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21. 发明申请

US20080134910A1 Imprinter 有权
标题翻译：打印机
公开(公告)号：US20080134910A1
公开(公告)日：2008-06-12
申请号：US11905724
申请日：2007-10-03
申请人： Yukio Hosaka
发明人： Yukio Hosaka
IPC分类号： B31F1/07
CPC分类号： B41L19/00
摘要： It is an object of the invention to provide an imprinter wherein a roller of hard material is rotatingly moved while the roller is kept in contact with the information represented as convexly embossed on a card during imprinting operation so that a clear transcription of information may be obtained without necessity of adjustment as to the contact between the roller and the embossed information.The imprinter comprises a printing base for mounting a card P and a print paper S to be imprinted on a predetermined area thereof, a carriage B that is movable above the printing base, a roller shaft 6 arranged at a position of a predetermined height from the card mounting surface of the printing base A, a roller C composed of an outer periphery 15 of hard material a center boss 16 that is in rotational engagement with the roller shaft 6 and elastic members 17 provided between the outer periphery and the center boss of the roller, the elastic members 17 being radially deformed during imprinting operation to cause the outer periphery 15 of the roller C to radially move relative to the center axis of the roller shaft 6 into a state of eccentric circle in vertical section, so that the embossed information of the card P may be transcribed onto the print paper S.
摘要翻译：本发明的一个目的是提供一种打印机，其中在压印操作期间，当辊与保持在卡上凸起压印的信息保持接触时，硬质材料的辊旋转移动，从而可以获得信息的清晰转录而不需要调整辊和压花信息之间的接触。打印机包括用于安装要打印在其预定区域上的卡片P和打印纸S的打印基座，可在打印基座上方移动的托架B，布置在距离打印基座预定高度的位置的滚轴6 印刷基座A的卡片安装面，由硬质材料的外周部15构成的滚子C，与辊轴6旋转接合的中心凸台16以及设置在滚筒轴6的外周与中心凸台之间的弹性部件17。在压印操作期间弹性构件17径向变形，使得辊C的外周15相对于辊轴6的中心轴线径向移动到垂直截面中的偏心圆的状态，使得压花信息卡P可以被转录到打印纸S上。

22. 发明授权

US06559611B1 Method for starting a load by engine-driven generator and engine-driven generator 失效
标题翻译：用发动机驱动的发电机和发动机驱动的发电机启动负载的方法
公开(公告)号：US06559611B1
公开(公告)日：2003-05-06
申请号：US09706281
申请日：2000-11-03
申请人： Satoru Satake , Yukio Hosaka , Hideharu Maruyama , Yuuji Matsumoto , Kiyonori Nakaoka
发明人： Satoru Satake , Yukio Hosaka , Hideharu Maruyama , Yuuji Matsumoto , Kiyonori Nakaoka
IPC分类号： H02P520
CPC分类号： H02P1/26
摘要： At a starting of a motor which receives an electric power from a generator driven by an engine, an excitation current controller controls an excitation current so as to cause an output frequency of a generator to approach a predetermined frequency which is lower than a rated frequency when an output voltage detected by an output voltage detector is reduced to lower than a first predetermined voltage. Thereafter, the excitation current controller controls the excitation current so as to cause the output voltage of the generator to be the rated voltage when the output voltage detector detects a second predetermined voltage which is higher than the first predetermined voltage. In this way, the load capacity which enables the starting by the engine-driven generator without directly controlling the engine is improved.
摘要翻译：在从由发动机驱动的发电机接收电力的电动机的启动时，励磁电流控制器控制励磁电流，以使发电机的输出频率接近低于额定频率的预定频率，当预定频率低于额定频率时由输出电压检测器检测的输出电压降低到低于第一预定电压。此后，励磁电流控制器控制励磁电流，以便当输出电压检测器检测到高于第一预定电压的第二预定电压时，使发电机的输出电压为额定电压。通过这种方式，可以提高能够在不直接控制发动机的情况下由发动机驱动的发电机起动的负载能力。

