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31. 发明授权

US5552076A Anhydrous amorphous ceramics as the particulate phase in electrorheological fluids 失效
标题翻译：无水非晶陶瓷作为电流变流体中的颗粒相
公开(公告)号：US5552076A
公开(公告)日：1996-09-03
申请号：US257319
申请日：1994-06-08
申请人： Daniel R. Gamota , Brian L. Mueller , Frank E. Filisko
发明人： Daniel R. Gamota , Brian L. Mueller , Frank E. Filisko
IPC分类号： C10M171/00 , H01B3/20 , C09K3/00 , C10M125/10
CPC分类号： C10M171/001 , Y10S423/30
摘要： An electrorheological fluid that includes a dispersed particulate phase of anhydrous amorphous ceramic particles. The anhydrous amorphous ceramic particles can be of a very precisely tailored composition that is unavailable in crystalline form, for obtaining enhanced electrorheological response. The amorphous particles are substantially free of water when used, and have reduced tendency to absorb water in use. Accordingly, the electrorheological fluid containing anhydrous amorphous electrorheologically responsive ceramic particles has wide applicability for use, and enhanced durability in such use.
摘要翻译：包含无水无定形陶瓷颗粒的分散颗粒相的电流变流体。无水无定形陶瓷颗粒可以是非常精确地定制的组合物，其不具有结晶形式，以获得增强的电流变响应。当使用时，无定形颗粒基本上不含水，并且在使用中具有降低的吸收水的倾向。因此，含有无水非电化学响应性陶瓷颗粒的电流变流体具有广泛的应用性和使用上的耐久性。

32. 发明授权

US08318032B2 Method to pattern metallized substrates using a high intensity light source 失效
标题翻译：使用高强度光源对金属化基板进行图案化的方法
公开(公告)号：US08318032B2
公开(公告)日：2012-11-27
申请号：US11962164
申请日：2007-12-21
申请人： John B. Szczech , Daniel R. Gamota , Tomasz L. Klosowiak , Jerzy Wielgus
发明人： John B. Szczech , Daniel R. Gamota , Tomasz L. Klosowiak , Jerzy Wielgus
IPC分类号： B44C1/22
CPC分类号： H05K3/027 , H05K1/0393 , H05K3/16 , H05K2201/0116 , H05K2201/0317 , H05K2201/10113 , H05K2203/0557 , H05K2203/056
摘要： A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of the desired metallization pattern is then situated over the metallization layer, exposing those portions of the metallization layer intended to be removed. The masked metallization layer is then exposed to a rapid burst of high intensity visible light from an arc source sufficient to cause complete removal of the exposed portions of the metallization layer, exposing the underlying substrate and creating the delineated pattern.
摘要翻译：使用广谱高强度光源描绘溅射铝或溅射铜层中的金属化图案的方法。通过溅射将金属沉积在聚合物基底上，使其具有多孔纳米结构。然后将作为所需金属化图案的正表示的不透明掩模放置在金属化层上方，暴露预期要去除的金属化层的那些部分。掩蔽的金属化层然后暴露于来自电弧源的高强度可见光的快速爆发，足以引起金属化层的暴露部分的完全去除，暴露下面的衬底并产生描绘图案。

