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31. 发明授权

US08835202B2 Structure and method for LED with phosphor coating 有权
标题翻译： LED与荧光粉涂层的结构和方法
公开(公告)号：US08835202B2
公开(公告)日：2014-09-16
申请号：US14140906
申请日：2013-12-26
申请人： TSMC Solid State Lighting Ltd.
发明人： Chi Xiang Tseng , Hsiao-Wen Lee , Tien-Ming Lin , Min-Sheng Wu
IPC分类号： H01L21/00 , H01L33/50
CPC分类号： H01L33/505 , H01L27/153 , H01L33/504 , H01L33/508 , H01L2933/0041
摘要： The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.
摘要翻译：本公开提供了一种发光二极管（LED）装置。 LED装置包括具有顶表面的LED发射器; 以及设置在LED发射器上的荧光体特征。荧光体特征包括设置在LED发射器的顶表面上并具有在平行于LED发射器的顶表面的方向上限定的第一尺寸的第一荧光膜; 第二荧光体膜，设置在所述第一荧光膜上并具有沿所述方向限定的第二尺寸; 并且第二尺寸基本上小于第一尺寸。

32. 发明申请

US20140252380A1 Shadow Mask Assembly 有权
标题翻译：阴影面具装配
公开(公告)号：US20140252380A1
公开(公告)日：2014-09-11
申请号：US13792136
申请日：2013-03-10
申请人： TSMC SOLID STATE LIGHTING LTD.
发明人： Ming-Shing Lee , Chyi-Shyuan Chern , Hsin-Hsien Wu , Yung-Chang Chen , Ming-Hua Lo , Chu-Ching Tsai
IPC分类号： H01L33/08
CPC分类号： H01L33/08 , C23C4/01 , H01L21/00 , H01L21/68721 , H01L2933/0041
摘要： A shadow mask assembly includes a securing assembly configured to hold a substrate that is configured to hold a plurality of dies. The securing assembly includes a number of guide pins and a shadow mask comprising holes for the guide pins, said holes allowing the guide pins freedom of motion in one direction. The securing assembly includes a number of embedded magnets configured to secure the shadow mask to the securing assembly.
摘要翻译：荫罩组件包括固定组件，其被配置为保持构造成保持多个模具的衬底。固定组件包括多个引导销和一个包括用于引导销的孔的荫罩，所述孔允许导销在一个方向上自由运动。固定组件包括多个嵌入式磁体，其构造成将荫罩固定到固定组件。

33. 发明授权

US08815618B2 Light-emitting diode on a conductive substrate 有权
标题翻译：导电基板上的发光二极管
公开(公告)号：US08815618B2
公开(公告)日：2014-08-26
申请号：US12541787
申请日：2009-08-14
申请人： Ding-Yuan Chen , Chen-Hua Yu , Wen-Chih Chiou
发明人： Ding-Yuan Chen , Chen-Hua Yu , Wen-Chih Chiou
IPC分类号： H01L33/00 , H01L21/78
CPC分类号： H01L33/0062 , H01L21/78 , H01L33/0066 , H01L33/0079 , H01L2924/01078 , H01S5/1231 , H01S5/2275
摘要： A light-emitting diode (LED) device is provided. The LED device is formed by forming an LED structure on a first substrate. A portion of the first substrate is converted to a porous layer, and a conductive substrate is formed over the LED structure on an opposing surface from the first substrate. The first substrate is detached from the LED structure along the porous layer and any remaining materials are removed from the LED structure.
摘要翻译：提供了一种发光二极管（LED）装置。 LED器件通过在第一衬底上形成LED结构而形成。将第一衬底的一部分转换成多孔层，并且在与第一衬底相对的表面上的LED结构上形成导电衬底。第一衬底沿着多孔层与LED结构分离，并且从LED结构中去除任何剩余的材料。

