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    • 31. 发明授权
    • Formation of graphene wafers on silicon substrates
    • 在硅衬底上形成石墨烯晶片
    • US07947581B2
    • 2011-05-24
    • US12538214
    • 2009-08-10
    • Ce Ma
    • Ce Ma
    • H01L21/20H01L21/36H01L21/00
    • H01L21/02381H01L21/02527H01L21/02612H01L29/1606Y10S977/734Y10S977/755Y10S977/844Y10S977/847
    • Processes for forming full graphene wafers on silicon or silicon-on-insulator substrates. The processes comprise formation of a metal carbide layer on the substrate and annealing of the metal carbide layer under high vacuum. For volatile metals, this annealing step results in volatilization of the metal species of the metal carbide layer and reformation of the carbon atoms into the desired graphene wafer. Alternatively, for non-volatile metals, the annealing step results in migration of the metal in the metal carbide layer to the top surface of the layer, thereby forming a metal rich top layer. The desired graphene layer is formed by the carbon atoms left at the interface with the metal rich top layer. The thickness of the graphene layer is controlled by the thickness of the metal carbide layer and by solid phase reactions.
    • 在硅或绝缘体上硅衬底上形成完整的石墨烯晶片的工艺。 该方法包括在基底上形成金属碳化物层,并在高真空下退火金属碳化物层。 对于挥发性金属,该退火步骤导致金属碳化物层的金属物质的挥发和将碳原子重新形成所需的石墨烯晶片。 或者,对于非挥发性金属,退火步骤导致金属碳化物层中的金属向层的顶表面迁移,从而形成富金属顶层。 所需的石墨烯层由与富金属顶层界面处留下的碳原子形成。 石墨烯层的厚度由金属碳化物层的厚度和固相反应控制。