23. 发明授权

US06262173B1 Thermoplastic resin composition having excellent long-term heat-aging properties 有权
标题翻译：热塑性树脂组合物具有优异的长期热老化性能
公开(公告)号：US06262173B1
公开(公告)日：2001-07-17
申请号：US09351298
申请日：1999-07-12
申请人： Takashi Kurata , Yukio Hosaka
发明人： Takashi Kurata , Yukio Hosaka
IPC分类号： C08G6348
CPC分类号： C08L69/00 , C08L2666/02
摘要： The present invention relates to a thermoplastic resin composition with excellent long-term heat-aging properties, comprising: (I) 10 to 45% by weight of a rubber-modified thermoplastic resin obtained by graft polymerizing at least one monomer selected from the group consisting of aromatic vinyl compounds, vinyl cyanide compounds and other vinyl monomers copolymerizable therewith in the presence of a rubber-like polymer; (II) 5 to 30% by weight of a thermoplastic resin obtained by copolymerizing the monomers comprising an aromatic vinyl compound, a vinyl cyanide compound and optionally other vinyl monomer copolymerizable therewith; and (III) 50 to 70% by weight of a polycarbonate resin, the content of the vinyl cyanide compound in the whole produced composition being 3 to 12% by weight.
摘要翻译：本发明涉及具有优异的长期热老化性能的热塑性树脂组合物，其包含：（I）10至45重量％的橡胶改性热塑性树脂，其通过将至少一种选自以下的单体接枝聚合而获得：的芳族乙烯基化合物，乙烯基氰化合物和其它可与橡胶状聚合物共聚的乙烯基单体;（II）5-30重量％的热塑性树脂，其通过将包含芳族乙烯基化合物，乙烯基氰化物化合物和可与其共聚的任意其它乙烯基单体; 和（III）50〜70重量％的聚碳酸酯树脂，全部生成组合物中的乙烯基氰化合物的含量为3〜12重量％。

24. 发明授权

US06208420B1 Method and apparatus for estimating quality of grains 有权
标题翻译：估计谷物质量的方法和装置
公开(公告)号：US06208420B1
公开(公告)日：2001-03-27
申请号：US09501272
申请日：2000-02-09
申请人： Satoru Satake , Yukio Hosaka , Hideharu Maruyama , Nobuhiko Nakamura , Nobuharu Yagishita
发明人： Satoru Satake , Yukio Hosaka , Hideharu Maruyama , Nobuhiko Nakamura , Nobuharu Yagishita
IPC分类号： G01N2155
CPC分类号： G01N21/3563 , G01N21/84 , G01N33/02 , G01N2021/8466
摘要： A method and an apparatus are provided for estimating a quality of grains to be harvested from a grain plant in the future, during a growth period prior to the harvesting. The method comprises the step for establishing a quality conversion coefficient for estimating a specific quality of grains after the harvesting based on absorbencies relating to the specific quality of the grains obtained by irradiating light having predetermined wavelength regions on a leaf of a grain plant in growth at a predetermined time during the growth period of the grain plant and the specific quality obtained from the same grains after the harvesting, and the step for estimating the quality of the grains to be harvested in the future based on said quality conversion coefficient and absorbencies relating to said specific quality obtained from a leaf of the grain plant presently growing at the predetermined time. The measurement for estimating the quality of the grains can be carried out in an easy and simple manner during the growth of grain plants.
摘要翻译：提供了一种方法和装置，用于在收获前的生长期间估计将来从谷物植物收获的谷粒的质量。该方法包括用于建立质量转换系数的步骤，用于基于通过在具有预定波长区域的光照射在具有生长的谷物植物的叶上获得的颗粒的特定质量的吸光度来估计收获后的谷物的特定质量在谷物植物的生长期间的预定时间和从收获后的相同谷粒获得的特定质量，以及基于所述质量转换系数和与之相关的吸光度来估计未来收获的谷粒的质量的步骤所述特定质量从目前在预定时间生长的谷物植物叶获得。用于估计谷物质量的测量可以在粮食植物生长期间以简单和简单的方式进行。

25. 发明授权

US4914892A Process for packaging article with film 失效
标题翻译：用薄膜包装制品的方法
公开(公告)号：US4914892A
公开(公告)日：1990-04-10
申请号：US300155
申请日：1989-01-23
申请人： Tsutomu Saito , Yukio Hosaka
发明人： Tsutomu Saito , Yukio Hosaka
IPC分类号： B65B11/12 , B65B9/02 , B65B53/00
CPC分类号： B65B53/00 , B65B9/026
摘要： This invention relates to a process for packaging an article with a thermoplastic resin film in which the film is rolled on the two rolls on both side so that an intermediate region thereof may be extended in tension condition between the rolls, and an article to be packaged is fed through a space between the rolls so as to push against the extended intermediate region of the film and be wrapped therewith, and overlapped portions of the wrapping film are set in parallel with the surface of the article and are fused together, and at the same time are cut so that there may be obtained such a fused adhesion line on the overlapped portions of the film that extends in the lateral width of the film and is longer in length than the width of the film, so that there is obtained the packaged article in which the fused overlapped portions of the packaging film is laid along on the surface of the article and, on the other hand, there is obtained an intermediate region of the film which is extended between the two rolls and has the foregoing fused overlapped portions.

