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21. 发明申请

WO1997048111A1 DEMETALLIZATION OF POLYMER/METAL MULTILAYER FILMS BY ETCHING 审中-公开
标题翻译：通过蚀刻去除聚合物/金属多层膜
公开(公告)号：WO1997048111A1
公开(公告)日：1997-12-18
申请号：PCT/US1997009958
申请日：1997-06-06
申请人： MEDTRONIC, INC.
发明人： MEDTRONIC, INC. , YIALIZIS, Angelo, N. , KEIMEL, John, G. , RHORER, Alvin, S. , HUNTOON, Trey, W.
IPC分类号： H01G04/30
CPC分类号： H01G4/012 , H01G4/30 , H01G13/06 , Y10T29/417
摘要： A method of improving the breakdown strength of polymer multi-layer (PML) capacitors is provided. The method comprises removing metal, specifically aluminum, from the cut edge. This is done by either etching back the metal electrode layers in either basic or acidic solution or by anodizing the metal to cover that portion of the metal at the edge with an oxide. Removing the metal from the cut edge increases the breakdown strength of the PML capacitors by a factor of two or more.
摘要翻译：提供了一种提高聚合物多层（PML）电容器的击穿强度的方法。该方法包括从切割边缘去除金属，特别是铝。这是通过在碱性或酸性溶液中蚀刻金属电极层或通过阳极氧化金属来覆盖边缘处的金属部分以用氧化物来完成的。从切割边缘去除金属会使PML电容器的击穿强度提高2倍以上。

22. 发明申请

WO1990006586A1 METALLIZED FILM FOR LAMINATED CHIP CAPACITORS AND METHOD OF PRODUCING THE SAME 审中-公开
标题翻译：用于层压芯片电容器的金属化膜及其制造方法
公开(公告)号：WO1990006586A1
公开(公告)日：1990-06-14
申请号：PCT/JP1989001229
申请日：1989-12-07
申请人： HONSHU PAPER CO., LTD. , YAMAUCHI, Tsunetatsu , OKANIWA, Masataka , MURATA, Mamoru
发明人： HONSHU PAPER CO., LTD.
IPC分类号： H01G04/24
CPC分类号： H01G4/015 , C23C14/042 , C23C14/56 , C23C14/562 , H01G4/30 , H01G13/06
摘要： A metallized film for laminated chip capacitors obtained by depositing metal films (23, 24) on a belt-like dielectric film (21) in a direction at right angles with the lengthwise direction of the film mantaining a predetermined independent pattern, such as a skewered pattern or a backbone pattern, and a method of producing the metallized film by forming a film of a masking oil on the surface of dielectric film using a pattern roll (36) with rugged portions and then depositing a metal thereon.

23. 发明申请

WO1987000208A1 DEVICE FOR MAKING METALLIZED PLASTIC FILMS WITH CLEARLY DEFINED NON-METALLIZED AREAS 审中-公开
标题翻译：用于制造具有明确定义的非金属化领域的金属化塑料薄膜的装置
公开(公告)号：WO1987000208A1
公开(公告)日：1987-01-15
申请号：PCT/EP1986000378
申请日：1986-06-25
申请人： METALVUOTO FILMS S.P.A. , RONCHI, Pietro
发明人： METALVUOTO FILMS S.P.A.
IPC分类号： C23C14/00
CPC分类号： C23C14/042 , H01G13/06
摘要： Said device comprises, among other things, a metallizing apparatus through which is made to pass the plastic film (15) whereon the metallizing layer is to be deposited, and a new oil-delivery unit (21) which deposits a layer of oil onto the areas of the film which are to remain non-metallized. The oil delivery unit (21) evaporator is positioned so that the thin layer of oil only adheres to the film in a clearly defined area. The oil has been selected with great care from those available for sale.
摘要翻译：所述装置尤其包括金属化装置，通过该金属化装置通过金属化层将要沉积的塑料膜（15），以及新的油输送单元（21），其将一层油沉积到该膜的区域将保持非金属化。油输送单元（21）蒸发器被定位成使得薄层的油仅在明确限定的区域附着于膜。从那些可供出售的油中选择了这种油。

