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21. 发明申请

US20010050429A1 Method and apparatus for surface mounted power transistor with heat sink 有权
标题翻译：具有散热片的表面贴装功率晶体管的方法和装置
公开(公告)号：US20010050429A1
公开(公告)日：2001-12-13
申请号：US09747599
申请日：2000-12-22
申请人： Texas Instruments Incorporated
发明人： Glynn Russell Ashdown
IPC分类号： H01L023/10 , H01L023/34
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A surface mounted power transistor is provided with a heat sink by positioning a mounting plate of a heat sink between the power transistor and a solder pad on the circuit board. The mounting plate of the heat sink is provided with a plurality of openings through which the solder of the solder pad flows during the solder reflow process so that the mounting plate is securely adhered between the power transistor and the circuit board. The mounting plate of the heat sink is connected thermally to an extension member which extends generally perpendicular to the mounting plate, the extension member in turn being connected to a heat dissipation surface which may be one or several fins.
摘要翻译：表面安装的功率晶体管通过将散热器的安装板定位在功率晶体管和电路板上的焊盘之间而设置有散热器。散热器的安装板设置有多个开口，焊料焊料的焊料在焊料回流工艺期间流过该开口，使得安装板牢固地粘附在功率晶体管和电路板之间。散热器的安装板热量连接到大致垂直于安装板延伸的延伸构件，延伸构件又连接到可以是一个或多个翅片的散热表面。

22. 发明申请

US20010038146A1 High-frequency circuit and its module for communication devices 有权
标题翻译：高频电路及其通信设备模块
公开(公告)号：US20010038146A1
公开(公告)日：2001-11-08
申请号：US09842243
申请日：2001-04-25
发明人： Junichi Shimizu
IPC分类号： H01L029/40 , H01L023/48 , H01L023/52 , H01L023/10
CPC分类号： G02F1/0123 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2224/48091 , H01L2224/48195 , H01L2224/48225 , H01L2224/48227 , H01L2224/4911 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01032 , H01L2924/01057 , H01L2924/01072 , H01L2924/01077 , H01L2924/12042 , H01L2924/1903 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A high-frequency circuit is provided, which makes it possible to prevent degradation of its high-frequency characteristic even if the lengths of bonding wires used are not decreased. This circuit comprises: (a) an electronic element having a capacitance; (b) a signal line for transmitting a high-frequency electric signal to the element; (c) a terminating resistor for impedance matching; (d) a first bonding wire for electrically connecting the signal line and the element; and (e) a second bonding wire for electrically connecting the element and the resistor. A characteristic impedance of combination of the element and the first and second bonding wires is equal to or greater than that of input side of the electric signal with respect to the combination. An inductance of the second wire is greater than that of the first wire. Preferably, at least one of the lengths of the first and second bonding wires is decreased, which enhances the advantage of the high-frequency circuit.
摘要翻译：提供了一种高频电路，即使不降低使用的接合线的长度，也能够防止其高频特性的劣化。该电路包括：（a）具有电容的电子元件; （b）用于向所述元件发送高频电信号的信号线; （c）用于阻抗匹配的终端电阻器; （d）用于电连接所述信号线和所述元件的第一接合线; 和（e）用于电连接元件和电阻器的第二接合线。元件与第一和第二接合线的组合的特征阻抗等于或大于相对于组合的电信号的输入侧的特性阻抗。第二线的电感大于第一线的电感。优选地，第一和第二接合线的长度中的至少一个减小，这增强了高频电路的优点。