26. 发明授权

US4027978A Method and apparatus for non-contact measurement of a gauge of a high temperature material 失效
标题翻译：用于非接触式测量高温材料量规的方法和装置
公开(公告)号：US4027978A
公开(公告)日：1977-06-07
申请号：US431735
申请日：1974-01-08
申请人： Tomio Yamamoto , Koji Sakasegawa , Atsushi Osumi , Yukio Hosaka , Takeo Yamada
发明人： Tomio Yamamoto , Koji Sakasegawa , Atsushi Osumi , Yukio Hosaka , Takeo Yamada
IPC分类号： G01B11/02 , G01B11/04
CPC分类号： G01B11/022 , G01B11/046
摘要： There are provided a method and apparatus for noncontact measurement of a gauge of a high temperature material such as a red-hot steel slab, wherein the entire optical system including a light source, a filter and a detector is employed at wavelengths in the near-ultraviolet zone, preferably in the range 4,300 - 4,400 A, and a sampling mark corresponding to a reference projection point for an optical mark of wavelengths in the near-ultraviolet zone is established on the screen of a television receiver on which the optical mark is displayed in accordance with the output of a camera tube which receives the optical mark through a band-pass filter which transmits the wavelengths in the near-ultraviolet zone, whereby the light source and the camera tube are translated from the reference positions until the optical mark formed on a high temperature material to be measured coincides with the sampling mark so that the gauge of the high temperature material is measured in accordance with the distance covered by the parallel motion of the light source and the camera tube.
摘要翻译：提供了用于非接触式测量诸如红热钢板的高温材料的量规的方法和装置，其中包括光源，滤光器和检测器的整个光学系统采用近红外线的波长，紫外线区域，优选在3,300-4,400A范围内，并且在其上显示光标记的电视接收机的屏幕上建立对应于近紫外区域中的波长光学标记的参考投影点的取样标记根据通过透射近紫外区域中的波长的带通滤波器接收光学标记的相机管的输出，由此光源和照相机管从基准位置平移直到形成光标在要测量的高温材料上与采样标记一致，使得高温材料的规格根据二由光源和相机管的平行运动所覆盖的姿态。

27. 发明授权

US08944888B2 Chemical-mechanical polishing pad and chemical-mechanical polishing method 有权
标题翻译：化学机械抛光垫和化学机械抛光方法
公开(公告)号：US08944888B2
公开(公告)日：2015-02-03
申请号：US13809694
申请日：2011-06-13
申请人： Kotaro Kubo , Yukio Hosaka , Takahiro Okamoto
发明人： Kotaro Kubo , Yukio Hosaka , Takahiro Okamoto
IPC分类号： B24B1/00 , B24B37/26 , B24B37/24 , H01L21/3105 , H01L21/321
CPC分类号： B24B37/26 , B24B37/24 , H01L21/31053 , H01L21/3212
摘要： A chemical mechanical polishing pad includes a polishing layer, a recess being formed in a polishing surface of the polishing layer, the polishing layer including a surface layer that forms at least an inner side of the recess, and a ratio (D1/D2) of an average opening ratio D1(%) to an average opening ratio D2(%) being 0.01 to 0.5, the average opening ratio D1 being an average opening ratio of the inner side of the recess when the polishing layer has been immersed in water at 23° C. for 1 hour, and the average opening ratio D2 being an average opening ratio of a cross section of the polishing layer that does not intersect the surface layer when the cross section has been immersed in water at 23° C. for 1 hour.
摘要翻译：化学机械抛光垫包括抛光层，在抛光层的抛光表面上形成的凹槽，所述抛光层包括至少形成凹部内侧的表面层，以及所述抛光层的比例（D1 / D2）平均开口率D1（％）相对于平均开口率D2（％）为0.01〜0.5，平均开口率D1是当抛光层浸入水中时凹部的内侧的平均开口率为23 ℃，1小时，平均开口率D2是当横截面已经在23℃的水中浸渍1小时时，与表面层不相交的抛光层的横截面的平均开口率。

