专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明专利

JP3510024B2 Terminal connecting portion of the flat circuit body and a method for manufacturing 失效
公开(公告)号：JP3510024B2
公开(公告)日：2004-03-22
申请号：JP28611195
申请日：1995-11-02
申请人：矢崎総業株式会社
发明人：均牛島 , 義信秋葉
IPC分类号： H01B7/08 , H01B13/00 , H01R4/04 , H01R43/00 , H05K1/02 , H05K3/40 , H01R12/08 , H01R12/28
CPC分类号： H01R12/724 , H01R4/04 , H05K3/4015 , H05K3/4092 , Y10S29/012 , Y10T29/49128 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49179

22. 发明专利

JPS59501570A JPS59501570A - 失效
标题翻译：空值
公开(公告)号：JPS59501570A
公开(公告)日：1984-08-30
申请号：JP50304183
申请日：1983-09-01
IPC分类号： H01P11/00 , H01Q13/02
CPC分类号： H01Q13/0291 , H01P11/002 , Y10S29/012 , Y10S29/026 , Y10T29/49016 , Y10T29/49861

23. 发明专利

JP2004350374A Manufacturing method of commutator 有权
公开(公告)号：JP2004350374A
公开(公告)日：2004-12-09
申请号：JP2003143163
申请日：2003-05-21
申请人： Denso Corp , 株式会社デンソー
发明人： KOBAYASHI MASAYUKI , IWANARI EIJI
IPC分类号： H01R39/06 , H01R43/08 , H02K13/00 , H02K15/00 , H02K15/02 , H02K15/12
CPC分类号： H01R43/08 , H01R39/06 , H02K13/006 , H02K15/0056 , H02K15/12 , Y10S29/012 , Y10S29/029 , Y10S228/903 , Y10T29/49009 , Y10T29/49011 , Y10T29/49012 , Y10T29/49144
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a commutator in which sticking of an insulating resin material to a metal terminal is reduced. SOLUTION: A matrix 200 of the segment of the commutator as well as matrices 210 and 220 of a metal terminal are provided between a mold 230 and a mold 240 while they are combined. With the matrices 200, 210, and 220 combined together, a tab 78 of the matrix 220 is not bent but radially extending outways from the matrix 200 orthogonal to the rotating shaft of the commutator. The tab 78 is a plate flat in the direction orthogonal to the rotating shaft, and is pinched between the mold 230 and the mold 240 with no gap. An insulating resin material is filled into both molds along the border between the mold 230 and the mold 240 through a groove 232 of the mold 230 formed on the contact surface side to the mold 240. Here, little resin sticks to the flat surface of the tab 78 pinched between the mold 230 and the mold 240. After the resin solidifies, the mold 230 is released from the mold 240 and the tab 78 is bent toward the armature side. COPYRIGHT: (C)2005,JPO&NCIPI

24. 发明专利

JPS6111289B2 JPS6111289B2 - 失效
公开(公告)号：JPS6111289B2
公开(公告)日：1986-04-02
申请号：JP5554180
申请日：1980-04-28
申请人： Gen Electric
发明人： JON KUURUSON PURAISU
IPC分类号： C21D9/00 , C21D11/00 , F27B9/40 , F27D19/00
CPC分类号： C21D9/0081 , F27B9/40 , F27D2019/0003 , F27D2019/004 , F27M2001/1552 , Y10S29/012

25. 发明授权

KR1019920010879B1 플레인 베어링 无效
标题翻译：普通轴承
公开(公告)号：KR1019920010879B1
公开(公告)日：1992-12-19
申请号：KR1019850009502
申请日：1985-12-17
申请人： 에이이퍼블릭리미티드캄파니
发明人： 베리존이스트우드 , 데이빗알이스트햄
IPC分类号： C23C30/00 , F16C33/12
CPC分类号： F16C33/12 , F16C2204/20 , F16C2204/22 , Y10S29/012 , Y10S29/025 , Y10S384/907 , Y10S384/912 , Y10T29/49709
摘要： 내용 없음.