24. 发明申请

WO2013011614A1 フィルムコンデンサ用のフィルムの製造方法、フィルム、及びフィルムコンデンサ审中-公开
标题翻译：薄膜电容器，薄膜和薄膜电容器制造薄膜的方法
公开(公告)号：WO2013011614A1
公开(公告)日：2013-01-24
申请号：PCT/JP2012/003360
申请日：2012-05-23
申请人：ダイキン工業株式会社 , 大塚啓右
发明人：大塚　啓右
IPC分类号： H01G4/18
CPC分类号： H01G4/18 , H01G13/06 , Y02T10/7022
摘要：　フィルムコンデンサ用フィルムの製造方法は、フィルム体（22）の一方の面（22a）に金属を蒸着して金属膜（23）を形成する第１蒸着工程と、第１蒸着工程の後のフィルム体（22）の他方の面（22b）に電圧を印加し、フィルム体（22）に存在する絶縁欠陥部（30）周辺の金属膜（23）を除去する除去工程と、除去工程の後のフィルム体（22）の他方の面（22b）に金属を蒸着して金属膜（24）を形成する第２蒸着工程とを備える。
摘要翻译：这种薄膜电容薄膜的制造方法具有：用于在薄膜体（22）的一个表面（22a）上气相沉积金属并形成金属薄膜（23）的第一蒸镀步骤。在第一气相沉积之后，向膜体（22）的另一个表面（22b）施加电压并消除存在于膜体（22）中的绝缘缺陷部分（30）周围的金属膜（23）的消除步骤步; 以及用于在所述膜体（22）的另一个表面（22b）上气相沉积金属并在所述消除步骤之后形成金属膜（24）的第二蒸镀步骤。

25. 发明申请

WO2013009712A2 SINTERING OF HIGH TEMPERATURE CONDUCTIVE AND RESISTIVE PASTES ONTO TEMPERATURE SENSITIVE AND ATMOSPHERIC SENSITIVE MATERIALS 审中-公开
标题翻译：高温导电和耐高温烧结的高温敏感和大气敏感材料
公开(公告)号：WO2013009712A2
公开(公告)日：2013-01-17
申请号：PCT/US2012/045975
申请日：2012-07-09
申请人： KEMET ELECTRONICS CORPORATION , MCCONNELL, John, E. , BULTITUDE, John , GURAV, Abhijit
发明人： MCCONNELL, John, E. , BULTITUDE, John , GURAV, Abhijit
IPC分类号： C04B41/88 , C04B35/64 , C04B35/01 , H01G4/12
CPC分类号： H01G4/30 , B05D3/06 , H01G4/1227 , H01G13/02 , H01G13/06 , Y10T29/43
摘要： An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic.
摘要翻译：在金属箔涂覆的陶瓷的制造方法中提供一种形成金属箔涂覆的陶瓷和金属箔电容器的方法，包括：提供金属箔; 将陶瓷前体施加到金属箔上，其中陶瓷前体包括至少一个感受器和高介电常数氧化物和有机粘合剂，并且用高强度高脉冲频率光能烧结陶瓷前体以形成金属箔陶瓷。

26. 发明申请

WO1986003144A1 FOIL WITH TWO SURFACES WHICH RUN ESSENTIALLY PLANE-PARALLEL TO ONE ANOTHER, AND PROCESS AND DEVICE FOR ITS PRODUCTION 审中-公开
标题翻译：具有两个表面的平面的平面与平行的平面，以及其生产的过程和设备
公开(公告)号：WO1986003144A1
公开(公告)日：1986-06-05
申请号：PCT/EP1985000651
申请日：1985-11-28
申请人： SCHMOOCK, Helmuth
IPC分类号： B05D05/08
CPC分类号： H01G13/06 , B05D1/60 , B05D5/08 , B05D7/04 , B05D7/24 , G11B5/72 , Y10S428/90 , Y10T29/43 , Y10T428/265 , Y10T428/31681 , Y10T428/31692 , Y10T428/31699 , Y10T428/31714 , Y10T428/31725 , Y10T428/31786 , Y10T428/31844 , Y10T428/31931 , Y10T428/31935 , Y10T428/31938
摘要： The foil has two essentially plane-parallel surfaces of which at least one possesses at least partly a metal coating. The metal coating is protected on its metal surface by a sliding film. In addition, the surface facing the metal-coated surface can be protected by a sliding film. The sliding film should possess a maximum constant thickness of 0,5 eta over the entire surface. The process for producing a protection for the foil which is provided at least on its surfaces with a metal coating is characterized by the fact that the metal coating is covered with a sliding film. The foil can however also be provided with a sliding film on the surface which faces away from the metal coating. The sliding film can be vaporized, rolled or sprayed on to the foil or be spread on to it by ultra-sound or electrostatically. Subsequently, the foil is wound on to a roll.
摘要翻译：箔具有两个基本上平面平行的表面，其中至少一个至少部分具有金属涂层。金属涂层通过滑动膜在其金属表面上被保护。此外，面向金属涂覆表面的表面可以由滑动膜保护。滑动薄膜在整个表面上应具有最大恒定厚度0.5度。用金属涂层至少在其表面上提供的箔的保护方法的特征在于金属涂层被滑动膜覆盖。然而，箔也可以在远离金属涂层的表面上设置滑动膜。滑膜可以蒸发，滚动或喷涂到箔片上或通过超声或静电将其扩散到其上。随后，将箔卷绕成卷。

