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    • 35. 发明授权
    • Apparatus for ejecting droplets
    • 用于喷射液滴的装置
    • US08622520B2
    • 2014-01-07
    • US13532585
    • 2012-06-25
    • Hyun Ho ShinByung Hun KimJong Beom KimJae Chang LeeWon Chul Sim
    • Hyun Ho ShinByung Hun KimJong Beom KimJae Chang LeeWon Chul Sim
    • B41J2/135B41J2/14
    • B41J2/14233B41J2002/14362
    • Disclosed herein is an ejecting apparatus including: an upper body which includes an inlet through which ejectable fluid flows in from an external source, a channel which fluidly communicates with the inlet and through which the ejectable fluid flows, and an upper mounting portion which fluidly communicates with the channel and is opened downwardly; a lower body which includes a lower mounting portion which is opened upwardly to correspond to the upper mounting portion, and a nozzle slit which fluidly communicates with the lower mounting portion to eject the ejectable fluid to an outside, the lower body being fastened to the upper body, and a nozzle chip which is interposed between the upper mounting portion and the lower mounting portion to receive the ejectable fluid from the channel and discharge the ejectable fluid into the nozzle slit by being driven by an actuator.
    • 本文公开了一种喷射装置,包括:上体,其包括可喷射流体从外部源流入的入口,与入口流体连通并且可喷射流体流过的通道;以及流体连通的上部安装部 与通道向下打开; 下体,其包括向上打开以对应于上安装部分的下安装部分,以及与下安装部分流体连通以将可喷射流体喷射到外部的喷嘴狭缝,下体固定到上部 主体和插入在上安装部和下安装部之间的喷嘴芯片,以从通道接收可喷射的流体,并且通过致动器驱动将可喷射流体排出到喷嘴狭缝中。
    • 36. 发明授权
    • Piezoelectric actuator inkjet head and method of forming the same
    • 压电致动器喷墨头及其形成方法
    • US07682001B2
    • 2010-03-23
    • US11581333
    • 2006-10-17
    • Tae-kyung LeeJae-woo ChungKyo-yeol LeeHwa-sun LeeSeung-mo LimJae-chang Lee
    • Tae-kyung LeeJae-woo ChungKyo-yeol LeeHwa-sun LeeSeung-mo LimJae-chang Lee
    • B41J2/045
    • B41J2/14233B41J2002/14491Y10T29/42Y10T29/49002Y10T29/49005Y10T29/4908
    • A piezoelectric actuator of an inkjet head and a method of forming the piezoelectric actuator. The piezoelectric actuator is formed on a vibration plate to provide a driving force to each of a plurality of pressure chambers. The piezoelectric actuator includes a lower electrode formed on the vibration plate, a piezoelectric layer formed on the lower electrode at a position corresponding to each of the pressure chambers, a supporting pad formed on the lower electrode, the supporting pad contacting one end of the piezoelectric layer and extending away from the one end of the piezoelectric layer, and an upper electrode extending from a top surface of the piezoelectric layer to a top surface of the supporting pad. The upper electrode is bonded to a driving circuit above the supporting pad to receive a voltage from the driving circuit. The piezoelectric layer may have substantially the same length as the pressure chamber. The supporting pad may be formed of a photosensitive polymer and may have substantially the same height as the piezoelectric layer. The upper electrode may include a first portion formed on the piezoelectric layer and a second portion formed on the supporting pad, and the second portion may be wider than the first portion.
