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21. 发明授权

US5801433A Semiconductor device with smaller package 失效
标题翻译：半导体器件封装较小
公开(公告)号：US5801433A
公开(公告)日：1998-09-01
申请号：US759007
申请日：1996-12-02
申请人： Mitsuhiro Nakao , Toshimitsu Ishikawa , Kazunori Hayashi
发明人： Mitsuhiro Nakao , Toshimitsu Ishikawa , Kazunori Hayashi
IPC分类号： H01L21/48 , H01L23/495 , H01L23/48
CPC分类号： H01L24/06 , H01L21/4842 , H01L23/49541 , H01L23/49551 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/49171 , H01L2224/49175 , H01L2224/4943 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/3011
摘要： Disclosed is a semiconductor device comprising an integrated circuit chip, a first lead having a portion extending substantially in parallel to one side plurality of the chip, and a second lead located adjacent to the first lead. Each of the first and second leads has a recess and a projection continuously. The first lead and second lead are arranged adjacent to each other with the recess and projection of the first lead being in engagement with the projection and recess of the second lead. Bonding wires are bonded on the projection of the first lead and the projection of the second lead. The bonding wires electrically connect the chip to the first lead and also to the second lead.
摘要翻译：公开了一种半导体器件，其包括集成电路芯片，第一引线，其具有基本上平行于多个芯片的一侧延伸的部分，以及位于第一引线附近的第二引线。第一和第二引线中的每一个连续地具有凹部和突起。第一引线和第二引线彼此相邻布置，第一引线的凹部和突起与第二引线的突起和凹槽接合。接合线结合在第一引线和第二引线的突起的突起上。接合线将芯片电连接到第一引线并且还连接到第二引线。

22. 发明授权

US08308049B2 Wire bonding method 有权
标题翻译：接线方式
公开(公告)号：US08308049B2
公开(公告)日：2012-11-13
申请号：US12556918
申请日：2009-09-10
申请人： Mitsuhiro Nakao
发明人： Mitsuhiro Nakao
IPC分类号： B23K1/06
CPC分类号： B23K20/007 , B23K20/10 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/02166 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/48463 , H01L2224/48624 , H01L2224/48799 , H01L2224/78301 , H01L2224/85148 , H01L2224/85181 , H01L2224/85205 , H01L2224/85206 , H01L2924/00011 , H01L2924/00015 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/20752 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2924/20754 , H01L2924/01006
摘要： A bonding method of applying vibrations to a metal unit including copper while pressing the metal unit onto a bonding object to bond the metal unit to the bonding object is provided. The method includes: applying vibrations to the metal unit and bringing the metal unit into contact with the bonding object while applying the vibrations; gradually increasing a pressing load of the metal unit on the bonding object to a first pressing load; and reducing the pressing load to a second pressing load smaller than the first pressing load and gradually increasing an output power of the vibrations from a first output power to a second output power after the pressing load reaches the first pressing load, the first output power being applied during the first pressing load.
摘要翻译：提供了一种将包含铜的金属单元施加振动的接合方法，同时将金属单元压在接合体上以将金属单元接合到接合体。该方法包括：在施加振动的同时对金属单元施加振动并使金属单元与粘结物接触; 将金属单元在接合对象上的按压负荷逐渐增加到第一按压负载; 并且将所述按压负荷减小到比所述第一按压负载小的第二按压负荷，并且在所述按压负载达到所述第一按压负荷后，将所述振动的输出功率从第一输出功率逐渐增加到第二输出功率，所述第一输出功率为在第一按压负载期间施加。

23. 发明授权

US08004028B2 Solid state imaging device, manufacturing method of the same, and substrate for solid state imaging device 有权
标题翻译：固态成像装置及其制造方法以及固态成像装置用基板
公开(公告)号：US08004028B2
公开(公告)日：2011-08-23
申请号：US12385969
申请日：2009-04-24
申请人： Kenzo Fukuyoshi , Tadashi Ishimatsu , Keisuke Ogata , Mitsuhiro Nakao , Akiko Uchibori
发明人： Kenzo Fukuyoshi , Tadashi Ishimatsu , Keisuke Ogata , Mitsuhiro Nakao , Akiko Uchibori
IPC分类号： H01L31/062 , H01L31/113
CPC分类号： H01L27/14601 , H01L27/14627 , H01L27/14685
摘要： A solid state imaging device including photoelectric conversion devices which are arranged two-dimensionally; a color filter including a plurality of picture elements, each disposed corresponding to each of the photoelectric conversion devices; and a plurality of transfer lenses each disposed corresponding to each of the picture elements, formed of a thermoset acrylic resin, and formed directly on each of the picture elements, wherein a gap between neighboring transfer lenses is not more than 0.035 μm, and a contact length between neighboring transfer lenses is within the range of 3-80% of the pitch of the plurality of transfer lenses.
摘要翻译：一种包括二维布置的光电转换装置的固态成像装置; 包括多个像素的滤色器，每个图像元素分别对应于每个光电转换器件; 以及多个转印透镜，每个透镜对应于由热固性丙烯酸树脂形成的每个图像元素，并且直接形成在每个像素上，其中相邻转印透镜之间的间隙不大于0.035μm，并且接触相邻转印透镜之间的长度在多个转印透镜的间距的3-80％的范围内。