23. 发明申请

US20010035577A1 HEAT DISSIPATING MICROELECTRONIC PACKAGE 有权
标题翻译：散热微电子封装
公开(公告)号：US20010035577A1
公开(公告)日：2001-11-01
申请号：US09146695
申请日：1998-09-03
发明人： SALMAN AKRAM
IPC分类号： H01L023/10 , H01L023/34 , H01L023/28
CPC分类号： H01L23/24 , H01L23/36 , H01L23/3675 , H01L23/4951 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/85399 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/07802 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A novel package comprising a die and metal housing arrangement is provided that improves conduction of heat away from the die during use. The housing is a heat block and is abutted against the die in a thermally conductive manner. The heat block has a large thermal mass as compared to the die and is a substantially rectangular in cross section. A cavity is formed in the heat block for receiving the die. In one embodiment, the cavity is substantially rectangular in cross section and is bound on three sides by a wall and open on the fourth side. In another embodiment, the cavity is substantially rectangular and bound on all four sides by a wall. In both embodiments, the cavity is slightly larger than the perimeter of the die and the walls are arranged to be in close proximity with the die during use. A metal lid is provided for at least partially covering the die and for thermally conductively attaching to the die to even further facilitate heat transfer. The lid either has holes or is solid to, respectively, allow an electrical lead frame to pass through or underneath the lid. A metal socket is provided to align the package to a circuit by matingly receiving the lead frame in a channel. The channel either allows direct passage therethrough of the lead frame or is electrically coupled to a socket pin. The socket may be configured with a plurality of heat sinks that thermally conductively contact the socket and the heat block of the package.
摘要翻译：提供了一种包括模具和金属壳体布置的新型封装，其在使用期间改善了远离模具的热传导。壳体是热块，并以导热方式抵靠模具。与模具相比，热块具有大的热质量，并且是截面基本上矩形的。在加热块中形成用于接收管芯的空腔。在一个实施例中，空腔的横截面基本上是矩形，并且在三面上被墙壁结合并在第四面上打开。在另一个实施例中，腔体基本上是矩形的，并且在所有四个侧面上被壁限定。在两个实施例中，空腔略大于模具的周边，并且壁被布置成在使用期间与模具紧密接近。金属盖被设置用于至少部分地覆盖模具并且用于导热地附接到模具以进一步促进热传递。盖子有孔或者是固体的，分别允许电引线框架通过盖子或盖子下方。提供金属插座以通过在通道中配合地接收引线框架来将封装对准电路。该通道允许引线框架的直接通过，或者电连接到插座销。插座可以配置有多个散热器，其热传导地接触插座和封装的热块。

24. 发明申请

US20010023970A1 Semiconductor device package and optical communication device 失效
标题翻译：半导体器件封装和光通信器件
公开(公告)号：US20010023970A1
公开(公告)日：2001-09-27
申请号：US09811514
申请日：2001-03-20
发明人： Masanori Iida , Hiroyuki Asakura
IPC分类号： H01L031/0232 , H01L031/0203 , H01L023/10 , H01L023/34
CPC分类号： H01L31/0203 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： A semiconductor device package, has a heat radiating base that has a depression; a circuit substrate disposed on the heat radiating base so as to cover at least the depression; and at least two semiconductor devices at least one of which is mounted on each of one and the other major surfaces of the circuit substrate, wherein the semiconductor device mounted on one major surface of the circuit substrate coupled to the heat radiating base is disposed in the depression, and is coupled to at least a part of the depression with good thermal conductivity.
摘要翻译：半导体器件封装具有具有凹陷的散热基座; 设置在所述散热基底上以至少覆盖所述凹部的电路基板; 以及至少两个半导体器件，其中至少一个安装在电路衬底的一个和另一个主表面中的每一个上，其中安装在耦合到散热基座的电路基板的一个主表面上的半导体器件设置在并且与至少一部分具有良好导热性的凹陷结合。

25. 发明申请

US20010015492A1 Packaged die on pcb with heat sink encapsulant 有权
标题翻译：带有散热封装的pcb封装模具
公开(公告)号：US20010015492A1
公开(公告)日：2001-08-23
申请号：US09835541
申请日：2001-04-16
发明人： Salman Akram , James M. Wark
IPC分类号： H01L023/10 , H01L021/44 , H01L021/48
CPC分类号： H01L24/85 , H01L21/563 , H01L23/3121 , H01L23/3128 , H01L23/3135 , H01L23/3157 , H01L23/42 , H01L23/4334 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/97 , H01L25/0655 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/484 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/75 , H01L2224/81801 , H01L2224/83951 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01031 , H01L2924/01032 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15192 , H01L2924/181 , H01L2224/85 , H01L2224/81 , H01L2924/00011 , H01L2224/78 , H01L2224/45099 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/85399
摘要： An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface (nullopposing surfacenull) opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.
摘要翻译：一种通过在其上放置形成球顶部的一部分的散热材料在半导体芯片的上表面上提供散热器的装置和方法。该装置包括附接到衬底并与衬底电连通的半导体芯片。将屏障球顶材料施加到与附接到基板的表面相对的表面（“相对表面”）上的半导体芯片的边缘上，以形成围绕半导体芯片的相对表面的周边的壁，其中阻挡球顶部材料也延伸到接触并粘附到基底上。围绕半导体芯片的相对表面周边的壁形成凹陷。散热球体材料设置在凹槽内以接触半导体芯片的相对表面。