27. 发明专利

JP2013161931A Porous capacitor, and method of manufacturing the same 有权
标题翻译：多孔电容器及其制造方法
公开(公告)号：JP2013161931A
公开(公告)日：2013-08-19
申请号：JP2012022287
申请日：2012-02-03
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： MASUDA HIDETOSHI
IPC分类号： H01G4/33
CPC分类号： H01G4/01 , H01G4/018 , H01G4/302 , H01G9/048 , H01G13/06
摘要： PROBLEM TO BE SOLVED: To provide a porous capacitor designed to improve mechanical strength, and a method of manufacturing the same.SOLUTION: The porous capacitor includes a first conductor layer (21) and a second conductor layer (22) facing each other with a prescribed distance kept between, a dielectric layer (23) made of the oxide of a valve metal that is interposed between the first conductor layer and the second conductor layer, a large number of holes (24) formed so as to reach the first conductor layer and the second conductor layer respectively in a direction almost perpendicular to the first conductor layer and the second conductor layer, a first electrode (25) and a second electrode (26) formed by filling a conductive material in the holes, and insulating parts (24a, 24b) for electrically disconnecting the first electrode from the second conductor layer, and electrically disconnecting the second electrode from the first conductor layer. The positions of the terminals of the first and/or second electrode on the side that is not electrically connected to the first conductor layer or the second conductor layer are made uneven.
摘要翻译：要解决的问题：提供设计用于提高机械强度的多孔电容器及其制造方法。解决方案：多孔电容器包括第一导体层（21）和第二导体层（22），所述第一导体层（21）和第二导体层（22）由介于第一导体层和第二导体层之间的阀金属的氧化物构成的电介质层（23），形成有多个孔（24），以形成为达到第一导体层和第二导体层分别在与第一导体层和第二导体层大致垂直的方向上，通过在孔中填充导电材料形成的第一电极（25）和第二电极（26）以及绝缘部（24a ，24b），用于将第一电极与第二导体层电断开，以及将第二电极与第一导体层电断开。第一和/或第二电极的不与第一导体层或第二导体层电连接的一侧的端子的位置不均匀。

28. 发明专利

JP2013026390A Manufacturing method of film for film capacitor, film, and film capacitor 审中-公开
标题翻译：薄膜电容器，薄膜和薄膜电容器薄膜的制造方法
公开(公告)号：JP2013026390A
公开(公告)日：2013-02-04
申请号：JP2011158987
申请日：2011-07-20
申请人： Daikin Ind Ltd , ダイキン工業株式会社
发明人： OTSUKA KEISUKE
IPC分类号： H01G4/18
CPC分类号： H01G4/18 , H01G13/06 , Y02T10/7022
摘要： PROBLEM TO BE SOLVED: To allow for removal of a metal film around an insulation defective part while forming a metal film on both surfaces of a film for a film capacitor by a relatively simple step.SOLUTION: A manufacturing method of a film for a film capacitor comprises: a first deposition step of forming a metal film (23) by depositing a metal on one surface (22a) of a film body (22); a removal step of removing the metal film (23) around an insulation defective part (30) existing in the film body (22) by applying voltage to the other surface (22b) of the film body (22) after the first deposition step; and a second deposition step of forming a metal film (24) by depositing the metal on the other surface (22b) of the film body (22) after the removal step.
摘要翻译：要解决的问题：为了允许在绝缘缺陷部分周围去除金属膜，同时通过相对简单的步骤在用于薄膜电容器的膜的两个表面上形成金属膜。薄膜电容器薄膜的制造方法包括：通过在薄膜体（22）的一个表面（22a）上沉积金属来形成金属薄膜（23）的第一沉积步骤; 去除步骤，通过在第一沉积步骤之后向膜体（22）的另一个表面（22b）施加电压，去除存在于膜体（22）中的绝缘缺陷部分（30）周围的金属膜（23）以及第二沉积步骤，通过在去除步骤之后将金属沉积在膜体（22）的另一个表面（22b）上来形成金属膜（24）。版权所有（C）2013，JPO＆INPIT

