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31. 发明授权

US4929174A Gas lighter with spark ignition 失效
标题翻译：气体打火机带火花点火
公开(公告)号：US4929174A
公开(公告)日：1990-05-29
申请号：US326793
申请日：1989-03-21
申请人： Ming-I Wang
发明人： Ming-I Wang
IPC分类号： F23Q2/16
CPC分类号： F23Q2/163
摘要： A lighter including a machine housing, a nozzle assembly, an adjusting assembly, a grinding assembly and a filling assembly is provided to provide a flame having an inner flame and an outer flame and uneasy to be blown out. A burning tube is provided to mount at the intermediate portion thereof a disturbing disk defining thereabove a combustion chamber and decelerating the mixed air and gas to provide the inner flame in the combustion chamber.
摘要翻译：提供一种包括机器壳体，喷嘴组件，调节组件，研磨组件和填充组件的打火机，以提供具有内部火焰和外部火焰并且不易被吹出的火焰。燃烧管被设置成在其中间部分安装限定燃烧室上方的干扰盘，并使混合的空气和气体减速以在燃烧室中提供内部火焰。

32. 发明授权

US08558336B2 Semiconductor photodetector structure and the fabrication method thereof 有权
标题翻译：半导体光电探测器结构及其制造方法
公开(公告)号：US08558336B2
公开(公告)日：2013-10-15
申请号：US12542671
申请日：2009-08-17
申请人： Tzung-I Su , Bang-Chiang Lan , Chao-An Su , Hui-Min Wu , Ming-I Wang , Chien-Hsin Huang , Tzung-Han Tan , Min Chen , Meng-Jia Lin , Wen-Yu Su
发明人： Tzung-I Su , Bang-Chiang Lan , Chao-An Su , Hui-Min Wu , Ming-I Wang , Chien-Hsin Huang , Tzung-Han Tan , Min Chen , Meng-Jia Lin , Wen-Yu Su
IPC分类号： H01L31/0232 , H01L31/18 , H01L31/08
CPC分类号： H01L31/035281 , H01L27/1461 , H01L31/105 , H01L31/1804 , H01L31/1808 , Y02E10/547 , Y02P70/521
摘要： A semiconductor photodetector structure is provided. The structure includes a substrate, a photodetecting element and a semiconductor layer disposed on the photodetecting element. The substrate includes a first semiconductor material and includes a deep trench. The surface of the deep trench includes a first type dopant. The photodetecting element is disposed in the deep trench. The photodetecting element includes a second semiconductor material. The semiconductor layer includes a second type dopant.
摘要翻译：提供半导体光电检测器结构。该结构包括基板，受光元件和设置在光电检测元件上的半导体层。衬底包括第一半导体材料并且包括深沟槽。深沟槽的表面包括第一类型的掺杂剂。光检测元件设置在深沟槽中。光检测元件包括第二半导体材料。半导体层包括第二种掺杂剂。

33. 发明申请

US20120211641A1 CONTIGUOUS MICROLENS ARRAY 有权
公开(公告)号：US20120211641A1
公开(公告)日：2012-08-23
申请号：US13457680
申请日：2012-04-27
申请人： Yu-Tsung LIN , Hsin-Ping Wu , Hung-Chao Kao , Ming-I Wang
发明人： Yu-Tsung LIN , Hsin-Ping Wu , Hung-Chao Kao , Ming-I Wang
IPC分类号： H01L27/146 , G02B27/12
CPC分类号： B29D11/00365 , G02B3/0018 , G02B3/0056 , G02B5/201 , G03F7/40
摘要： The present disclosure provides a contiguous microlens array, which consists of a plurality of touching microlenses, wherein the adjacent microlenses are connected to each other to form a contiguous microlens array and curvatures of every angle cross section of each microlens are the same. The shape of the curved surface of a microlens in the microlens array is selectively adjusted according to its position in the array and the incident angle of light incident thereto.
摘要翻译：本公开提供了一种连续的微透镜阵列，其由多个触摸微透镜组成，其中相邻的微透镜彼此连接以形成连续的微透镜阵列，并且每个微透镜的每个角度横截面的曲率相同。微透镜阵列中的微透镜的曲面的形状根据其在阵列中的位置和入射到其中的光的入射角度而被选择性地调节。

