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21. 发明授权

US5181265A Optical coupling apparatus for introducing and coupling an incident light into a wave guide 失效
标题翻译：用于将入射光引入和耦合到波导中的光耦合装置
公开(公告)号：US5181265A
公开(公告)日：1993-01-19
申请号：US675527
申请日：1991-03-26
申请人： Seiji Nishiwaki , Shinji Uchida , Junichi Asada
发明人： Seiji Nishiwaki , Shinji Uchida , Junichi Asada
IPC分类号： G02B6/34 , G02B6/42 , G11B7/12
CPC分类号： G02B6/42 , G02B6/34 , G11B7/124
摘要： A photocoupler has a polarization converting device for converting laser light emitted from a laser source to a polarized beam of light having electric vectors oriented in a direction of a tangent of a circle having its center on an optical axis of the photocoupler and the phase of which beam is shifted by .pi. at the boundary of a declination line passing the center of the circle. The wave front of the converted laser light is spherical. And, a photocoupler for exciting a waveguided light which propagates radially from the center thereof is positioned so that the input coupling efficiency becomes maximum.

22. 发明授权

US5159650A Optical disk apparatus for recording and reproducing ultra-high density signals 失效
标题翻译：用于记录和再现超高密度信号的光盘设备
公开(公告)号：US5159650A
公开(公告)日：1992-10-27
申请号：US655356
申请日：1991-02-21
申请人： Seiji Nishiwaki , Shinji Uchida , Junichi Asada
发明人： Seiji Nishiwaki , Shinji Uchida , Junichi Asada
IPC分类号： G11B7/09 , G11B7/12 , G11B7/13 , G11B7/135
CPC分类号： G11B7/1381 , G11B7/0917 , G11B7/124 , G11B7/13 , G11B7/1365 , G11B7/1384
摘要： An optical disc apparatus includes an optical disk which satisfies the relationship of ##EQU1## where A.sub.s, .phi..sub.s are the amplitude reflectivity ratio and the phase difference between the regions within and out of a signal mark (27, 28) on a signal surface (16) of the optical disc, D.sub.s is the area of the signal mark (27, 28) and .lambda. is the wavelength of a light source (8), and the light reflected from signal surface (16) is input-coupled by a grating coupler (4A, 4B) into a waveguide layer to propagate as wave-guided light (18A, 18B), radiated at the end of the wave-guiding layer (3A, 3B) and received by a light detector (6A, 6B) so that a control signal and a reproduced signal can be obtained from the detector.
摘要翻译： PCT No.PCT / JP90 / 00843 Sec。 371日期1991年2月21日 102（e）日期1991年2月21日PCT Filed 1990年6月28日PCT公布。出版物WO91 / 00596 日期：1991年10月1日。一种光盘装置包括满足（Ascos phi s-1）> / = -Ds（As2-2Ascos phi s + 1）2/4λ2或Ascos phi的关系的光盘 = 1其中As，phi是光盘的信号表面（16）上的信号标记（27,28）内和之外的区域之间的振幅反射率和相位差，Ds是信号的面积标记（27,28），λ是光源（8）的波长，并且从信号表面（16）反射的光被光栅耦合器（4A，4B）输入耦合到波导层中以作为波（18A，18B）的端部辐射并由光检测器（6A，6B）接收的导光（18A，18B），从而可以从检测器获得控制信号和再现信号。

23. 发明授权

US5142394A Twisted nematic polarizing element with a concentric circle orientation surface and optical head device incorporating the same 失效
标题翻译：带有中心圆定向表面的双向极化极化元件和并入其的光学头装置
公开(公告)号：US5142394A
公开(公告)日：1992-08-25
申请号：US582418
申请日：1990-09-14
申请人： Junichi Asada , Seiji Nishiwaki , Shinji Uchida
发明人： Junichi Asada , Seiji Nishiwaki , Shinji Uchida
IPC分类号： G02F1/13 , G02B5/30 , G02B27/28 , G02F1/133 , G02F1/1337 , G11B7/135
CPC分类号： G11B7/1369 , G02B27/28 , G02B5/3016
摘要： An optical head device has a light source for emitting a light, a polarizing element for converting the linearly polarized emitted light into a concentric-circle polarized light or a radially polarized light, a concentric grating coupler through which the polarized light is introduced into a waveguide layer, and another polarizing element for converting the light radiated from the waveguide layer into a linearly polarized light. The light is applied to and reflected by the surface of an optical disk and introduced into the waveguide layer again as a concentric-circle polarized light or radially polarized light due to reversability of light, whereby the reflected light is detected. Each of the polarizing elements has a twist nematic liquid crystal layer having a linearly oriented liquid crystal orientation surface and a concentric-circle oriented liquid crystal orientation surface.