26. 发明申请

US20040262741A1 Resin molded semiconductor device and mold 有权
标题翻译：树脂模制半导体器件和模具
公开(公告)号：US20040262741A1
公开(公告)日：2004-12-30
申请号：US10870023
申请日：2004-06-18
申请人： NEC Electronics Corporation
发明人： Masahiro Koike , Hirochika Narita
IPC分类号： H01L023/10 , H01L021/44
CPC分类号： H01L27/14825 , H01L23/047 , H01L23/10 , H01L27/14806 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/15747 , H01L2924/16195 , H01L2924/00014 , H01L2924/00
摘要： To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is used as a material of a heat sink 11 having a one-dimensional CCD element 14 mounted thereon. The thermal coefficient of expansion of the heat sink 21 is matched with that of a hollow molded case 12 for integrally molding the heat sink 11 and a lead frame 20. A plurality of projections 21 formed on the side of the hollow molded case 12 are disposed at a bonding interface between the glass cap 13 which closes an upper opening of the hollow molded case 12 and side walls of hollow molded case 12.
摘要翻译：为了通过降低由于温度变化而安装在其上的具有一维CCD元件的CCD器件的屈曲来提供优异的图像。使用黑化处理的铁或铁基合金作为其上安装有一维CCD元件14的散热器11的材料。散热器21的热膨胀系数与用于整体模制散热器11和引线框架20的中空模制壳体12的热膨胀系数相匹配。形成在中空模制壳体12侧的多个突起21被设置在封闭中空成型壳体12的上开口的玻璃盖13和中空成型壳体12的侧壁之间的接合界面处。

27. 发明申请

US20040262740A1 Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application 失效
标题翻译：聚合物焊料混合界面材料，具有改进的焊料填充剂粒度和微电子封装应用
公开(公告)号：US20040262740A1
公开(公告)日：2004-12-30
申请号：US10612328
申请日：2003-06-30
发明人： James C. Matayabas JR. , Ashay A. Dani
IPC分类号： H01L023/10
CPC分类号： H01L23/3733 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/16152 , H01L2924/3011 , H01L2924/00 , H01L2224/0401
摘要： One embodiment of the invention includes a thermal interface material. The thermal interface material includes a polymer matrix; a plurality of fusible particles dispersed within the polymer matrix; and a plurality of non-fusible particles dispersed within the polymer matrix. The fusible particles have a mean particle size that is greater than the maximum particle size of the non-fusible particles. The thermal interface material improves performance of an integrated circuit.
摘要翻译：本发明的一个实施方案包括热界面材料。热界面材料包括聚合物基体; 分散在聚合物基质内的多个易熔颗粒; 以及分散在聚合物基质内的多个非易熔颗粒。可熔颗粒的平均粒径大于非易熔颗粒的最大粒径。热界面材料提高了集成电路的性能。

