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31. 发明授权

US08858755B2 Edge bevel removal apparatus and method 有权
标题翻译：边缘斜角去除装置及方法
公开(公告)号：US08858755B2
公开(公告)日：2014-10-14
申请号：US13595785
申请日：2012-08-27
申请人： Daniel Goodman , Arthur Keigler , Terry McElroy , Gary Boulet
发明人： Daniel Goodman , Arthur Keigler , Terry McElroy , Gary Boulet
IPC分类号： B44C1/22 , H01L21/67 , H01L21/02
CPC分类号： B44C1/22 , H01L21/02087 , H01L21/6708 , H01L21/6719 , Y10S134/902
摘要： A substrate edge bevel etch module for etching a material from a peripheral edge of a substrate with an etchant is described. The substrate edge bevel etch module includes a rotatable substrate holder having a support for a substrate, and a surface tension etch applicator comprising a wetted etching surface opposing a substrate surface proximate an edge of the substrate when the surface tension etch applicator is located proximate to the edge of the substrate. The surface tension etch applicator further includes an etchant dispensing portion, proximate the wetted etching surface, which dispenses an etchant in a region between the wetted etching surface and the substrate surface and wet at least a portion of the wetted etching surface and the substrate surface. A spacing between the wetted etching surface and the substrate surface is selected to retain the etchant using surface tension forces and form a meniscus there between.
摘要翻译：描述了用于用蚀刻剂从衬底的周边边缘蚀刻材料的衬底边缘斜面蚀刻模块。衬底边缘斜面蚀刻模块包括具有用于衬底的支撑件的可旋转衬底保持器，以及表面张力蚀刻施加器，当表面张力蚀刻施加器位于靠近衬底边缘时，该表面张力蚀刻施加器包括与靠近衬底的边缘的衬底表面相对的润湿蚀刻表面衬底的边缘。表面张力蚀刻施加器还包括蚀刻剂分配部分，靠近润湿的蚀刻表面，其在润湿的蚀刻表面和基底表面之间的区域中分配蚀刻剂，并湿润至少一部分润湿的蚀刻表面和基底表面。润湿的蚀刻表面和基底表面之间的间距被选择以使用表面张力保持蚀刻剂，并在其间形成弯液面。

32. 发明申请

US20130011225A1 SUBSTRATE LOADER AND UNLOADER HAVING A BERNOULLI SUPPORT 有权
标题翻译：具有BERNOULLI支持的基座装载机和卸载器
公开(公告)号：US20130011225A1
公开(公告)日：2013-01-10
申请号：US13279405
申请日：2011-10-24
申请人： Daniel Goodman , Arthur Keigler , Freman Fisher , David G. Guarnaccia
发明人： Daniel Goodman , Arthur Keigler , Freman Fisher , David G. Guarnaccia
IPC分类号： B25J15/06
CPC分类号： H01L21/67092 , H01L21/6838 , H01L21/68764 , H01L21/68785
摘要： A substrate chuck comprising a frame forming a support adapted to support an adhering surface thereon and a Bernoulli chuck surface coupled to the frame and adapted to support the substrate, the Bernoulli chuck surface being axially moveable relative to the support. The Bernoulli chuck surface has a first position adjacent the substrate with the substrate coupled to the adhering surface and wherein the Bernoulli chuck surface is moveable from the first position to a second position separating the substrate from the adhering surface without contact between the substrate and the Bernoulli chuck surface.
摘要翻译：一种基板卡盘，其包括形成支撑件的框架，所述支架适于支撑其上的粘合表面，以及联接到所述框架并适于支撑所述基板的伯努利卡盘表面，所述伯努利卡盘表面相对于所述支撑件可轴向移动。伯努利卡盘表面具有与衬底相邻的第一位置，衬底与粘合表面相连，并且其中伯努利卡盘表面可从第一位置移动到第二位置，从而将衬底与粘附表面分离，而基板和伯努利卡盘表面。