33. 发明申请

US20090161727A1 Method and Apparatus for a Temperature Sensor for Measuring Peak Temperatures 失效
标题翻译：用于测量峰值温度的温度传感器的方法和装置
公开(公告)号：US20090161727A1
公开(公告)日：2009-06-25
申请号：US11959774
申请日：2007-12-19
申请人： Jerzy Wielgus , Daniel R. Gamota , John B. Szczech , Kin P. Tsui , Jie Zhang
发明人： Jerzy Wielgus , Daniel R. Gamota , John B. Szczech , Kin P. Tsui , Jie Zhang
IPC分类号： G01K7/00 , H01C7/02
CPC分类号： G01K3/04 , G01K7/16 , G01K2211/00 , H01C7/04 , H01C17/065 , Y10T29/49085
摘要： A method and apparatus for an irreversible temperature sensor for measuring a peak exposure temperature. The apparatus is fabricated by printing an admixture of conductive nanoparticles on a dielectric substrate to form a film. The film has an electrical resistance that is inversely proportional to the exposure temperature. The electrical resistance also irreversibly decreases as the exposure temperature of the film increases. A portion of the film is exposed to a pulse of electromagnetic energy sufficient to render it substantially more electrically conductive than the portion that was not exposed. In use, the peak exposure temperature is determined by measuring the electrical resistance of the non-altered portion of the film and the electrical resistance of the portion that was exposed to the pulse of electromagnetic energy, and subtracting the electrical resistance of the altered portion from the electrical resistance of the portion that was not altered, to provide a difference value. The peak exposure temperature is then be calculated as a function of the difference value.
摘要翻译：用于测量峰值暴露温度的不可逆温度传感器的方法和装置。该装置通过在介电基片上印刷导电纳米颗粒的混合物来形成膜。该膜具有与曝光温度成反比的电阻。随着膜的暴露温度升高，电阻也不可逆地减小。膜的一部分暴露于足以使其基本上比未暴露的部分更具导电性的电磁能的脉冲。在使用中，峰值曝光温度通过测量膜的未改变部分的电阻和暴露于电磁能脉冲的部分的电阻，以及减去改变部分的电阻来确定未改变的部分的电阻，以提供差值。然后根据差值计算峰值暴露温度。

34. 发明申请

US20090034215A1 Method and Apparatus for Providing Electrically Isolated Closely Spaced Features on a Printed Circuit Board 失效
标题翻译：在印刷电路板上提供电隔离密封特征的方法和装置
公开(公告)号：US20090034215A1
公开(公告)日：2009-02-05
申请号：US11830348
申请日：2007-07-30
申请人： Jerzy Wieglus , Daniel R. Gamota , Tomasz L. Klosowiak , John B. Szczech , Kin P. Tsui
发明人： Jerzy Wieglus , Daniel R. Gamota , Tomasz L. Klosowiak , John B. Szczech , Kin P. Tsui
IPC分类号： H05K7/00 , H01R43/00
CPC分类号： H05K3/04 , H01L21/4846 , H01L23/145 , H01L23/49838 , H01L23/49866 , H01L29/78603 , H01L2924/0002 , H05K1/0293 , H05K3/22 , H05K2201/068 , H05K2201/09727 , H05K2203/1105 , H05K2203/1476 , H05K2203/175 , Y10T29/49117 , H01L2924/00
摘要： A method and apparatus for forming controlled stress fractures in metal produces electrically isolated, closely spaced circuit sub-entities for use on a metallized printed wiring board. A polymeric substrate has a layer of metal adhered to the surface, and the metal layer is formed into entities. Each entity has a fracture initiating feature formed into it, which serves to initiate and/or direct a stress crack that is induced in the metal. The entities are fractured in a controlled manner by subjecting the substrate and the entities to mechanical stress by a rapid thermal excursion, creating a stress fracture in the entity extending from the fracture initiating feature. The stress fracture divides each entity into two or more sub-entities that are electrically isolated from each other by the stress fracture. The resulting structure can be used to form circuitry requiring very fine spaces for high density printed circuit boards. The rapid thermal stress may be induced by a high intensity, strobed xenon arc lamp.
摘要翻译：用于在金属中形成受控应力断裂的方法和装置产生用于金属化印刷线路板的电隔离，紧密间隔的电路子实体。聚合物基材具有粘附到表面的金属层，并且金属层形成为实体。每个实体具有形成在其中的断裂起始特征，其用于引发和/或引导在金属中诱发的应力裂纹。通过快速热偏移对衬底和实体进行机械应力，以受控的方式将实体断裂，在从断裂起始特征延伸的实体中产生应力断裂。应力断裂将每个实体分为两个或多个通过应力断裂彼此电隔离的子实体。所得到的结构可用于形成对于高密度印刷电路板需要非常精细空间的电路。快速热应力可能由高强度，选通的氙弧灯引起。