34. 发明申请

US20120205808A1 MEMS and Protection Structure Thereof 有权
标题翻译： MEMS及其保护结构
公开(公告)号：US20120205808A1
公开(公告)日：2012-08-16
申请号：US13459268
申请日：2012-04-30
申请人： Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Min Chen , Chien-Hsin Huang , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Li-Che Chen , Meng-Jia Lin
发明人： Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Min Chen , Chien-Hsin Huang , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Li-Che Chen , Meng-Jia Lin
IPC分类号： H01L23/48
CPC分类号： H01L24/02 , B81B2207/015 , B81B2207/07 , B81B2207/115 , B81C1/00246 , B81C2203/0714 , H01L23/585 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/1461 , H01L2924/00
摘要： A protection structure of a pad is provided. The pad is disposed in a dielectric layer on a semiconductor substrate and the pad includes a connection region and a peripheral region which encompasses the connection region. The protection structure includes at least a barrier, an insulation layer and a mask layer. The barrier is disposed in the dielectric layer in the peripheral region. The insulation layer is disposed on the dielectric layer. The mask layer is disposed on the dielectric layer and covers the insulation layer and the mask layer includes an opening to expose the connection region of the pad.
摘要翻译：提供垫的保护结构。衬垫设置在半导体衬底上的电介质层中，衬垫包括连接区域和包围连接区域的周边区域。保护结构至少包括屏障，绝缘层和掩模层。阻挡层设置在周边区域的电介质层中。绝缘层设置在电介质层上。掩模层设置在电介质层上并覆盖绝缘层，掩模层包括露出焊盘连接区域的开口。

35. 发明授权

US08193640B2 MEMS and a protection structure thereof 有权
标题翻译： MEMS及其保护结构
公开(公告)号：US08193640B2
公开(公告)日：2012-06-05
申请号：US12538168
申请日：2009-08-10
申请人： Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Min Chen , Chien-Hsin Huang , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Li-Che Chen , Meng-Jia Lin
发明人： Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Min Chen , Chien-Hsin Huang , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Li-Che Chen , Meng-Jia Lin
IPC分类号： H01L23/48
CPC分类号： H01L24/02 , B81B2207/015 , B81B2207/07 , B81B2207/115 , B81C1/00246 , B81C2203/0714 , H01L23/585 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/1461 , H01L2924/00
摘要： A protection structure of a pad is provided. The pad is disposed in a dielectric layer on a semiconductor substrate and the pad includes a connection region and a peripheral region which encompasses the connection region. The protection structure includes at least a barrier, an insulation layer and a mask layer. The barrier is disposed in the dielectric layer in the peripheral region. The insulation layer is disposed on the dielectric layer. The mask layer is disposed on the dielectric layer and covers the insulation layer and the mask layer includes an opening to expose the connection region of the pad.
摘要翻译：提供垫的保护结构。衬垫设置在半导体衬底上的电介质层中，衬垫包括连接区域和包围连接区域的周边区域。保护结构至少包括屏障，绝缘层和掩模层。阻挡层设置在周边区域的电介质层中。绝缘层设置在电介质层上。掩模层设置在电介质层上并覆盖绝缘层，掩模层包括露出焊盘连接区域的开口。