26. 发明授权

KR100272069B1 전자장치의 패키지화 방법 및 전자장치 패키지 失效
标题翻译：球网阵列没有通过孔或通过互连
公开(公告)号：KR100272069B1
公开(公告)日：2000-12-01
申请号：KR1019970008776
申请日：1997-03-14
申请人： 인터내셔널 비지네스 머신즈 코포레이션
发明人： 윌슨제임스워렌
IPC分类号： H01L21/56 , H01L23/12
CPC分类号： H01L23/3128 , H01L21/4846 , H01L23/145 , H01L23/49816 , H01L23/49866 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , Y10S29/012 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399 , H01L2924/00012
摘要： An electronic device package in the form of a ball grid array package is formed adding a single layer of conductive material including circuitry having trace lines, wire bond pads, and solder ball pads electrically coupled together. Thin film circuitisation techniques are used on a polyimide laminate substrate to accommodate greater than 100 input/output contacts of an electronic device on a single layer. Thus, the package will not have vias or other conductive type through holes as in multiple conductive layer ball grid array packages.

27. 发明申请

WO9957797A8 CARBON COMMUTATOR 审中-公开
标题翻译：碳交换机
公开(公告)号：WO9957797A8
公开(公告)日：2000-01-27
申请号：PCT/US9909579
申请日：1999-04-30
申请人： MCCORD WINN TEXTRON INC
发明人： ZIEGLER WILLIAM E , BAUER WILLIAM A
IPC分类号： H01R39/04 , H01R39/06 , H01R39/16 , H01R43/06 , H02K13/00 , H02K15/02 , H02K39/08 , H02K15/00 , H02K15/12
CPC分类号： H01R39/06 , H01R39/045 , Y10S29/012 , Y10S29/029 , Y10S228/903 , Y10T29/49011 , Y10T29/49144
摘要： A barrel or face-type carbon-segment commutator assembly (12c) for an electric motor includes a segmented commutating surface (22c) defined by an annular array of commutator sector (14c, 18c), each sector including a carbon segment (18c) connected to a respective conductor section (14c). To form the assembly, an annular carbon cylinder (20c) is overmolded onto a copper blank (70c) and radial grooves (54c) are formed in an inside surface of the carbon cylinder opposite the communicating surface. An insulator hub (24c) is overmolded onto the carbon cylinder and into the radial grooves. Slots (56c) are then machined inward from the communicating surface to the insulator-filled grooves to isolate the commutator sectors. The remaining insulator material mechanically interlocks the sectors. In other embodiments, the commutator assembly (100) is formed by soldering a carbon cylinder (142) to conductor sections (102) before overmolding a hub (112) and cutting slots (108) to isolate commutator sectors (106).
摘要翻译：一种用于电动机的桶形或面型碳分段换向器组件（12c）包括由换向器扇形（14c，18c）的环形阵列限定的分段换向表面（22c），每个扇区包括连接的碳段（18c）到相应的导体部分（14c）。为了形成组件，将环形碳筒（20c）包覆成型到铜坯（70c）上，并且在与连通表面相对的碳瓶的内表面上形成径向槽（54c）。绝缘体轮毂（24c）被包覆成型到碳筒上并进入径向槽。然后将槽（56c）从连通表面向内加工到绝缘体填充的沟槽以隔离换向器扇区。剩余的绝缘体材料机械地互锁扇区。在其他实施例中，换向器组件（100）通过在包覆模制轮毂（112）和切割槽（108）之前将碳圆柱体（142）焊接到导体部分（102）而形成，以隔离换向器扇区（106）。

28. 发明申请

WO99057797A1 CARBON COMMUTATOR 审中-公开
标题翻译：碳通讯员
公开(公告)号：WO99057797A1
公开(公告)日：1999-11-11
申请号：PCT/US1999/009579
申请日：1999-04-30
IPC分类号： H01R39/04 , H01R39/06 , H01R39/16 , H01R43/06 , H02K13/00 , H02K15/02 , H02K39/08 , H02K15/00 , H02K15/12
CPC分类号： H01R39/06 , H01R39/045 , Y10S29/012 , Y10S29/029 , Y10S228/903 , Y10T29/49011 , Y10T29/49144
摘要： A barrel-type carbon-segment commutator assembly (100) for an electric motor includes an annular array of copper conductor sections (102) stamped from a single copper blank. The annular array is overmolded with an electrical-conducting resin-bonded carbon composition (106) that mechanically interlocks the conductor sections and defines an outer cylindrical commutating surface (110). An annular hub (112) is then formed by overmolding an insulator material inside, under, and above the carbon overmold and the conductor section array. The hub insulator material flows into the radial grooves (108) of the carbon overmold and leaves only the outer cylindrical commutating surface exposed.
摘要翻译：一种用于电动机的桶形碳段换向器组件（100）包括从单个铜坯冲压的铜导体部分（102）的环形阵列。环形阵列用导电树脂粘合碳组合物（106）包覆成型，机械地互锁导体部分并限定外圆柱形换向表面（110）。然后通过在碳包覆模具和导体部分阵列的内部，下面和之上包覆模制绝缘体材料来形成环形毂（112）。轮毂绝缘体材料流入碳包覆模制件的径向凹槽（108），并且仅露出暴露的外圆柱形换向表面。