34. 发明授权

US08783911B2 LED packaging structure having improved thermal dissipation and mechanical strength 有权
标题翻译： LED封装结构具有改善的散热和机械强度
公开(公告)号：US08783911B2
公开(公告)日：2014-07-22
申请号：US13399027
申请日：2012-02-17
申请人： Yi-Tsuo Wu
发明人： Yi-Tsuo Wu
IPC分类号： F21V29/00
CPC分类号： F21V29/70 , F21K9/20 , F21Y2115/10 , H01L2224/48091 , H01L2224/48137 , H01L2224/8592 , H01L2924/00014
摘要： The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate.
摘要翻译：本公开涉及一种照明装置。照明装置包括导热基板。导热基板可以包括基板。照明装置还包括印刷电路板（PCB）。 PCB位于导热基板之外。 PCB和导热基板具有不同的材料组成。照明装置还包括位于导热基板上的光子器件。光子器件可以包括发光二极管（LED）裸片。光子器件热耦合到导热基底。光子器件电耦合到印刷电路板。照明装置还包括散热结构。散热结构热耦合到导热基板。

35. 发明申请

US20140184081A1 Color Temperature Adjustment for LED Lamps Using Switches 有权
标题翻译：使用开关的LED灯的色温调整
公开(公告)号：US20140184081A1
公开(公告)日：2014-07-03
申请号：US14197288
申请日：2014-03-05
申请人： TSMC Solid State Lighting Ltd.
发明人： Wei-Yu Yeh , Chih-Hsuan Sun
IPC分类号： H05B33/08
CPC分类号： H05B33/0863 , H05B33/0824 , H05B33/0869
摘要： A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time.
摘要翻译：发光二极管（LED）灯包括许多不同颜色的LED，可以使用可由用户操作的外部开关以不同的组合打开和关闭。用户或控制器可以调节灯输出的光的色温。色温变化可能是用户偏好，并且可以补偿随时间降低的磷光体效率。

36. 发明授权

US08757845B2 Wide angle based indoor lighting lamp 有权
标题翻译：广角室内照明灯
公开(公告)号：US08757845B2
公开(公告)日：2014-06-24
申请号：US13194538
申请日：2011-07-29
申请人： Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
发明人： Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
IPC分类号： F21V7/07
CPC分类号： F21K9/50 , F21K9/60 , F21K9/90 , F21V3/02 , F21V3/0625 , F21V5/008 , F21V5/04 , F21V7/0091 , F21V29/77 , F21V29/89 , F21Y2115/10 , H01L33/58 , H01L2933/0091 , Y10T29/49826
摘要： The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.
摘要翻译：本公开提供了照明结构的一个实施例。照明结构包括在基板上的发光二极管（LED）装置; 固定在基板上并在LED器件上方的透镜; 以及固定在所述基板上并覆盖所述透镜的散射器盖，其中所述透镜和扩散器盖被设计和配置为重新分配来自所述LED装置的光以用于广角照明。

37. 发明申请

US20140151740A1 Micro-Structure Phosphor Coating 审中-公开
标题翻译：微结构荧光粉涂层
公开(公告)号：US20140151740A1
公开(公告)日：2014-06-05
申请号：US14174891
申请日：2014-02-07
申请人： TSMC Solid State Lighting Ltd.
发明人： Chi Xiang Tseng , Hsiao-Wen Lee
IPC分类号： H01L33/50
CPC分类号： H01L33/505 , H01L33/54 , H01L2224/14 , H01L2933/0041
摘要： An optical emitter includes micro-structure phosphor coating on a light-emitting diode die mounted on a package substrate. The micro-structures are transferred onto a micro-structure phosphor coating precursor by patterning and curing the precursor or by curing the precursor through a mold. The micro-structures are half spheroids, three-sided pyramids, or six-sided pyramids.
摘要翻译：光发射器包括安装在封装衬底上的发光二极管管芯上的微结构磷光体涂层。通过图案化和固化前体或通过模具固化前体将微结构转移到微结构荧光体涂层前体上。微结构是半球体，三面体金字塔或六边形金字塔。

