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    • 25. 发明申请
    • Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system comprising an integrated circuit obtained by means of the method
    • 制造集成电路的方法,根据所述方法获得的集成电路,提供有根据该方法获得的集成电路的晶片,以及包括通过该方法获得的集成电路的系统
    • US20030075741A1
    • 2003-04-24
    • US10253235
    • 2002-09-24
    • Anton Petrus Maria Van ArendonkEdwin RoksAdrianus Johannes Mierop
    • H01L027/148
    • G01R31/318505G01R31/318511G01R31/3187
    • The invention relates to a method of manufacturing an integrated circuit (404) on a die (402), wherein the die (402) forms a detachable part of a wafer (401) comprising a plurality of dies that are separated from each other by dicing lanes (403). The method comprises a step of applying a metallization pattern (407) in at least one of the dicing lanes (403) to form a communication bus comprising at least one communication bus circuit (405) that is part of the integrated circuit (404). Said step is followed by a step wherein the integrated circuit (404) is tested according to a predetermined testing method which uses the communication bus circuit (405) to communicate with the integrated circuit (404). This step is followed by a next step wherein the die (402) is detached from the wafer (401). The communication bus circuit (405) is designed so as to communicate in a wafer test mode as well as in a functional mode. During the testing of the integrated circuit (404), it communicates in the wafer test mode. The invention also relates to an integrated circuit (404) obtained by means of the manufacturing method, a wafer (401) comprising an integrated circuit (404) obtained by means of the manufacturing method, and a system comprising an integrated circuit (404) obtained by means of the manufacturing method.
    • 本发明涉及在芯片(402)上制造集成电路(404)的方法,其中模具(402)形成晶片(401)的可拆卸部分,该晶片包括通过切割相互分离的多个管芯 车道(403)。 该方法包括在至少一个切割通道(403)中施加金属化图案(407)以形成包括作为集成电路(404)的一部分的至少一个通信总线电路(405)的通信总线的步骤。 所述步骤之后是其中根据使用通信总线电路(405)与集成电路(404)通信的预定测试方法测试集成电路(404)的步骤。 该步骤之后是其中模具(402)与晶片(401)分离的下一步骤。 通信总线电路(405)被设计成在晶片测试模式以及功能模式下进行通信。 在集成电路(404)的测试期间,它以晶片测试模式进行通信。 本发明还涉及通过制造方法获得的集成电路(404),包括通过制造方法获得的集成电路(404)的晶片(401)和包括获得的集成电路(404)的系统, 通过制造方法。
    • 26. 发明申请
    • Fast line dump structure for solid state image sensor
    • 用于固态图像传感器的快速线路转储结构
    • US20030067019A1
    • 2003-04-10
    • US10293672
    • 2002-11-13
    • Eric G. Stevens
    • H01L027/148
    • H01L29/76816H01L27/14806H01L27/14887
    • The present invention is a structure for a fast-dump gate (FDG) and a fast-dump drain (FDD) for a charge coupled device. It is envisioned that the charge coupled device be a horizontal readout register of a solid-state image sensor. This structure uses a third layer of polysilicon (or other suitable gate material) to form the fast-dump gate which is in addition to the other two layers of gate material used to form the gates in the horizontal readout register. This allows the channel region under the fast-dump gate (FDG) to form without the use of highly-doped channel stop regions thereby eliminating any potential wells or barriers that may result in transfer inefficiency often time found with other structures.
    • 本发明是用于电荷耦合器件的快速转储门(FDG)和快速泄放漏极(FDD)的结构。 可以设想,电荷耦合器件是固态图像传感器的水平读出寄存器。 该结构使用第三层多晶硅(或其他合适的栅极材料)形成快速转储栅极,除了用于在水平读出寄存器中形成栅极的另外两层栅极材料之外。 这允许在快速转储门(FDG)下形成通道区而不使用高度掺杂的通道停止区,从而消除任何潜在的井或障碍物,其通常可能导致与其他结构发现的转移效率低下。
    • 29. 发明申请
    • Charge-coupled device
    • 电荷耦合器件
    • US20020175350A1
    • 2002-11-28
    • US10055343
    • 2002-01-22
    • Jan Theodoor Jozef BosiersAgnes Catharina Maria KleimannYvonne Astrid Boersma
    • H01L027/148H01L029/768H01L031/113
    • H01L29/76816H01L27/148
    • The invention relates to a CCD of the buried-channel type comprising a charge-transport channel in the form of a zone (12) of the first conductivity type, for example the n-type, in a well (13) of the opposite conductivity type, in the example the p-type. In order to obtain a drift field in the channel below one or more gates (9, 10a) to improve the charge transfer, the well is provided with a doping profile, so that the average concentration decreases in the direction of charge transport. Such a profile can be formed by covering the area of the well during the well implantation with a mask, thereby causing fewer ions to be implanted below the gates (9, 10a) than below other parts of the channel. By virtue of the invention, it is possible to produce a gate (10a) combining a comparatively large length, for example in the output stage in front of the output gate (9) to obtain sufficient storage capacity, with a high transport rate.
    • 本发明涉及一种埋入通道型的CCD,其包括形成第一导电类型的区域(12)形式的电荷传输通道,例如n型,在相反电导率的阱(13)中 类型,在示例中为p型。 为了获得在一个或多个栅极(9,10a)下方的通道中的漂移场以改善电荷转移,阱具有掺杂分布,使得平均浓度在电荷传输方向上减小。 这样的形状可以通过用掩模在阱注入期间覆盖阱的区域来形成,从而在栅极(9,10a)下面比在通道的其它部分下方注入更少的离子。 根据本发明,可以产生组合比较大长度的门(10a),例如在输出门(9)前面的输出级中以高传输速率获得足够的存储容量。