24. 发明授权

US5745221A Exposure equipment 失效
标题翻译：曝光设备
公开(公告)号：US5745221A
公开(公告)日：1998-04-28
申请号：US816831
申请日：1997-03-18
申请人： Seiji Nishiwaki , Junichi Asada , Keiichi Matsuzaki
发明人： Seiji Nishiwaki , Junichi Asada , Keiichi Matsuzaki
IPC分类号： G03F7/20 , G03B27/42 , G03B27/52
CPC分类号： G03F7/7035 , G03F7/70408
摘要： An exposure equipment which is simply configured and can expose fine cyclic patterns whose pitch is smaller than the wavelength of light source has the laser beam 2 (wavelength .lambda.) outgoing from the light source 1 reflected on the mirror 3a, 3b, guided to the beam expander optical system 4, and converged by a focusing lens 4a, passing through a pinhole 4c located on the focal plane of the focusing lens 4a, and converted into parallel beam 5 with the beam diameter expanded by a collimator lens 4b, wherein this parallel beam 5 vertically impinges on and penetrates a phase shifter 6 with recessed portion and protruded portion repeatedly formed on the outgoing surface side of the parallel flat plate configured with transparent material of refraction index n, and as a result, .+-. first order diffracted light is generated, and the .+-. first order diffracted lights interfere with one another on the sensitized film facing the phase shifter via a spacer 7 to form fine fringes, thereby exposing the sensitized film.
摘要翻译：简单地配置并能够露出间距小于光源波长的精细循环图案的曝光设备具有从反射镜3a，3b上反射的光源1射出的激光束2（波长λ），被引导到光束扩展器光学系统4，并且由聚焦透镜4a会聚，穿过位于聚焦透镜4a的焦平面上的针孔4c，并被转换成具有由准直透镜4b扩展的光束直径的平行光束5，其中该平行光束 5垂直地照射并穿过具有凹部的移相器6，并且突出部分重复地形成在构成有折射率n的透明材料的平行平板的出射面侧，结果是+/-一级衍射光并且+/-一级衍射光通过间隔物7在面向移相器的敏化膜上彼此干涉，以形成细条纹，从而展现出唱敏感胶卷。

25. 发明授权

US08797834B2 Objective lens, optical head, optical disk device, and information processing device 有权
标题翻译：物镜，光头，光盘装置及信息处理装置
公开(公告)号：US08797834B2
公开(公告)日：2014-08-05
申请号：US13699134
申请日：2011-05-31
申请人： Fumitomo Yamasaki , Hiroshi Shiroiwa , Yoshiaki Komma , Junichi Asada , Osamu Kajino , Noriaki Terahara , Toshiyasu Tanaka
发明人： Fumitomo Yamasaki , Hiroshi Shiroiwa , Yoshiaki Komma , Junichi Asada , Osamu Kajino , Noriaki Terahara , Toshiyasu Tanaka
IPC分类号： G11B7/135
CPC分类号： G11B7/1374 , G02B1/11 , G02B1/115 , G02B5/1814 , G02B27/0037 , G02B27/4294 , G11B7/1275 , G11B7/1353 , G11B7/1367 , G11B2007/0006
摘要： A disclosed objective lens includes: a lens having an entrance surface and an emission surface; and an anti-reflection coat formed on the emission surface, wherein a transmittance T1—0 [%] of the anti-reflection coat when an incident angle of a first laser beam having a first wavelength λ1 (390 nm≦λ1≦430 nm) is 0°, and the transmittance T1—40 [%] of the anti-reflection coat when the incident angle of the first laser beam is 40° satisfy 0.95≦T1—0/T1—40≦1.05, and a transmittance T2—0 [%] of the anti-reflection coat when an incident angle of a second laser beam having a second wavelength λ2 (630 nm≦λ2≦680 nm) is 0° and a transmittance T2—40 [%] of the anti-reflection coat when the incident angle of the second laser beam is 40° satisfy 0.85≦T2—0/T2—40≦0.97.
摘要翻译：所公开的物镜包括：具有入射表面和发射表面的透镜; 以及形成在发射表面上的防反射涂层，其中当具有第一波长λ1（390nm和nlE;λ1＆nlE; 430nm）的第一激光束的入射角时抗反射涂层的透射率T1-0 [％] 为0°，当第一激光束的入射角为40°时防反射涂层的透射率T1-40 [％]满足0.95＆nlE; T1-0 / T1-40＆nlE; 1.05，透射率T2- 当具有第二波长λ2（630nm＆nlE;λ2＆nlE; 680nm）的第二激光束的入射角为0°时的抗反射涂层的0 [％]和抗反射层的透射率T2-40 [％] 当第二激光束的入射角为40°时，涂层满足0.85＆nlE; T2-0 / T2-40＆nlE; 0.97。