28. 发明申请

US20130189907A1 CHEMICAL-MECHANICAL POLISHING PAD AND CHEMICAL-MECHANICAL POLISHING METHOD 有权
标题翻译：化学机械抛光垫和化学机械抛光方法
公开(公告)号：US20130189907A1
公开(公告)日：2013-07-25
申请号：US13809694
申请日：2011-06-13
申请人： Kotaro Kubo , Yukio Hosaka , Takahiro Okamoto
发明人： Kotaro Kubo , Yukio Hosaka , Takahiro Okamoto
IPC分类号： B24B37/26 , B24B37/24
CPC分类号： B24B37/26 , B24B37/24 , H01L21/31053 , H01L21/3212
摘要： A chemical mechanical polishing pad includes a polishing layer, a recess being formed in a polishing surface of the polishing layer, the polishing layer including a surface layer that forms at least an inner side of the recess, and a ratio (D1/D2) of an average opening ratio D1(%) to an average opening ratio D2(%) being 0.01 to 0.5, the average opening ratio D1 being an average opening ratio of the inner side of the recess when the polishing layer has been immersed in water at 23° C. for 1 hour, and the average opening ratio D2 being an average opening ratio of a cross section of the polishing layer that does not intersect the surface layer when the cross section has been immersed in water at 23° C. for 1 hour.
摘要翻译：化学机械抛光垫包括抛光层，在抛光层的抛光表面上形成的凹槽，所述抛光层包括至少形成凹部内侧的表面层，以及所述抛光层的比例（D1 / D2）平均开口率D1（％）相对于平均开口率D2（％）为0.01〜0.5，平均开口率D1是当抛光层浸入水中时凹部的内侧的平均开口率为23 ℃，1小时，平均开口率D2是当横截面已经在23℃的水中浸渍1小时时，与表面层不相交的抛光层的横截面的平均开口率。

29. 发明授权

US07790788B2 Method for producing chemical mechanical polishing pad 有权
标题翻译：化学机械抛光垫的生产方法
公开(公告)号：US07790788B2
公开(公告)日：2010-09-07
申请号：US12253349
申请日：2008-10-17
申请人： Yukio Hosaka , Rikimaru Kuwabara
发明人： Yukio Hosaka , Rikimaru Kuwabara
IPC分类号： D21H19/58 , C08B37/02 , B24D11/00
CPC分类号： B29C35/0866 , B24B37/24 , B24D18/0009 , B29C37/0057 , B29C2035/0877 , B29L2031/736
摘要： There is provided a method for producing a chemical mechanical polishing pad, the method comprising the steps of (1) producing a sheet-shaped polymer molded article and (2) irradiating the sheet-shaped polymer molded article with an electron beam within an irradiation dose of 10 to 400 kGy.A chemical mechanical polishing pad produced by the above method has advantages that it is excellent in removal rate and scratches and in-plane uniformity on a polished surface and that it shows a stable removal rate even when polishing a number of objects to be polished successively.
摘要翻译：提供了一种生产化学机械抛光垫的方法，该方法包括以下步骤：（1）制备片状聚合物模塑制品，和（2）在辐射剂量内用电子束照射片状聚合物模塑制品 10到400 kGy。通过上述方法制造的化学机械抛光垫具有在抛光表面上的去除率和划痕和面内均匀性优异的优点，即使在连续研磨多个待抛光物体时也能显示出稳定的去除率。

30. 发明授权

US06848974B2 Polishing pad for semiconductor wafer and polishing process using thereof 有权
标题翻译：半导体晶片抛光垫及其抛光工艺
公开(公告)号：US06848974B2
公开(公告)日：2005-02-01
申请号：US10252696
申请日：2002-09-24
申请人： Kou Hasegawa , Yukio Hosaka
发明人： Kou Hasegawa , Yukio Hosaka
IPC分类号： B24B37/20 , B24B37/22 , B24B37/24 , B24D13/12 , B24D13/14 , H01L21/304 , H01L21/306 , B24B1/00
CPC分类号： B24B37/22 , H01L21/30625
摘要： An object of the present invention is to provide a polishing pad for a semiconductor wafer which can perform a stable polishing while preventing a polishing layer from floating up from a supporting layer and a surface of a polishing pad from bending during polishing using a polishing pad having a multi-layered structure of a polishing layer and a supporting layer, and a polishing process using thereof. The polishing pad of the present invention is characterized in that it is comprising a supporting layer which is a non-porous elastic body and a polishing layer which is laminated on one surface of the supporting layer, and a polishing process using thereof. Shore D hardness of the polishing layer is preferably 35 or more, and hardness of the supporting layer is preferably lower than that of the polishing layer.
摘要翻译：本发明的目的是提供一种用于半导体晶片的抛光垫，其可以执行稳定的抛光，同时防止抛光层从支撑层浮起并且抛光垫的表面在抛光期间使用抛光垫弯曲，抛光层和支撑层的多层结构，以及使用其的抛光工艺。本发明的抛光垫的特征在于，其包括作为无孔弹性体的支撑层和层叠在支撑层的一个表面上的研磨层和使用其的研磨工序。抛光层的肖氏D硬度优选为35以上，并且支撑层的硬度优选低于抛光层的硬度。

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