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    • 31. 发明授权
    • Fabrication method employing and energy beam source
    • 采用制造方法和能量束源
    • US5989779A
    • 1999-11-23
    • US544108
    • 1995-10-17
    • Masahiro HatakeyamaKatsunori IchikiTadasuke KobataYotaro HatamuraMasayuki Nakao
    • Masahiro HatakeyamaKatsunori IchikiTadasuke KobataYotaro HatamuraMasayuki Nakao
    • H01J37/305H01J37/317H05H3/02G03C5/00B23K15/00G21K5/10
    • H05H3/02H01J37/3053H01J37/3178
    • An energy beam source is used in micro-fabrication tasks, such as fabrication of specific patterns, in-situ bonding, repair, connection and disconnection of electrical paths, applicable to semiconductor devices and other micro-sized circuits in integrated circuits. The beam source is made compact so that several sources can be located inside a vacuum vessel and in conjunction with micro-manipulators or micro-movement stages operated under light or an electron microscope. The beam source is provided with at least three electrodes, and by applying a selected voltage, i.e., high frequency voltage, direct current voltage and ground voltage, on each the three electrodes in association with film-forming substance(s), virtually any type of deposit can be formed at any location of a workpiece. Different types of particle beams, such as positive and negative ion beams, a highspeed neutral atomic beam, a radical particle beam, an electron beam can be produced from the beam source by judicious choice of operating-parameters and the film-forming material which may be a process gas or an applied coating. By using the beam source and the method of deposit forming presented, virtually any type of fabrication task can be carried out on any surface and any location of a workpiece in a three-dimensional space.
    • 能量束源用于微加工任务,例如制造特定图案,原位粘合,修复,连接和断开电路径,适用于集成电路中的半导体器件和其他微型尺寸电路。 光束源是紧凑的,使得几个源可以位于真空容器内并且与在微光或电子显微镜下操作的微操纵器或微移动台结合。 光束源设置有至少三个电极,并且通过在与成膜物质相关联的三个电极上的每一个上施加选择的电压,即高频电压,直流电压和接地电压,实际上任何类型 的沉积物可以形成在工件的任何位置。 可以通过明智地选择操作参数和成膜材料,从光束源产生不同类型的粒子束,例如正离子束和负离子束,高速中性原子束,自由基粒子束,电子束, 作为工艺气体或涂覆涂层。 通过使用光束源和沉积物形成方法,几乎​​任何类型的制造任务可以在三维空间中的工件的任何表面和任何位置上进行。