35. 发明申请

US20080135282A1 PRINTED MULTILAYER CIRCUIT CONTAINING ACTIVE DEVICES AND METHOD OF MANUFATURING 审中-公开
标题翻译：包含活动设备的印刷多层电路及其制造方法
公开(公告)号：US20080135282A1
公开(公告)日：2008-06-12
申请号：US11609069
申请日：2006-12-11
申请人： Krishna D. Jonnalagadda , Daniel R. Gamota , Iwona Turlik
发明人： Krishna D. Jonnalagadda , Daniel R. Gamota , Iwona Turlik
IPC分类号： H05K1/16 , H05K3/12
CPC分类号： H05K3/4664 , H05K1/16 , H05K3/12 , H05K3/4069 , H05K2203/0113 , H05K2203/0143 , Y10T29/49155
摘要： A printed multilayer electronic circuit has printed electronic components on a first level circuit. Electrical conductors are printed on the first level circuit, electrically connected to the electronic components. A layer of dielectric material is printed over the printed electrical conductors. The dielectric layer contains apertures or openings that extend vertically through the dielectric layer down to the electrical conductors. A second set of electrical conductors are then printed on the dielectric layer, situated around the apertures. Electrically conductive material is printed in the apertures so that an electrical connection is made from the second set of electrical conductors to the electrical conductors on the lower level. A second level circuit having additional electronic components is then formed on the dielectric layer and the second set of conductors, so that these electronic components are electrically connected to the electronic components on the first level circuit through the path of the printed second set of electrical conductors, the printed electrically conductive material, and the printed electrical conductors on the lower level.
摘要翻译：印刷的多层电子电路在第一级电路上印刷了电子部件。电导体印刷在第一级电路上，电连接到电子部件。电介质材料层印在印刷电导体上。电介质层包含沿电介质层垂直延伸到电导体的孔或开口。然后将第二组电导体印刷在位于孔周围的电介质层上。导电材料印刷在孔中，使得从第二组电导体到下层的电导体形成电连接。然后在介电层和第二组导体上形成具有附加电子部件的第二电平电路，使得这些电子部件通过印刷的第二组电导体的路径电连接到第一电平电路上的电子部件，印刷的导电材料和下层的印刷电导体。

36. 发明申请

US20080024060A1 ELECTROLUMINESCENT DISPLAY HAVING A PIXEL ARRAY 有权
标题翻译：具有像素阵列的电致发光显示器
公开(公告)号：US20080024060A1
公开(公告)日：2008-01-31
申请号：US11461056
申请日：2006-07-31
申请人： Krishna D. Jonnalagadda , Marc K. Chason , Daniel R. Gamota , Jie Zhang
发明人： Krishna D. Jonnalagadda , Marc K. Chason , Daniel R. Gamota , Jie Zhang
IPC分类号： H05B33/00
CPC分类号： H05B33/06
摘要： An electroluminescent display contains an array of dynamically addressable pixels. The pixels are arranged on one side of a carrier substrate. Conductive vias in the substrate are electrically connected to each of the pixels. Each pixel consists of a bottom electrode that is coupled to a via, an electroluminescent material, and a dielectric material. A common top electrode is disposed on the dielectric material. A driver circuit conductor or connector is situated on the other side of the substrate and is electrically coupled to each of the conductive vias and to the common top electrode, so that each pixel can be individually addressed to illuminate the electroluminescent material on individual pixels.
摘要翻译：电致发光显示器包含动态可寻址像素的阵列。像素布置在载体衬底的一侧上。衬底中的导电通孔电连接到每个像素。每个像素由耦合到通孔，电致发光材料和介电材料的底部电极组成。公共顶部电极设置在电介质材料上。驱动器电路导体或连接器位于衬底的另一侧，并且电耦合到每个导电通孔和公共顶部电极，使得每个像素可被单独寻址以照射各个像素上的电致发光材料。