29. 实用新型

KR2019930019535U 금속화 플라스틱 필름으로부터 금속막을 벗겨내는 장치 无效
标题翻译：从金属化塑料薄膜剥离金属薄膜的设备
公开(公告)号：KR2019930019535U
公开(公告)日：1993-09-23
申请号：KR2019930002365
申请日：1993-02-20
申请人： 가이또매뉴팩처링코우.,엘티디.
发明人： 마사오가이또
IPC分类号： B29B17/00
CPC分类号： C23C14/562 , B29C63/0013 , C23C14/14 , C23C14/58 , H01G13/06
摘要： 본고안은종래의장치에비해경제적으로작동하며, 금속막을벗겨낼때벗겨진금속막의잔여량이외부로확산되지않는, 금속화플라스틱필름에서금속막을벗겨내는장치에관한것이본 장치는금속화플라스틱필름의축과권취축사이에서, 음극전압(또는양극전압) 공급롤러및 양극전압(또는음극전압) 인가용전극봉을구비하고, 상기전극봉하부에서압축롤러를구비하며, 매번의벗김단계에서 360/(는 10, 20, 30, 40, 60, 90 또는 180임개의벗김수단; 플라스틱필름을가압하는압축롤러를포함하는압축수단; 금속막의잔여량을제거하는연마수단; 및상부에서개구부를하부에서분진흡인구를지니며, 상기벗김수단및 상기연마수단을수납하는하우징으로구성된다.
摘要翻译：纸内并比常规设备经济运行，金属膜的剩余量剥离naelttae关闭金属薄膜不会扩散到外部，即本发明的装置涉及一种装置，剥离在金属化的塑料膜的金属膜是金属化的塑料膜轴和（或阳极电压）供应辊和用于施加正电压（或负电极电压）的电极，以及位于电极底部的压缩辊，其中360 / ，30,40,60,90或180次，包括用于压制塑料膜的压缩辊的压缩装置，用于除去金属膜的剩余量的抛光装置，，剥离装置以及用于容纳抛光装置的壳体。

30. 发明公开

KR1020120028509A 커패시터 형성 방법 및 이를 이용한 반도체 장치 제조 방법 无效
标题翻译：形成电容器的方法和使用其制造半导体器件的方法
公开(公告)号：KR1020120028509A
公开(公告)日：2012-03-23
申请号：KR1020100090390
申请日：2010-09-15
申请人： 삼성전자주식회사
发明人： 오정민 , 윤보언 , 최규완 , 이근택 , 강대혁 , 박임수 , 이동석 , 김영후
IPC分类号： H01L21/8242 , H01L27/108
CPC分类号： H01G13/06
摘要： PURPOSE: A method for forming a capacitor and a method for manufacturing a semiconductor device using the same are provided to prevent a short circuit between bottom electrodes by forming a bowing preventing film having a lower etching rate than that of a mold film in forming a capacitor. CONSTITUTION: A first mold film, a supporting film, a second mold film, a bowing preventing film, and a third mold film are successively formed on a top side of a substrate. The third mold film, the bowing preventing film, the second mold film, the supporting film, and the first mold film are etched partly and a first opening(150b) is formed which to expose a conductive region. A bottom electrode(190) electrically connected to the conductive region is formed on an inner wall of the first opening. The third mold film, the bowing preventing film, and the second mold film are removed. A supporting film pattern(150a) is formed by eliminating a part of the supporting film.
摘要翻译：目的：提供一种用于形成电容器的方法和使用该电容器的半导体器件的制造方法，以通过在形成电容器中形成具有比模具膜蚀刻速率低的蚀刻速率的弓形防止膜来防止底部电极之间的短路。构成：在基板的上侧依次形成第一模膜，支撑膜，第二模膜，防弓膜，第三模膜。部分地蚀刻第三模具薄膜，防弓薄膜，第二模具薄膜，支撑薄膜和第一模具薄膜，并形成露出导电区域的第一开口（150b）。电连接到导电区域的底部电极（190）形成在第一开口的内壁上。去除第三模具薄膜，防弓薄膜和第二模具薄膜。通过消除支撑膜的一部分来形成支撑膜图案（150a）。

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