26. 发明授权

US5944540A Operation assuring structure of electronic circuit board in connector for said circuit board 失效
标题翻译：操作确保用于所述电路板的连接器中的电子电路板的结构
公开(公告)号：US5944540A
公开(公告)日：1999-08-31
申请号：US95754
申请日：1998-06-11
申请人： Junichi Asada , Hideo Taguchi , Isao Baba , Toshiyasu Ito
发明人： Junichi Asada , Hideo Taguchi , Isao Baba , Toshiyasu Ito
IPC分类号： H01R13/658 , H05K1/02 , H05K1/11 , H05K3/34 , H05K9/00 , H01R4/66
CPC分类号： H01R12/721 , H05K9/0039 , H01R23/688 , H05K1/0218 , H05K1/117 , H05K3/3405
摘要： An operation assuring structure of an electronic circuit board in a connector for the electronic circuit board including an insert plate portion disposed on an end portion of an electronic circuit board and adapted to be inserted into a receiving port of a connector, a plurality of signal electronic pads arranged on a surface of the insert plate portion, and a plurality of signal contacts disposed within the receiving port of the connector and adapted to be contacted to the signal electrode pads, wherein a cut-off grounding contact, which is not conductive to the electronic circuit board, is interposed between the signal contacts within the receiving port, and the cut-off grounding contact has a length dimension enough to extend in parallel to the signal contacts and to interpose a distal end thereof between the signal electrode pads on the insert plate portion.
摘要翻译：一种用于电子电路板的连接器中的电子电路板结构的操作，包括设置在电子电路板的端部上并适于插入连接器的接收端口的插入板部分，多个信号电子布置在插入板部分的表面上的焊盘以及设置在连接器的接收端口内并且适于与信号电极焊盘接触的多个信号触点，其中截止接地触点对于电子电路板插入在接收端口内的信号触点之间，并且截止接地触头具有足够的长度尺寸以足以平行于信号触头延伸并且将其远端插入到插入件上的信号电极焊盘之间板部分。

27. 发明授权

US08581372B2 Semiconductor storage device and a method of manufacturing the semiconductor storage device 有权
标题翻译：半导体存储装置及半导体存储装置的制造方法
公开(公告)号：US08581372B2
公开(公告)日：2013-11-12
申请号：US13051405
申请日：2011-03-18
申请人： Junichi Asada , Taku Nishiyama , Atsuko Seki
发明人： Junichi Asada , Taku Nishiyama , Atsuko Seki
IPC分类号： H01L23/495 , H01L23/28
CPC分类号： H01L24/49 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49558 , H01L23/49575 , H01L23/49589 , H01L24/45 , H01L24/48 , H01L25/0655 , H01L25/0657 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/49171 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1434 , H01L2924/1438 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, a semiconductor storage device includes a plate and an external connection terminal. The plate is molded in a resin mold section. A semiconductor memory chip is placed on the plate. The external connection terminal is exposed to the outer circumferential surface of the semiconductor storage device. The plate includes a plurality of exposed portions exposed to the outer circumferential surface of the resin mold section. The plurality of exposed portions is electrically insulated from each other inside the resin mold section.
摘要翻译：根据一个实施例，半导体存储装置包括板和外部连接端子。板被模制在树脂模具部分中。半导体存储芯片放置在板上。外部连接端子暴露于半导体存储装置的外周面。该板包括暴露于树脂模具部分的外圆周表面的多个暴露部分。多个露出部分在树脂模具部分内彼此电绝缘。

28. 发明授权

US06429372B1 Semiconductor device of surface mounting type and method for fabricating the same 有权
标题翻译：表面安装型半导体器件及其制造方法
公开(公告)号：US06429372B1
公开(公告)日：2002-08-06
申请号：US09256220
申请日：1999-02-24
申请人： Hideo Taguchi , Junichi Asada , Jun Omori , Toshikazu Mino , Naohisa Okumura , Hiroshi Shimoe , Toshitsune Iijima , Katsuhiko Oyama
发明人： Hideo Taguchi , Junichi Asada , Jun Omori , Toshikazu Mino , Naohisa Okumura , Hiroshi Shimoe , Toshitsune Iijima , Katsuhiko Oyama
IPC分类号： H01L2328
CPC分类号： H01L24/85 , H01L23/3121 , H01L23/4985 , H01L23/49894 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05554 , H01L2224/32225 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/73215 , H01L2224/78301 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/20753 , H01L2924/351 , H01L2924/20752 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599
摘要： An IC chip and overhang portions are stuck to tape by an adhesive agent layer having elasticity. A plurality of solder balls are attached to the tape. By soldering the solder balls to a printed board, a semiconductor device is mounted. In the case where a temperature cycle has been caused, thermal stress occurs between the IC chip and the printed board or between the hangover portion and the printed board because of a difference in coefficient of thermal expansion between the IC chip or the hangover portion and the printed board. However, this thermal stress is absorbed by the elasticity of the adhesive agent layer. As a result, little thermal stress is applied to solder balls. Even if the above described temperature cycle is repeated, therefore, the solder balls are electrically connected to the printed board stably over a long period of time. In addition, the area of the tape is widened by the area of the hangover portions. Accordingly, a larger number of solder balls can be attached to the tape without reducing the size of each of the solder balls.
摘要翻译：通过具有弹性的粘合剂层将IC芯片和突出部分粘附到带上。多个焊球附着在带子上。通过将焊球焊接到印刷电路板上，安装半导体器件。在发生了温度循环的情况下，由于IC芯片或者宿醉部分之间的热膨胀系数不同，IC芯片和印刷电路板之间或者宿醉部分和印刷电路板之间产生热应力印刷板然而，这种热应力被粘合剂层的弹性所吸收。结果，焊球几乎没有热应力。因此，即使重复上述的温度循环，焊料球长期稳定地电连接到印刷电路板上。此外，带的面积由宿醉部分的面积加宽。因此，可以在不减小每个焊球的尺寸的情况下将更多数量的焊球附着到带上。