37. 发明申请

US20070152576A1 CUSTOMIZED ELECTROLUMINESCENT DISPLAY 审中-公开
标题翻译：自定义电致发光显示
公开(公告)号：US20070152576A1
公开(公告)日：2007-07-05
申请号：US11275373
申请日：2005-12-29
申请人： Krishna Kalyanasundaram , Daniel R. Gamota , Krishna D. Jonnalagadda
发明人： Krishna Kalyanasundaram , Daniel R. Gamota , Krishna D. Jonnalagadda
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01J9/227
摘要： An electroluminescent display device is fabricated by creating a generic electroluminescent base laminate or precursor containing an base electrode and an electroluminescent layer. A custom graphic arts film or precursor containing a graphic element and a corresponding electrode is also fabricated. The two precursors are then bonded together using an adhesive to create the customized EL display, so that only the sections of the electroluminescent display device that are associated with the corresponding electrode on the graphic arts film emit light.
摘要翻译：通过产生一般的电致发光基底层压体或含有基极和电致发光层的前体来制造电致发光显示装置。还制造了包含图形元素和相应电极的定制图形艺术膜或前体。然后使用粘合剂将两个前体结合在一起以产生定制的EL显示器，使得只有与图形艺术膜上的相应电极相关联的电致发光显示装置的部分发光。

38. 发明授权

US06541300B1 Semiconductor film and process for its preparation 失效
标题翻译：半导体薄膜及其制备方法
公开(公告)号：US06541300B1
公开(公告)日：2003-04-01
申请号：US10058704
申请日：2002-01-28
申请人： Abhijit R. Chowdhuri , Jie Zhang , Daniel R. Gamota
发明人： Abhijit R. Chowdhuri , Jie Zhang , Daniel R. Gamota
IPC分类号： H01L5140
CPC分类号： H01L51/0003 , H01L51/0004 , H01L51/0007 , H01L51/0036 , H01L51/0512
摘要： The present invention is directed to semiconductor films and a process for their preparation. In accordance with the process of the present invention, semiconductor organic material is blended with a multi-component solvent blend and the blend is deposited on a receiving material to provide a continuous highly ordered film having greater periodicity than films produced with a single solvent/semiconducting material blend under similar processing conditions.
摘要翻译：本发明涉及半导体膜及其制备方法。根据本发明的方法，将半导体有机材料与多组分溶剂共混物共混，并将共混物沉积在接收材料上，以提供具有比用单一溶剂/半导体制备的膜具有更大周期性的连续高阶膜材料混合在相似的加工条件下。

39. 发明授权

US5912507A Solderable pad with integral series termination resistor 失效
标题翻译：具有集成串联终端电阻的可焊垫
公开(公告)号：US5912507A
公开(公告)日：1999-06-15
申请号：US18363
申请日：1998-02-04
申请人： Gregory J. Dunn , Lawrence E. Lach , Daniel R. Gamota
发明人： Gregory J. Dunn , Lawrence E. Lach , Daniel R. Gamota
IPC分类号： H01L23/498 , H05K1/09 , H05K1/16 , H05K3/34 , H01L23/48
CPC分类号： H01L23/49811 , H05K1/167 , H01L2224/16225 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K1/095 , H05K2201/09481 , H05K2201/09763 , H05K2201/10734 , H05K3/3436
摘要： A microelectronic assembly, such as a surface-mount device or a ball-grid array (BGA) package, has one or more integral resistors. The integral resistors are incorporated into one or more of the microelectronic assembly's electrical leads or connections. The integral resistors preferably terminate in a solderable pad. For example, the BGA package may include an IC chip and interposer. A terminal is located on a surface of the IC chip, on a surface of the interposer, or on the surface of the substrate to which the BGA is mounted. An electrically-resistive material overlies the terminal and electrically couples the terminal to a bond pad, thereby defining an integral resistor. The integral resistors reduce electrical resonances and reflections that may otherwise degrade the signal integrity and reliability of the electrical system employing the device; hence, reduce or eliminate the requirement for discrete resistors for the microelectronic assembly.
摘要翻译：诸如表面贴装器件或球栅阵列（BGA）封装的微电子组件具有一个或多个积分电阻器。集成电阻器被并入到微电子组件的电引线或连接中的一个或多个中。整体电阻器优选地终止于可焊接焊盘中。例如，BGA封装可以包括IC芯片和插入器。端子位于IC芯片的表面上，在中介层的表面上，或位于安装有BGA的基板的表面上。电阻材料覆盖在端子上并将端子电耦合到接合焊盘，从而限定一个整体电阻器。积分电阻减少电共振和反射，否则可能会降低采用该器件的电气系统的信号完整性和可靠性; 因此，减少或消除了对于微电子组件的分立电阻器的要求。

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