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    • 21. 发明授权
    • Image sensor and method of forming the same
    • 图像传感器及其形成方法
    • US07531860B2
    • 2009-05-12
    • US12047941
    • 2008-03-13
    • Ki-Hong Kim
    • Ki-Hong Kim
    • H01L31/062H01L31/113H01L31/0232H01L31/00
    • H01L27/14636H01L27/14627
    • A method for forming an image sensor is provided. The method includes providing a semiconductor substrate having a pixel region and a peripheral circuit region, forming a photoelectric transformation section at the semiconductor substrate of the pixel region, forming a plurality of interlayer dielectrics over the semiconductor substrate with interconnections interposed therebetween, forming a passivation layer, partially patterning the passivation layer at the peripheral circuit region to form a via hole exposing the interconnection and removing the passivation layer and the underlying interlayer dielectric at the pixel region. The method further includes forming a conductive layer to fill the via hole and etching the conductive layer to remove the conductive layer at the pixel region and form a via plug and a conductive pad at the peripheral circuit region. The via plug fills the via hole and the conductive pad protrudes outwardly from the via hole.
    • 提供了一种用于形成图像传感器的方法。 该方法包括提供具有像素区域和外围电路区域的半导体衬底,在像素区域的半导体衬底处形成光电转换部分,在半导体衬底上形成多个层间电介质,其间插入互连,形成钝化层 ,在外围电路区域部分地图案化钝化层以形成暴露互连并在像素区域去除钝化层和下层层间电介质的通孔。 该方法还包括形成导电层以填充通孔并蚀刻导电层以去除像素区域处的导电层,并在外围电路区域形成通孔塞和导电垫。 通孔插头填充通孔,导电垫从通孔向外突出。