24. 发明申请

US20100226766A1 Centrifugal Blower 有权
标题翻译：离心式鼓风机
公开(公告)号：US20100226766A1
公开(公告)日：2010-09-09
申请号：US12224442
申请日：2008-05-08
申请人： Tsuyoshi Eguchi , Atsushi Suzuki , Mitsuhiro Nakao , Tetsuo Tominaga
发明人： Tsuyoshi Eguchi , Atsushi Suzuki , Mitsuhiro Nakao , Tetsuo Tominaga
IPC分类号： F04D29/44
CPC分类号： F04D29/663 , F04D29/422 , F04D29/4226 , F05D2250/232
摘要： It is intended to provide a centrifugal blower capable of suppressing the generation of noise including periodic noise that is caused by interference between a tongue and an impeller. The centrifugal blower is provided with an impeller (2) provided with plural blades around a rotating shaft; a casing (3) which houses the impeller (2) and has a suction portion at one end in an axial line direction of the rotating shaft; a spiral flow passage (4) formed around the impeller (2) in the casing (3); and a tongue (6) for suppressing inflow of air from a winding end to a winding origin of the spiral flow passage (4). The centrifugal blower is characterized in that an extension (20) is provided at a tip of the tongue (6) in a reverse rotational direction that is reverse to a rotational direction of the impeller (2) in such a manner that it projects in the reverse rotational direction by a length that varies depending on the position in the axial line direction and that the gap between itself and the impeller (2) in the radial direction of the impeller (2) is kept approximately constant.
摘要翻译：旨在提供一种能够抑制噪声的产生的离心鼓风机，包括由舌片和叶轮之间的干扰引起的周期性噪声。离心式鼓风机设置有围绕旋转轴设置有多个叶片的叶轮（2）壳体（3），其容纳所述叶轮（2），并且在所述旋转轴的轴线方向上的一端具有吸引部; 围绕所述壳体（3）中的叶轮（2）形成的螺旋流动通道（4）; 以及用于抑制空气从螺旋流路（4）的卷绕端到卷绕原点的流入的舌部（6）。离心式鼓风机的特征在于，在与叶轮（2）的旋转方向相反的反向旋转方向上，在舌部（6）的前端设置有延伸部（20）反转旋转方向取决于轴线方向上的位置而变化的长度，并且其与叶轮（2）在叶轮（2）的径向方向上的间隙保持大致恒定。

25. 发明授权

US07748954B2 Centrifugal fan 有权
标题翻译：离心风机
公开(公告)号：US07748954B2
公开(公告)日：2010-07-06
申请号：US11702163
申请日：2007-02-05
申请人： Tsuyoshi Eguchi , Atsushi Suzuki , Tetsuo Tominaga , Mitsuhiro Nakao
发明人： Tsuyoshi Eguchi , Atsushi Suzuki , Tetsuo Tominaga , Mitsuhiro Nakao
IPC分类号： F01D5/22
CPC分类号： F04D29/162 , F04D29/282
摘要： A centrifugal fan includes a space in which the dimension between a shroud-facing wall and a shroud, from the outer peripheral side to the inner peripheral side of the shroud, is substantially uniform, wherein the shroud-facing wall includes a recess extending in the circumferential direction, the recess being disposed at the inner peripheral side of the outer peripheral end of the shroud-facing wall forming the space having the uniform dimension so that the recess forms a space larger than the other part.
摘要翻译：离心式风扇包括一个空间，其中护罩相对壁和护罩之间从护罩的外周侧到内周侧的尺寸基本上均匀，其中面向护罩的壁包括在其中延伸的凹部所述凹部设置在形成具有均匀尺寸的空间的面向护罩的外周端的内周侧，使得凹部形成比另一部分大的空间。