    • 喷墨头的压电致动器和形成压电致动器的方法。 压电致动器形成在振动板上以向多个压力室中的每一个提供驱动力。 压电致动器包括形成在振动板上的下电极,形成在下电极上的与每个压力室对应的位置处的压电层,形成在下电极上的支撑焊盘,支撑焊盘接触压电体的一端 并且离开压电层的一端延伸,以及从压电层的顶表面延伸到支撑衬垫的顶表面的上电极。 上电极接合到支撑焊盘上方的驱动电路,以接收来自驱动电路的电压。 压电层可以具有与压力室大致相同的长度。 支撑垫可以由光敏聚合物形成,并且可以具有与压电层基本相同的高度。 上部电极可以包括形成在压电层上的第一部分和形成在支撑垫上的第二部分,并且第二部分可以比第一部分更宽。
    • 37. 发明申请
    • PIEZOELECTRIC INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME
    • 压电喷墨印刷机及其制造方法
    • US20090102895A1
    • 2009-04-23
    • US12038170
    • 2008-02-27
    • Jong-beom KimJae-chang Lee
    • Jong-beom KimJae-chang Lee
    • B41J2/045H01L21/00
    • B41J2/1628B41J2/14233B41J2/161B41J2/1631B41J2/1642B41J2/1646Y10T29/49401
    • Provided are a piezoelectric inkjet printhead and a method of manufacturing the same. The piezoelectric inkjet printhead includes first and second single-crystalline silicon substrates. An ink flow path is disposed in a first surface of the first substrate. The ink flow path includes an ink introduction port, a manifold for supplying ink, a plurality of pressure chambers filled with ink to be ejected, a plurality of restrictors for connecting the manifold with the plurality of pressure chambers, respectively, and a plurality of nozzles for ejecting ink. The second substrate is bonded to the first substrate to thereby complete the ink flow path. A plurality of piezoelectric actuators are disposed on a second surface of the first substrate to correspond to each of the pressure chambers and provide drivability required for ejecting ink to the respective pressure chambers. In this construction, aligning the first and second substrates is unnecessary, so that the manufacturing process can be simplified, the manufacturing cost can be reduced, and ink ejecting performance can be improved.
    • 提供一种压电喷墨打印头及其制造方法。 压电喷墨打印头包括第一和第二单晶硅衬底。 墨流路设置在第一基板的第一表面中。 墨水流路包括墨水引入口,用于供应墨水的歧管,填充有待喷射墨水的多个压力室,分别用于将歧管与多个压力室连接的多个限制器,以及多个喷嘴 用于喷墨。 第二基板结合到第一基板,从而完成油墨流动路径。 多个压电致动器设置在第一基板的第二表面上以对应于每个压力室,并提供将油墨喷射到各个压力室所需的驱动能力。 在这种结构中,不需要对准第一和第二基板,从而可以简化制造工艺,可以降低制造成本,并且可以提高喷墨性能。
    • 39. 发明授权
    • Silicon direct bonding method
    • 硅直接键合法
    • US07442622B2
    • 2008-10-28
    • US11505420
    • 2006-08-17
    • Sung-gyu KangSeung-mo LimJae-chang LeeWoon-bae Kim
    • Sung-gyu KangSeung-mo LimJae-chang LeeWoon-bae Kim
    • H01L21/30
    • H01L21/187H01L21/2007
    • A silicon direct bonding (SDB) method by which void formation caused by gases is suppressed. The SDB method includes: preparing two silicon substrates having corresponding bonding surfaces; forming trenches having a predetermined depth in at least one bonding surface of the two silicon substrates; forming gas discharge outlets connected to the trenches on at least one of the two silicon substrates to vertically penetrate the bonding surface; cleaning the two silicon substrates; closely contacting the two silicon substrates to each other; and thermally treating the two substrates to bond them to each other. The trenches are formed along at least a part of a plurality of dicing lines, and both ends of the trenches are clogged. Gases generated during a thermal treatment process can be smoothly and easily discharged through the trenches and the gas discharge outlet such that a void is prevented from being formed in the junctions of the two silicon substrates due to the gases.
    • 抑制由气体引起的空隙形成的硅直接接合(SDB)方法。 SDB方法包括:制备具有相应粘合表面的两个硅衬底; 在所述两个硅衬底的至少一个接合表面中形成具有预定深度的沟槽; 形成连接到所述两个硅衬底中的至少一个上的沟槽的气体放电出口,以垂直地穿透所述接合表面; 清洁两个硅衬底; 使两个硅衬底彼此紧密接触; 并对两个基板进行热处理以将它们彼此粘合。 沟槽沿着多个切割线的至少一部分形成,并且沟槽的两端被堵塞。 在热处理过程中产生的气体可以通过沟槽和气体排出口平滑且容易地排出,从而防止由于气体而在两个硅衬底的接合处形成空隙。