33. 发明申请

US20120308345A1 PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM 有权
标题翻译：平行单基板加工系统
公开(公告)号：US20120308345A1
公开(公告)日：2012-12-06
申请号：US13488090
申请日：2012-06-04
申请人： Arthur Keigler , Freeman Fisher , Daniel L. Goodman
发明人： Arthur Keigler , Freeman Fisher , Daniel L. Goodman
IPC分类号： B65G49/00
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A system for processing surfaces of substrates having a process module having a process module frame and a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A plurality of substrate holder assemblies, each having a number of substrate holders, each of which is removably coupled to the process module frame, each substrate holder configured to hold a substrate. The process module frame has alignment features aligning the substrate holders in the substrate holder assembly in repeatable alignment with respect to each of the process elements with each of the process elements located between the substrates. A loader module is configured to unload processed substrates from each of the substrate holder assemblies and load unprocessed substrates to each of the substrate holder assemblies. A transporter is configured to transport the substrate holder assemblies to and from the process module and the loader module.
摘要翻译：一种用于处理具有处理模块的基板的表面的系统，该处理模块具有处理模块框架和多个处理元件，以在不接触基板表面的情况下处理基板表面。多个衬底保持器组件，每个衬底保持器组件具有多个衬底保持器，每个衬底保持器可移除地联接到过程模块框架，每个衬底保持器被构造成保持衬底。过程模块框架具有对准特征，其中衬底保持器组件中的衬底保持器相对于每个工艺元件可重复地对准，每个工艺元件位于衬底之间。装载器模块被配置为从每个基板保持器组件卸载经处理的基板，并且将未处理的基板装载到每个基板保持器组件。传送器构造成将基板保持器组件传送到过程模块和加载器模块。

34. 发明申请

US20120308344A1 PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM 有权
标题翻译：平行单基板加工系统
公开(公告)号：US20120308344A1
公开(公告)日：2012-12-06
申请号：US13488297
申请日：2012-06-04
申请人： Arthur Keigler
发明人： Arthur Keigler
IPC分类号： B25J11/00
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A system for fluid processing substrate surfaces arrayed in a fluid having a process section with a frame having a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces; and a substrate holder assembly having a number of substrate holders and configured for transporting substrates as a unit. The substrate holder assembly and each of the substrate holders are configured for removable coupling to the process section frame, each substrate holder configured to hold at least one of the substrates. The process section frame has alignment features disposed so that, on coupling of the substrate holder assembly with the process section frame, the alignment features interface with each substrate holder of the substrate holder assembly and locate each substrate holder in repeatable alignment, at corresponding coupling of each substrate holder and the process section frame, with respect to a predetermined feature of the process section.
摘要翻译：一种用于流体处理衬底表面的系统，其布置在具有处理部分的流体中，所述工艺部分具有框架，所述框架具有多个处理元件以处理所述衬底表面而不接触所述衬底表面; 以及具有多个基板保持器并且被配置为作为一个单元输送基板的基板保持器组件。衬底保持器组件和每个衬底保持器被构造成用于可移除地连接到工艺段框架，每个衬底保持器被配置成保持至少一个衬底。处理部分框架具有对准特征，其布置成使得在衬底保持器组件与过程部分框架的联接时，对准特征与衬底保持器组件的每个衬底保持器接合并且将每个衬底保持器定位成可重复对准，每个衬底保持器和处理部分框架相对于处理部分的预定特征。

35. 发明申请

US20120306139A1 PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM HOLDER 审中-公开
标题翻译：平行单基板加工系统支架
公开(公告)号：US20120306139A1
公开(公告)日：2012-12-06
申请号：US13488407
申请日：2012-06-04
申请人： Arthur Keigler , Freeman Fisher , Mehran Asdigha
发明人： Arthur Keigler , Freeman Fisher , Mehran Asdigha
IPC分类号： H01L21/687
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A substrate holder adapted to hold and retain a substrate during vertical fluid processing of a surface of the substrate. The wafer holder has a frame. A first leg is coupled to the frame by a first compliant flexure, the first leg having a first contact member configured to engage a first edge of the substrate. A second leg is coupled to the frame by a second compliant flexure, the second leg having a second contact member configured to engage a second edge of the substrate. Upon deflection of the first and second compliant flexures, the first and second legs are moveable in substantially opposite directions disengaging the first and second contact fingers from the first and second edges of the substrate respectively.
摘要翻译：衬底保持器，适于在衬底的表面的垂直流体处理期间保持和保持衬底。晶片架具有框架。第一腿通过第一柔顺弯曲部联接到框架，第一腿部具有构造成接合衬底的第一边缘的第一接触构件。第二腿通过第二柔顺弯曲部联接到框架，第二腿具有构造成接合衬底的第二边缘的第二接触构件。在第一和第二柔性弯曲部偏转时，第一和第二腿部可以基本上相反的方向移动，从而分别使第一和第二接触指与基板的第一和第二边缘分离。