26. 发明申请

US20080110546A1 Apparatus and method for manufacturing semiconductor device 失效
标题翻译：半导体器件制造装置及方法
公开(公告)号：US20080110546A1
公开(公告)日：2008-05-15
申请号：US11892638
申请日：2007-08-24
申请人： Shoko Omizo , Atsushi Yoshimura , Mitsuhiro Nakao , Junya Sagara , Masayuki Dohi , Tatsuhiko Shirakawa
发明人： Shoko Omizo , Atsushi Yoshimura , Mitsuhiro Nakao , Junya Sagara , Masayuki Dohi , Tatsuhiko Shirakawa
IPC分类号： B32B38/10 , B32B37/14 , B32B38/18 , B32B38/00 , B32B41/00
CPC分类号： H01L21/67132 , B32B2038/1891 , Y10T29/49131 , Y10T29/49133 , Y10T29/53178 , Y10T29/53183 , Y10T156/16
摘要： An apparatus for manufacturing a semiconductor device, includes: a collet; an alignment stage; and a sheet feeding mechanism. The collet is configured to suck a surface of a semiconductor chip. The surface is on opposite side of a bonding surface to be bonded to a bonding target. The bonding surface is provided with a film-like adhesive layer. The collet includes a heater for heating the adhesive layer. The alignment stage is configured to support the semiconductor chip and to correct position of the semiconductor chip. The sheet feeding mechanism is configured to feed a release sheet onto the alignment stage.
摘要翻译：一种半导体器件的制造装置，包括：夹头; 对准阶段和送纸机构。夹头构造成吸附半导体芯片的表面。该表面位于与结合靶接合的接合面的相反侧。接合表面设置有膜状粘合剂层。夹头包括用于加热粘合剂层的加热器。对准台被配置为支撑半导体芯片并校正半导体芯片的位置。片材进给机构构造成将释放片材供给到对准台上。

27. 发明申请

US20070058068A1 Solid state imaging device, manufacturing method of the same, and substrate for solid state imaging device 有权
标题翻译：固态成像装置及其制造方法以及固态成像装置用基板
公开(公告)号：US20070058068A1
公开(公告)日：2007-03-15
申请号：US11599373
申请日：2006-11-15
申请人： Kenzo Fukuyoshi , Tadashi Ishimatsu , Keisuke Ogata , Mitsuhiro Nakao , Akiko Uchibori
发明人： Kenzo Fukuyoshi , Tadashi Ishimatsu , Keisuke Ogata , Mitsuhiro Nakao , Akiko Uchibori
IPC分类号： G02B13/16 , H04N5/225 , H01L21/82
CPC分类号： H01L27/14601 , H01L27/14627 , H01L27/14685
摘要： A method of manufacturing a solid state imaging device having photoelectric conversion devices, the method including: 1) forming a plurality of color filters differing in color from each other, 2) forming a transparent resin layer on the color filters, 3) forming an etching control layer on the transparent resin layer, the etching control layer being enabled to be etched at a different etching rate from the etching rate of the transparent resin layer, 4) forming a lens master on the etching control layer by using a heat-flowable resin material, 5) transferring a pattern of the lens master to the etching control layer by dry etching to form an intermediate micro lens, and 6) transferring a pattern of the intermediate micro lens to the transparent resin layer by dry etching to form the transfer lenses.
摘要翻译：一种制造具有光电转换装置的固态成像装置的方法，所述方法包括：1）形成多个不同颜色的滤色器，2）在滤色器上形成透明树脂层，3）形成蚀刻控制层，能够以与透明树脂层的蚀刻速率不同的蚀刻速率蚀刻蚀刻控制层，4）通过使用热可流动树脂在蚀刻控制层上形成透镜母版材料，5）通过干蚀刻将透镜主体的图案转移到蚀刻控制层以形成中间微透镜，以及6）通过干蚀刻将中间微透镜的图案通过干蚀刻转印到透明树脂层上以形成转印透镜。