38. 发明授权

US08742441B2 Light-emitting diode with embedded elements 有权
标题翻译：具有嵌入元件的发光二极管
公开(公告)号：US08742441B2
公开(公告)日：2014-06-03
申请号：US12547428
申请日：2009-08-25
申请人： Ding-Yuan Chen , Wen-Chih Chiou , Chen-Hua Yu
发明人： Ding-Yuan Chen , Wen-Chih Chiou , Chen-Hua Yu
IPC分类号： H01L29/72
CPC分类号： H01L33/44 , H01L33/08 , H01L33/20
摘要： A light-emitting diode (LED) device is provided. The LED device has a substrate and an LED structure overlying the substrate. Embedded elements are embedded within one or more layers of the LED structure. In an embodiment, the embedded elements include a dielectric material extending through the LED structure such that the embedded elements are surrounded by the LED structure. In another embodiment, the embedded elements only extend through an upper layer of the LED structure, or alternatively, partially through the upper layer of the LED structure. Another conductive layer may be formed over the upper layer of the LED structure and the embedded elements.
摘要翻译：提供了一种发光二极管（LED）装置。 LED器件具有衬底和覆盖衬底的LED结构。嵌入式元件嵌入LED结构的一层或多层内。在一个实施例中，嵌入元件包括延伸穿过LED结构的电介质材料，使得嵌入元件被LED结构包围。在另一个实施例中，嵌入式元件仅延伸穿过LED结构的上层，或者部分地穿过LED结构的上层。另外的导电层可以形成在LED结构的上层和嵌入元件上。

39. 发明授权

US08729591B2 Opto-electronic device package with a semiconductor-based sub-mount having SMD metal contacts 有权
标题翻译：具有半导体基座的光电器件封装，具有SMD金属触点
公开(公告)号：US08729591B2
公开(公告)日：2014-05-20
申请号：US12426796
申请日：2009-04-20
申请人： Jochen Kuhmann , Lior Shiv
发明人： Jochen Kuhmann , Lior Shiv
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L23/13 , H01L23/147 , H01L23/49827 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： Non-planar via designs for sub-mounts on which to mount a LED or other optoelectronic device include a continuous layer of metal to conduct the current from the front-side (e.g., LED side) to the backside (e.g., SMD side) through the via and to provide a sufficiently stable and reliable under bump metallization for SMD soldering. Each UBM can be structured so that it does not fully cover the sidewall surfaces of the via that forms the front-to-backside interconnect. In some implementations, each via structure for the feedthrough metallization extends to a respective side-edge of the sub-mount.
摘要翻译：用于安装LED或其他光电子器件的子安装座的非平面通孔设计包括连续的金属层，以将电流从前侧（例如，LED侧）传导到背面（例如，SMD侧）通孔，并为SMD焊接提供足够稳定和可靠的凸块下金属化。每个UBM可以被构造成使得其不完全覆盖形成前后互连的通孔的侧壁表面。在一些实施方案中，用于馈通金属化的每个通孔结构延伸到子安装座的相应侧边缘。

40. 发明申请

US20140078757A1 High Voltage LED with Improved Heat Dissipation and Light Extraction 有权
标题翻译：高压LED具有改进的散热和光提取
公开(公告)号：US20140078757A1
公开(公告)日：2014-03-20
申请号：US13790092
申请日：2013-03-08
申请人： TSMC SOLID STATE LIGHTING LTD.
发明人： Kuan-Chun Chen , Hao-Chung Kuo , You-Da Lin , Zhen-Yu Li
IPC分类号： H01L33/64 , F21V21/00
CPC分类号： H01L25/0753 , F21S6/00 , F21V3/049 , F21V7/22 , F21V21/00 , F21V29/74 , F21V29/89 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L27/156 , H01L33/0079 , H01L33/06 , H01L33/20 , H01L33/24 , H01L33/32 , H01L33/36 , H01L33/502 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： The present disclosure involves a lighting apparatus. The lighting apparatus includes a polygon die. The polygon die includes a plurality of light-emitting diodes (LEDs). Each LED includes a plurality of epi-layers, the epi-layers containing a p-type layer, an n-type layer, and a multiple quantum well (MQW) disposed between the p-type layer and the n-type layer. Each LED includes a p-type electrode and an n-type electrode electrically coupled to the p-type layer and the n-type layer, respectively. The polygon die also includes a submount to which each of the LEDs is coupled. The p-type and the n-type electrodes are located between the submount and the epi-layers. The submount contains a plurality of conductive elements configured to electrically couple at least a portion of the plurality of LEDs in series.
摘要翻译：本公开涉及一种照明装置。照明装置包括多边形模具。多边形管芯包括多个发光二极管（LED）。每个LED包括多个外延层，外延层包含设置在p型层和n型层之间的p型层，n型层和多量子阱（MQW）。每个LED包括分别电耦合到p型层和n型层的p型电极和n型电极。多边形管芯还包括每个LED耦合到的基座。 p型和n型电极位于底座和外延层之间。底座包含多个导电元件，其被配置为将多个LED的至少一部分串联耦合。

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