28. 发明申请

US20040238946A1 Heat spreader and semiconductor device and package using the same 失效
标题翻译：散热器和半导体器件和封装使用相同
公开(公告)号：US20040238946A1
公开(公告)日：2004-12-02
申请号：US10701499
申请日：2003-11-06
申请人： Kabushik Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
发明人： Takeshi Tachibana , Kazushi Hayashi , Kenichi Inoue , Yoshihiro Yokoto , Koji Kobashi , Nobuyuki Kawakami , Takashi Kobori
IPC分类号： H01L023/10
CPC分类号： H01L23/3732 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： A semiconductor device and package has a heat spreader directly disposed on the reverse surface of the semiconductor device. This heat spreader includes a diamond layer or a layer containing diamond and ceramics such as silicon carbide and aluminum nitride. The heat spreader is directly formed on a substrate for the semiconductor device. In particular, the heat spreader is composed of a diamond layer and one or two metal or ceramic members, which are bonded to the diamond layer with one or two polymer adhesive layers. This diamond layer has a fiber structure across the thickness or a microcrystalline structure. Cilia are formed on a surface of the diamond layer facing the one or two metal or ceramic members.
摘要翻译：半导体器件和封装具有直接设置在半导体器件的反面上的散热器。该散热器包括金刚石层或含有金刚石和陶瓷的层，例如碳化硅和氮化铝。散热器直接形成在用于半导体器件的衬底上。特别地，散热器由金刚石层和一个或两个金属或陶瓷构件组成，其通过一个或两个聚合物粘合剂层结合到金刚石层。该金刚石层具有穿过厚度或微晶结构的纤维结构。在金刚石层的面向一个或两个金属或陶瓷构件的表面上形成纤毛。

29. 发明申请

US20040217464A1 OPTICAL ASSEMBLIES FOR TRANSMITTING AND MANIPULATING OPTICAL BEAMS 失效
标题翻译：用于发射和操纵光学光学的光学组件
公开(公告)号：US20040217464A1
公开(公告)日：2004-11-04
申请号：US10428960
申请日：2003-05-02
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Monty M. Denneau , Dinesh Gupta , Lisa J. Jimarez , Steven Ostrander , Brenda L. Peterson , Mark V. Pierson , Eugen Schenfeld , Subhash L. Shinde
IPC分类号： H01L023/10
CPC分类号： G02B6/3522 , G02B6/2817 , G02B6/3544 , G02B6/3574 , G02B6/3598 , G02B6/4214 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4249 , G02B6/4259 , G02B6/4269 , G02B6/4281 , G02B6/43 , H01L2924/0002 , H01L2924/00
摘要： Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

30. 发明申请

US20040212092A1 Methods of fabricating semiconductor substrate-based BGA interconnections 失效
标题翻译：制造基于半导体衬底的BGA互连的方法
公开(公告)号：US20040212092A1
公开(公告)日：2004-10-28
申请号：US10848762
申请日：2004-05-18
发明人： Salman Akram
IPC分类号： H01L023/10
CPC分类号： H01L23/49811 , G01R1/0408 , G01R1/0466 , G01R1/0483 , H01L24/12 , H01L2224/0401 , H01L2224/0603 , H01L2224/1403 , H01L2224/16237 , H01L2224/81141 , H01L2224/81191 , H01L2224/81385 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H05K1/112
摘要： The present invention relates to a method of forming interconnections for a temporary package, wherein the interconnections are capable of receiving solder balls on a die, partial wafer or wafer under test for testing and burn-in. The interconnections are formed in recesses sized and shaped to receive and contain approximately 10% to 50%, and preferably about 30%, of the total height of each solder ball within its associated interconnection. Such a design compensates for undersized or misshapen solder balls on the die under test and thereby prevents a possible false failure indication for the die under test. This design also distributes the forces on the solder ball caused by biasing the die under test to its temporary package to the periphery of the solder ball and thus reduces the likelihood of damage to the solder ball or the semiconductor substrate.
摘要翻译：本发明涉及一种用于形成用于临时封装的互连的方法，其中所述互连能够接收待测的芯片上的焊球，用于测试和老化的部分晶片或晶片。互连形成在尺寸和形状上的凹部中，以容纳并容纳其相关联的互连中每个焊球的总高度的约10％至50％，优选约30％。这样的设计补偿了被测试模具上的尺寸不足或畸形的焊球，从而防止了被测模具的可能的虚假故障指示。该设计还通过将被测试的模具偏置到其临时封装到焊球的周边而将焊球上的力分布，从而降低了焊球或半导体衬底的损坏的可能性。

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