36. 发明申请

US20120298504A1 Electro chemical deposition and replenishment apparatus 有权
标题翻译：电化学沉积和补充装置
公开(公告)号：US20120298504A1
公开(公告)日：2012-11-29
申请号：US13445457
申请日：2012-04-12
申请人： David Guarnaccia , Arthur Keigler , Demetrius Papapanayiotou , Johannes Chiu
发明人： David Guarnaccia , Arthur Keigler , Demetrius Papapanayiotou , Johannes Chiu
IPC分类号： C25B9/08
CPC分类号： C25D21/22 , C25D7/123 , C25D17/001 , C25D17/002
摘要： An electrochemical deposition apparatus adapted to deposit metal onto a surface of a substrate, the apparatus has a frame configured for holding a process electrolyte. A substrate holder is removably coupled to the frame, the substrate holder supporting the substrate in the process electrolyte. An anode fluid compartment is removably coupled to the frame and containing an anolyte and having an anode facing the surface of the substrate, the anode fluid compartment further having a ion exchange membrane disposed between the anode and the surface of the substrate, the anode fluid compartment removable from the frame as a unit with the ion exchange membrane and the anode. The holder, the anode and the membrane are arranged in the frame so that ions from the anode pass through the ion exchange membrane into and primarily replenish ions in the process electrolyte depleted by ion deposition onto the surface of the substrate.
摘要翻译：一种适于将金属沉积在基底表面上的电化学沉积装置，该装置具有构造成保持工艺电解质的框架。衬底保持器可移除地联接到框架，衬底保持器将衬底支撑在处理电解质中。阳极流体隔室可拆卸地联接到框架并且包含阳极电解液并且具有面向基底表面的阳极，阳极流体隔室还具有设置在阳极和基底表面之间的离子交换膜，阳极流体隔室作为与离子交换膜和阳极的单元从框架中移除。保持器，阳极和膜被布置在框架中，使得来自阳极的离子通过离子交换膜进入并且主要补充通过离子沉积耗尽的工艺电解质中的离子到衬底的表面上。

37. 发明授权

US08168057B2 Balancing pressure to improve a fluid seal 有权
标题翻译：平衡压力以改善流体密封
公开(公告)号：US08168057B2
公开(公告)日：2012-05-01
申请号：US12790264
申请日：2010-05-28
申请人： Arthur Keigler , Qunwei Wu , Zhenqiu Liu , John Harrell
发明人： Arthur Keigler , Qunwei Wu , Zhenqiu Liu , John Harrell
IPC分类号： C25D5/02
CPC分类号： H01L21/67126 , C25D5/003 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/67023
摘要： A method of fluid sealing a workpiece is provided. The method includes providing a force to cause a ring to form a barrier to fluid entry with the workpiece and preventing fluid from crossing the barrier to fluid entry by forming a pressure differential across the barrier.
摘要翻译：提供了流体密封工件的方法。该方法包括提供一个力，以使环形成与流体进入工件的阻挡层，并且通过在该屏障上形成一个压差来防止流体穿过该屏障穿过该流体入口。