36. 发明申请

US20110115040A1 Semiconductor Optoelectronic Structure and the Fabricating Method Thereof 有权
标题翻译：半导体光电子结构及其制造方法
公开(公告)号：US20110115040A1
公开(公告)日：2011-05-19
申请号：US12618774
申请日：2009-11-15
申请人： Tzung-I Su , Chao-An Su , Ming-I Wang , Bang-Chiang Lan , Tzung-Han Tan , Hui-Min Wu , Chien-Hsin Huang , Min Chen , Meng-Jia Lin
发明人： Tzung-I Su , Chao-An Su , Ming-I Wang , Bang-Chiang Lan , Tzung-Han Tan , Hui-Min Wu , Chien-Hsin Huang , Min Chen , Meng-Jia Lin
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： G02B6/1228 , G02B6/12002 , G02B6/12004 , G02B6/136 , G02B6/428
摘要： A method of fabricating a semiconductor optoelectronic structure is provided. First, a substrate is provided, and a waveguide is formed therein, and then a plurality of dielectric layers is formed on the waveguide. Next, a contact pad and a passivation layer are provided on the dielectric layers and a patterned mask layer is formed thereon. Last, an etching process is provided by using the patterned mask layer to expose the contact pad and remove a portion of the passivation layer and the dielectric layers to form a transformer.
摘要翻译：提供一种制造半导体光电子结构的方法。首先，提供基板，并且在其中形成波导，然后在波导上形成多个电介质层。接下来，在电介质层上设置接触焊盘和钝化层，并且在其上形成图案化的掩模层。最后，通过使用图案化掩模层来暴露接触焊盘并去除钝化层和介电层的一部分以形成变压器来提供蚀刻工艺。

37. 发明申请

US20110097033A1 FOCUSING MEMBER AND OPTOELECTRONIC DEVICE 有权
标题翻译：聚焦会员和光电设备
公开(公告)号：US20110097033A1
公开(公告)日：2011-04-28
申请号：US12605891
申请日：2009-10-26
申请人： Tzung-I Su , Ming-I Wang , Bang-Chiang Lan , Te-Kan Liao , Chao-An Su , Hui-Min Wu , Chien-Hsin Huang , Tzung-Han Tan , Min Chen , Meng-Jia Lin
发明人： Tzung-I Su , Ming-I Wang , Bang-Chiang Lan , Te-Kan Liao , Chao-An Su , Hui-Min Wu , Chien-Hsin Huang , Tzung-Han Tan , Min Chen , Meng-Jia Lin
IPC分类号： G02B6/12 , G02B1/10 , G02B6/32
CPC分类号： G02B6/12004 , G02B6/305
摘要： A focusing member and an optoelectronic device having the same are provided. The focusing member includes multiple levels of conductive plugs and multiple levels of conductive layers that together form an inversed half-boat shape. The optoelectronic device includes a bottom layer, an optical waveguide above the bottom layer, a dielectric layer covering the optical waveguide, and the above focusing member disposed at an edge of the optoelectronic device and located in the dielectric layer above the optical waveguide. A wider end of the inversed half-boat shape of the focusing member faces the outside of the optoelectronic device. The refractive indexes of the bottom layer and the dielectric layer are smaller than that of the optical waveguide.
摘要翻译：提供聚焦构件和具有该聚焦构件的光电子器件。聚焦构件包括多个级别的导电插塞和多层导电层，这些导电层一起形成反转的半舟形状。光电子器件包括底层，底层上方的光波导，覆盖光波导的电介质层，以及设置在光电子器件的边缘并位于光波导上方的电介质层中的上述聚焦构件。聚焦构件的反转半舟形的较宽端面向光电器件的外侧。底层和电介质层的折射率小于光波导的折射率。

38. 发明申请

US20110057288A1 MEMS DEVICE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译： MEMS器件及其制造方法
公开(公告)号：US20110057288A1
公开(公告)日：2011-03-10
申请号：US12943269
申请日：2010-11-10
申请人： Tzung-Han TAN , Bang-Chiang LAN , Ming-I WANG , Chien-Hsin HUANG , Meng-Jia LIN
发明人： Tzung-Han TAN , Bang-Chiang LAN , Ming-I WANG , Chien-Hsin HUANG , Meng-Jia LIN
IPC分类号： H01L29/06 , H01L21/71
CPC分类号： B81C1/00246 , B81B3/0072 , B81B2203/04 , B81B2207/015 , B81C2201/0167
摘要： A microelectromechanical system (MEMS) device and a method for fabricating the same are described. The MEMS device includes a first electrode and a second electrode. The first electrode is disposed on a substrate, and includes at least two metal layers, a first protection ring and a dielectric layer. The first protection ring connects two adjacent metal layers, so as to define an enclosed space between two adjacent metal layers. The dielectric layer is disposed in the enclosed space and connects two adjacent metal layers. The second electrode is disposed on the first electrode, wherein a cavity is formed between the first electrode and the second electrode.
摘要翻译：描述了微机电系统（MEMS）装置及其制造方法。 MEMS器件包括第一电极和第二电极。第一电极设置在基板上，并且包括至少两个金属层，第一保护环和介电层。第一保护环连接两个相邻的金属层，以便限定两个相邻金属层之间的封闭空间。电介质层设置在封闭空间中并连接两个相邻的金属层。第二电极设置在第一电极上，其中在第一电极和第二电极之间形成空腔。