29. 发明申请

WO1994008443A1 METHOD AND APPARATUS FOR FABRICATING PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：制作印刷电路板的方法和装置
公开(公告)号：WO1994008443A1
公开(公告)日：1994-04-14
申请号：PCT/US1993009207
申请日：1993-09-28
申请人： BERG, N., Edward
IPC分类号： H05K03/36
CPC分类号： H05K3/4638 , H05K1/0269 , H05K3/0002 , H05K3/0008 , H05K3/0047 , H05K3/0082 , H05K3/4611 , H05K2201/096 , H05K2201/09918 , H05K2203/0551 , H05K2203/1476 , Y10S29/012 , Y10S408/704 , Y10T29/49126 , Y10T29/49155 , Y10T29/53013
摘要： A method for fabricating at least one via or hole in a multi-layer printed circuit board comprises separately drilling the board layers (3A, 3B, 3C) stacking and laminating the drilled board layers, and then finish drilling the holes (7A, 7B, 7C). The invention also provides a method for correcting artwork to compensate for lamination distortion. Also described is a process for forming interconnection lines on a printed circuit board. The surface of a circuit board substrate (105) is covered with a photoresist layer (107), and the photoresist layer in turn is covered with a halide emulsion layer (109). The emulsion layer (109) is then exposed to a predetermined pattern of white light, and the image developed. The board is then exposed to UV light through the imaged emulsion layer.
摘要翻译：一种用于在多层印刷电路板中制造至少一个通孔或孔的方法包括：单独钻孔层叠所钻出的板层的板层（3A，3B，3C），然后完成钻孔（7A，7B， 7C）。本发明还提供了一种用于校正图案以补偿层叠失真的方法。还描述了在印刷电路板上形成互连线的工艺。电路板基板（105）的表面被光致抗蚀剂层（107）覆盖，光致抗蚀剂层依次被卤化物乳剂层（109）覆盖。然后将乳剂层（109）暴露于预定的白光图案，并且图像显影。然后将该板通过成像的乳剂层暴露于UV光。

30. 发明申请

WO1984001058A1 METHOD FOR FABRICATING CORRUGATED MICROWAVE COMPONENTS 审中-公开
标题翻译：用于制造腐蚀性微波组件的方法
公开(公告)号：WO1984001058A1
公开(公告)日：1984-03-15
申请号：PCT/US1983001371
申请日：1983-09-01
申请人： HUGHES AIRCRAFT COMPANY
发明人： HUGHES AIRCRAFT COMPANY , COBB, Jack, M.
IPC分类号： H01P11/00
CPC分类号： H01Q13/0291 , H01P11/002 , Y10S29/012 , Y10S29/026 , Y10T29/49016 , Y10T29/49861
摘要： In the disclosed method for fabricating corrugated microwave components, a billet assembly is formed of electrically conductive plates (10) sandwitched with chemical etching sensitive spacer material (20) and clamped together (30 and 31). An inside surface (40) is formed in the billet and a mandrel (50) inserted. An outer contoured surface (55) is then formed on the mandrel-billet assembly. The outer surface is then plated (60) to a desired thickness. The mandrel (50) is removed and the spacers (20) chemically etched away leaving the finished component. With the disclosed method, microwave device fabrication for frequencies including 100 GHz and higher is possible.
摘要翻译：在所公开的用于制造波纹微波部件的方法中，坯料组件由夹在化学蚀刻敏感间隔物材料上并夹在一起的导电板形成。在坯料中形成内表面并插入心轴。然后在心轴 - 坯料组件上形成外部轮廓表面。然后将外表面电镀到期望的厚度。去除心轴，并将间隔物化学蚀刻掉离开成品组件。利用所公开的方法，可以使用包括100GHz及更高频率的微波器件制造。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式