38. 发明申请

US20110139627A1 METHOD AND APPARATUS FOR FLUID PROCESSING A WORKPIECE 有权
标题翻译：流体加工工艺的方法和装置
公开(公告)号：US20110139627A1
公开(公告)日：2011-06-16
申请号：US12963991
申请日：2010-12-09
申请人： Arthur Keigler , John Harrell , Zhenqiu Liu , Qunwei Wu
发明人： Arthur Keigler , John Harrell , Zhenqiu Liu , Qunwei Wu
IPC分类号： C25D7/12
CPC分类号： C25D17/001 , C25D5/003 , C25D7/123 , C25D17/005 , C25D17/06 , C25D21/10 , C25D21/12 , H01L21/67023 , H01L21/67126
摘要： A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation.
摘要翻译：一种流体处理半导体工件的方法，包括将具有能够容纳流体的壳体布置在工件夹持器上，保持工件的工件保持器，提供连接到壳体的搅拌系统，并且包括设置在壳体内的邻近工件保持器的构件并且通过以非均匀的振荡运动基本上平行于工件的表面移动构件来搅动流体，该非均匀振荡运动是一系列基本上连续的几何非对称振荡，其中该系列的每个连续振荡是几何不对称的具有至少两个基本上连续的相对冲程，其中基本上连续的不对称振荡的每个基本上连续行程的反转位置相对于振荡的每个紧接在前的基本上连续的行程的中心点非对称地设置。

39. 发明授权

US07100954B2 Ultra-thin wafer handling system 有权
标题翻译：超薄晶圆处理系统
公开(公告)号：US07100954B2
公开(公告)日：2006-09-05
申请号：US10618091
申请日：2003-07-11
申请人： Martin P. Klein , Arthur Keigler , David Felsenthal
发明人： Martin P. Klein , Arthur Keigler , David Felsenthal
IPC分类号： B66C1/02
CPC分类号： H01L21/6838
摘要： An improved Bernoulli end effector for holding, handling, and transporting ultra-thin substrates includes edge guides to aid in the positioning of the substrate and may include friction pads that impede motion of the substrate lifted by the end effector. The Bernoulli end effector may be incorporated into an apparatus and method for supinating a substrate so that both surfaces of the substrate can be processed. In addition, the Bernoulli end effector may be used to place ultra-thin substrates on and retrieve substrates from a substrate handling structure that includes weights that prevent the substrates from bowing or flexing during processing and includes guides that prevent the ultra-thin substrates from moving or translating on the surface of the substrate handling structure.
摘要翻译：用于保持，处理和运输超薄基板的改进的伯努利端部执行器包括边缘引导件以帮助基板的定位，并且可以包括妨碍由末端执行器提升的基板的运动的摩擦垫。伯努利末端执行器可以结合到用于使衬底延伸的装置和方法中，使得可以处理衬底的两个表面。此外，伯努利末端执行器可用于将超薄基板放置在基板处理结构上并从基板处理结构回收基板，该基板处理结构包括在加工期间防止基板弯曲或弯曲的重量，并且包括防止超薄基板移动的引导件或在基板处理结构的表面上平移。

40. 发明授权

US07067045B2 Method and apparatus for sealing electrical contacts during an electrochemical deposition process 失效
标题翻译：在电化学沉积过程中密封电接点的方法和装置
公开(公告)号：US07067045B2
公开(公告)日：2006-06-27
申请号：US10274722
申请日：2002-10-18
申请人： Arthur Keigler , Harald Herchen , Vincent E. Burkhart , Son N. Trinh
发明人： Arthur Keigler , Harald Herchen , Vincent E. Burkhart , Son N. Trinh
IPC分类号： C25B9/02
CPC分类号： C25D17/06 , C25D7/123 , C25D17/004
摘要： An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust plate assembly adapted to exert a downward force on the substrate. For some embodiments, a first sealing member adapted to engage a plating surface of the substrate may be attached to the substrate support member. The apparatus may also include a second sealing member adapted to engage a non-plating surface of the substrate or a surface of the substrate support member to prevent the flow of plating fluid to a non-plating surface of the substrate. The apparatus may also include electrical contacts to electrically contact the plating or non-plating surface of the substrate.
摘要翻译：提供了一种用于将基板固定在电化学沉积系统中的装置。该装置通常包括适于接收基板的基板支撑构件和适于在基板上施加向下的力的推力板组件。对于一些实施例，适于接合衬底的电镀表面的第一密封构件可以附接到衬底支撑构件。该装置还可以包括适于接合基板的非电镀表面或基板支撑构件的表面的第二密封构件，以防止电镀液体流到基板的非电镀表面。该设备还可以包括电接触以电接触衬底的镀层或非电镀表面。

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