39. 发明申请

US20100074458A1 STRUCTURE OF MEMS ELECTROACOUSTIC TRANSDUCER AND FABRICATING METHOD THEREOF 有权
标题翻译： MEMS电磁传感器的结构及其制造方法
公开(公告)号：US20100074458A1
公开(公告)日：2010-03-25
申请号：US12233919
申请日：2008-09-19
申请人： Bang-Chiang Lan , Ming-I Wang , Li-Hsun Ho , Hui-Min Wu , Min Chen , Chien-Hsin Huang
发明人： Bang-Chiang Lan , Ming-I Wang , Li-Hsun Ho , Hui-Min Wu , Min Chen , Chien-Hsin Huang
IPC分类号： H04R3/00 , H04R31/00
CPC分类号： B81B3/0021 , B81B2201/0271 , H04R3/00 , H04R7/00 , H04R19/005 , H04R31/00 , H04R2499/11 , Y10T29/49002
摘要： A structure of a micro-electro-mechanical systems (MEMS) electroacoustic transducer includes a substrate, a diaphragm, a silicon material layer, and a conductive pattern. The substrate includes an MEMS device region. The diaphragm has openings, and is disposed in the MEMS device region. A first cavity is formed between the diaphragm and the substrate. The silicon material layer is disposed on the diaphragm and seals the diaphragm. The conductive pattern is disposed beneath the diaphragm in the MEMS device region.
摘要翻译：微电子机械系统（MEMS）电声换能器的结构包括基板，隔膜，硅材料层和导电图案。衬底包括MEMS器件区域。隔膜具有开口，并且设置在MEMS器件区域中。在隔膜和基板之间形成第一空腔。硅材料层设置在隔膜上并密封隔膜。导电图案设置在MEMS器件区域中的隔膜下方。

40. 发明申请

US20100044147A1 MICROELECTROMECHANICAL SYSTEM DIAPHRAGM AND FABRICATING METHOD THEREOF 有权
标题翻译：微电子系统膜及其制造方法
公开(公告)号：US20100044147A1
公开(公告)日：2010-02-25
申请号：US12196016
申请日：2008-08-21
申请人： Ming-I Wang
发明人： Ming-I Wang
IPC分类号： H04R7/14 , B81C1/00 , B81B7/02
CPC分类号： H04R19/005 , B81B3/0072 , B81B2201/0257 , B81B2203/04
摘要： A microelectromechanical system diaphragm is provided. The microelectromechanical system diaphragm includes a substrate, a first conductive layer, a second conductive layer, a first dielectric layer, and a second dielectric layer. The first conductive layer is disposed on the substrate. The first conductive layer has a flexible portion in which a plurality of trenches is formed. The second conductive layer is disposed between the first conductive layer and the substrate, in which the flexible portion is located above the second conductive layer. The first dielectric layer is disposed between the second conductive layer and the substrate. The second dielectric layer is disposed between the substrate and a portion of the first conductive layer so as to suspend the flexible portion. Furthermore, at least one first opening is formed in the first conductive layer.
摘要翻译：提供微机电系统隔膜。微机电系统隔膜包括基板，第一导电层，第二导电层，第一介电层和第二介电层。第一导电层设置在基板上。第一导电层具有形成多个沟槽的柔性部分。第二导电层设置在第一导电层和基板之间，柔性部分位于第二导电层之上。第一介电层设置在第二导电层和基板之间。第二电介质层设置在基板和第一导电层的一部分之间，以使弹性部分悬挂。此外，在第一导电层中形成至少一个第一开口。

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