28. 发明授权

US5763849A Wire bonding apparatus 失效
标题翻译：接线装置
公开(公告)号：US5763849A
公开(公告)日：1998-06-09
申请号：US771909
申请日：1996-12-23
申请人： Mitsuhiro Nakao
发明人： Mitsuhiro Nakao
IPC分类号： H01L21/60 , B23K20/00 , B23K11/16
CPC分类号： H01L24/85 , B23K20/007 , H01L24/78 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/4845 , H01L2224/78268 , H01L2224/78271 , H01L2224/78301 , H01L2224/85045 , H01L24/45 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079
摘要： In a wire bonding apparatus comprising a torch electrode for melting an end of a metallic thin wire to form a ball thereof, a high voltage detecting circuit for detecting a voltage between the metallic thin wire and the torch electrode in order to output the detected voltage as a voltage signal, a ball diameter calculator, and a ball diameter display device for displaying the ball diameter outputted from the ball diameter calculator, are further provided.
摘要翻译：在包括用于熔化金属细线的端部以形成其球的焊炬电极的引线接合装置中，用于检测金属细线和炬电极之间的电压的高电压检测电路，以将检测到的电压输出为进一步提供用于显示从球直径计算器输出的球直径的电压信号，球直径计算器和球直径显示装置。

29. 发明授权

US5592020A Semiconductor device with smaller package having leads with alternating offset projections 失效
标题翻译：具有较小封装的半导体器件具有交替偏置突起的引线
公开(公告)号：US5592020A
公开(公告)日：1997-01-07
申请号：US462564
申请日：1995-06-05
申请人： Mitsuhiro Nakao , Toshimitsu Ishikawa , Kazunori Hayashi
发明人： Mitsuhiro Nakao , Toshimitsu Ishikawa , Kazunori Hayashi
IPC分类号： H01L21/48 , H01L23/495 , H01L23/48
CPC分类号： H01L24/06 , H01L21/4842 , H01L23/49541 , H01L23/49551 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/49171 , H01L2224/49175 , H01L2224/4943 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/3011
摘要： Disclosed is a semiconductor device comprising an integrated circuit chip, a first lead having a portion extending substantially in parallel to one side plurality of the chip, and a second lead located adjacent to the first lead. Each of the first and second leads has a recess and a projection continuously. The first lead and second lead are arranged adjacent to each other with the recess and projection of the first lead being in engagement with the projection and recess of the second lead. Bonding wires are bonded on the projection of the first lead and the projection of the second lead. The bonding wires electrically connect the chip to the first lead and also to the second lead.
摘要翻译：公开了一种半导体器件，其包括集成电路芯片，第一引线，其具有基本上平行于多个芯片的一侧延伸的部分，以及位于第一引线附近的第二引线。第一和第二引线中的每一个连续地具有凹部和突起。第一引线和第二引线彼此相邻布置，第一引线的凹部和突起与第二引线的突起和凹槽接合。接合线结合在第一引线和第二引线的突起的突起上。接合线将芯片电连接到第一引线并且还连接到第二引线。

30. 发明授权

US08097485B2 Solid state image pickup device and manufacturing method thereof 有权
标题翻译：固体摄像装置及其制造方法
公开(公告)号：US08097485B2
公开(公告)日：2012-01-17
申请号：US11889070
申请日：2007-08-08
申请人： Keisuke Ogata , Kenzo Fukuyoshi , Tadashi Ishimatsu , Mitsuhiro Nakao , Satoshi Kitamura
发明人： Keisuke Ogata , Kenzo Fukuyoshi , Tadashi Ishimatsu , Mitsuhiro Nakao , Satoshi Kitamura
IPC分类号： H01L21/00
CPC分类号： G02B5/201 , G02B3/0018 , G02B3/0056 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H04N9/045
摘要： A method of manufacturing a solid state image pickup device including photoelectric conversion elements which are two-dimensionally arranged in a semiconductor substrate, and a color filter having a plurality of color filter patterns differing in color from each other and disposed on a surface of the semiconductor substrate according to the photoelectric conversion elements. The method including the steps of successively subjecting a plurality of filter layers differing in color from each other to a patterning process to form the plurality of color filter patterns. At least one color filter pattern to be formed at first among the plurality of color filter patterns is formed by means of dry etching, and the rest of the plurality of the color filter pattern is formed by means of photolithography.
摘要翻译：一种制造固体摄像装置的方法，该固体摄像装置包括二维排列在半导体衬底中的光电转换元件，以及滤色器，其具有彼此不同颜色的多个滤色器图案，并配置在半导体衬底的表面上基板根据光电转换元件。该方法包括以下步骤：将彼此不同颜色的多个滤光层连续地进行图案化处理，以形成多个滤色器图案。通过干法蚀刻形成要在多个滤色器图案中首先形成的至少一个滤色器图案，并且通过光刻法形成多个滤色器图案的其余部分。

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