29. 发明授权

US06413798B1 Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same 有权
公开(公告)号：US06413798B1
公开(公告)日：2002-07-02
申请号：US09828131
申请日：2001-04-09
申请人： Junichi Asada
发明人： Junichi Asada
IPC分类号： H01L2144
摘要： A semiconductor package of this invention has an insulating substrates, wiring layers disposed on the surface of the insulating substrate, a semiconductor chip disposed in a device hole provided in the insulating substrate, inner-joint-conductors for connecting at least part of the bonding pads on the surface of the semiconductor chip to the corresponding inner-joint-conductors and connection lands connected to the wiring layers. The device hole is provided so that it goes through the center of the insulating substrate. The semiconductor chip is thinner than the insulating substrate. Then, this semiconductor chip is disposed in the device hole such that a bottom thereof is flush with a bottom plane of the insulating substrate. Further, this invention provides a MCM in which plural pieces of the thin semiconductor packages are laminated. In the MCM, the semiconductor packages are laminated such that top and bottom faces of the thin silicon chip are inverted. Predetermined connection lands are electrically connected to each other through a connecting conductor. This MCM has a high mechanical strength in its stacked structure and there is a low possibility that crack may occur in the package due to stress in the bending direction.

30. 发明授权

US06239496B1 Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same 失效
标题翻译：具有非常薄的半导体芯片，由封装组装的多芯片模块的封装及其制造方法
公开(公告)号：US06239496B1
公开(公告)日：2001-05-29
申请号：US09484032
申请日：2000-01-18
申请人： Junichi Asada
发明人： Junichi Asada
IPC分类号： H01L2348
CPC分类号： H01L21/6836 , H01L21/563 , H01L23/3107 , H01L24/29 , H01L25/105 , H01L2221/68327 , H01L2223/54473 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/01022 , H01L2924/01028 , H01L2924/3512 , H01L2924/00 , H01L2224/48 , H01L2224/05599
摘要： A semiconductor package of this invention has an insulating substrates, wiring layers disposed on the surface of the insulating substrate, a semiconductor chip disposed in a device hole provided in the insulating substrate, inner-joint-conductors for connecting at least part of the bonding pads on the surface of the semiconductor chip to the corresponding inner-joint-conductors and connection lands connected to the wiring layers. The device hole is provided so that it goes through the center of the insulating substrate. The semiconductor chip is thinner than the insulating substrate. Then, this semiconductor chip is disposed in the device hole such that a bottom thereof is flush with a bottom plane of the insulating substrate. Further, this invention provides a MCM in which plural pieces of the thin semiconductor packages are laminated. In the MCM, the semiconductor packages are laminated such that top and bottom faces of the thin silicon chip are inverted. Predetermined connection lands are electrically connected to each other through a connecting conductor. This MCM has a high mechanical strength in its stacked structure and there is a low possibility that crack may occur in the package due to stress in the bending direction.
摘要翻译：本发明的半导体封装具有绝缘基板，布置在绝缘基板表面上的布线层，设置在绝缘基板中的器件孔中的半导体芯片，用于连接至少部分接合焊盘的内部接头导体在半导体芯片的表面上连接到相应的内部接头导体和连接到布线层的连接焊盘。设备孔设置成穿过绝缘基板的中心。半导体芯片比绝缘基板薄。然后，将该半导体芯片设置在器件孔中，使得其底部与绝缘基板的底面齐平。此外，本发明提供一种MCM，其中层叠有多片薄的半导体封装。在MCM中，层叠半导体封装，使得薄硅芯片的顶面和底面倒置。预定的连接焊盘通过连接导体彼此电连接。该MCM在其堆叠结构中具有高机械强度，并且由于弯曲方向上的应力，在封装中可能发生裂纹的可能性较小。

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