bottom face of the core for contacting with an electronic device.
摘要翻译：散热装置包括散热器，其包括套环，容纳在轴环中的芯和嵌入在芯的圆周面中的螺旋形热管。套环具有接收孔和从轴环的外表面径向向外延伸的多个翅片。核心与热管一起被接收在散热器的接收孔中。芯具有平坦的底面和与底面相对的顶面。热管位于散热器和芯之间，并与散热器和芯体的轴颈热接触。热管从芯的底面延伸到芯的顶面，并且具有与芯的底面共面的扁平底面，用于与电子装置接触。

39. 发明授权

US07382047B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07382047B2
公开(公告)日：2008-06-03
申请号：US11306412
申请日：2005-12-27
申请人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： H01L23/10 , B23P6/00 , F28F27/00 , H01B7/42
CPC分类号： F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/4006 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.
摘要翻译：散热装置（1）包括散热器（10），风扇（20）和冷却构件（30）。散热器包括基座，从基座延伸的多个翅片和至少一个热连接底座和翅片的热管。冷却件在其上设置有翅片组件，并且包括附接到翅片的一侧的冷表面和至少一个热管的冷凝部分，以使翅片的一侧和冷凝部分具有较低的温度。

40. 发明申请

US20080105409A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES 审中-公开
标题翻译：带热管的散热装置
公开(公告)号：US20080105409A1
公开(公告)日：2008-05-08
申请号：US11556556
申请日：2006-11-03
申请人： WEN-LI LUO , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： WEN-LI LUO , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base for absorbing heat from a heat generating device and a first fin set disposed on the base. Two second fin sets are located on two sides of the first fin set and extend beyond the base. At least a heat pipe includes a first section thermally sandwiched between the base and the first fin set and extending totally within and thermally contacting with the two second fin sets, and a second section extending away from the base and thermally contacting the first fin set and the second fin set.
摘要翻译：散热装置包括用于从发热装置吸收热量的基座和设置在基座上的第一翅片组。两个第二个翅片组位于第一个翅片组的两侧，并延伸到基座之外。至少一个热管包括热夹持在基部和第一翅片组之间的第一部分，并且全部在两个第二翅片组内部和与第二翅片组热接触的第一部分，以及远离基部延伸并与第一翅片组热接触的第二部分第二个翅膀集。

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