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21. 发明授权

US07315086B2 Chip-on-board package having flip chip assembly structure and manufacturing method thereof 有权
标题翻译：片上封装具有倒装芯片组装结构及其制造方法
公开(公告)号：US07315086B2
公开(公告)日：2008-01-01
申请号：US11181145
申请日：2005-07-13
申请人： Dong-Han Kim , Sa-Yoon Kang , Seok-Won Lee
发明人： Dong-Han Kim , Sa-Yoon Kang , Seok-Won Lee
IPC分类号： H01L23/42 , H01L23/58 , H01L23/14
CPC分类号： H01L23/49816 , H01L23/13 , H01L23/5384 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/90 , H01L2224/11334 , H01L2224/13144 , H01L2224/16237 , H01L2224/451 , H01L2224/48227 , H01L2224/48228 , H01L2224/81201 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/90 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H05K1/112 , H05K1/189 , H05K2201/0394 , H05K2201/09472 , H05K2201/10674 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401 , H01L2924/00012
摘要： A chip-on-board (COB) package has a flip chip assembly structure and is used for an integrated circuit (IC) card. The COB package has conductive patterns as contact terminals on an outer surface of a non-conductive film, and an IC chip on an inner surface of the film. The film has a number of holes through which the conductive patterns are partly exposed. A number of conductive bumps on an active surface of the IC chip face the inner surface of the film and enter corresponding holes in the non-conductive film to mechanically join and electrically couple to the conductive patterns. The disclosed COB package and a related manufacturing method allow a reduction in production cost, simplified process, better electrical connections, and improved reliability.
摘要翻译：片上芯片（COB）封装具有倒装芯片组装结构，用于集成电路（IC）卡。 COB封装具有作为非导电膜的外表面上的接触端子的导电图案和膜的内表面上的IC芯片。该膜具有多个孔，导电图案通过该孔部分露出。 IC芯片的有源表面上的多个导电凸块面向薄膜的内表面，并且在非导电薄膜中进入相应的孔以机械地连接并电耦合到导电图案。所公开的COB封装和相关制造方法允许降低生产成本，简化工艺，更好的电连接和改进的可靠性。

22. 发明申请

US20060028573A1 Image sensor camera module and method of fabricating the same 有权
公开(公告)号：US20060028573A1
公开(公告)日：2006-02-09
申请号：US11177451
申请日：2005-07-07
申请人： Byoung-Rim Seo , Jae-Cheon Doh , Yung-Cheol Kong , Seok-Won Lee
发明人： Byoung-Rim Seo , Jae-Cheon Doh , Yung-Cheol Kong , Seok-Won Lee
IPC分类号： H04N5/225
CPC分类号： H04N5/2254
摘要： The invention involves an image sensor camera module and a method of fabricating the image sensor camera module. The image sensor camera module uses a single-body type lens holder defined by a hollow cylindrical body having a shoulder protruding radially inwardly from an inner surface thereof. First and second lenses therein are spaced apart by a first spacer and a filter therein is spaced from the second lens by a second spacer. An image sensor is adhered to a lower rim of the body, and the filter is adhered to an upper rim thereof. All optical elements within the lens holder thus are affixed in fixed relative position compatible with a predefined focal length and axis. Moreover, the adhesively sealed interior of the body of the image sensor camera module prevents particulate contamination.

23. 发明申请

US20050258502A1 Chip package, image sensor module including chip package, and manufacturing method thereof 审中-公开
标题翻译：芯片封装，包括芯片封装的图像传感器模块及其制造方法
公开(公告)号：US20050258502A1
公开(公告)日：2005-11-24
申请号：US11130586
申请日：2005-05-16
申请人： Yung-Cheol Kong , Jae-Cheon Doh , Byoung-Rim Seo , Seok-Won Lee
发明人： Yung-Cheol Kong , Jae-Cheon Doh , Byoung-Rim Seo , Seok-Won Lee
IPC分类号： H01L27/14 , H01L23/00 , H01L23/12 , H01L27/146 , H01L31/0203 , H01L31/10 , H04N5/225 , H04N5/335 , H04N5/374
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14685 , H01L31/0232 , H01L2224/05571 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , H01L2224/05599
摘要： A chip package, an image sensor module including the same and a manufacturing method thereof. The chip package includes an image sensor chip having a plurality of bonding pads, a packaging substrate having a plurality of connection pads, an adhesive insulator, a plurality of conductive fillers, and a sealing insulator. The packaging substrate is mounted on the image sensor chip through the adhesive insulator, so that a light receiving area of the image sensor chip and an opening of the packaging substrate are vertically aligned. A plurality of through holes are formed to penetrate from portions of the connection pads to the packaging substrate. The through holes may be filled with the conductive fillers that are electrically connected between the bonding pads and the connection pads. The sealing insulator may protect the connective fillers.
摘要翻译：芯片封装，包括该芯片封装的图像传感器模块及其制造方法。芯片封装包括具有多个焊盘的图像传感器芯片，具有多个连接焊盘的封装基板，粘合绝缘体，多个导电填料和密封绝缘体。通过粘合绝缘体将封装基板安装在图像传感器芯片上，使得图像传感器芯片的光接收区域和封装基板的开口垂直对齐。多个通孔形成为从连接焊盘的部分穿透到封装基板。通孔可以填充有电连接在接合焊盘和连接焊盘之间的导电填料。密封绝缘子可以保护连接填料。

24. 发明授权

US09640549B2 Vertical memory device with gate lines at the same level connected 有权
公开(公告)号：US09640549B2
公开(公告)日：2017-05-02
申请号：US14534181
申请日：2014-11-06
申请人： Seok-Won Lee , Joon-Hee Lee , Dong-Seog Eun , Chang-Hyun Lee
发明人： Seok-Won Lee , Joon-Hee Lee , Dong-Seog Eun , Chang-Hyun Lee
IPC分类号： H01L27/115 , H01L27/11582 , H01L27/11556 , G11C5/06 , H01L27/11548 , H01L27/11575 , G11C8/14 , H01L29/66 , H01L29/788 , H01L29/792
CPC分类号： H01L27/11582 , G11C5/063 , G11C8/14 , H01L27/11548 , H01L27/11556 , H01L27/11575 , H01L29/66825 , H01L29/66833 , H01L29/7889 , H01L29/7926
摘要： A vertical memory device includes a substrate, a channel, gate lines and a connecting portion. A plurality of the channels extend in a first direction which is vertical to a top surface of a substrate. A plurality of the gate lines are stacked in the first direction to be spaced apart from each other and extend in a second, lengthwise direction, each gate line intersecting a set of channels and surrounding outer sidewalls of each channel of the set of channels. The gate lines forms a stepped structure which includes a plurality of vertical levels. A connecting portion connects a group of gate lines of the plurality of gate lines located at the same vertical level, the connecting portion diverging from the second direction in which the gate lines of the group of gate lines extend.

25. 发明申请

US20100240078A1 METHODS AND COMPOSITIONS FOR DIAGNOSIS AND/OR PROGNOSIS IN SYSTEMIC INFLAMMATORY RESPONSE SYNDROMES 有权
标题翻译：用于系统性炎症反应综合征诊断和/或预防的方法和组合物
公开(公告)号：US20100240078A1
公开(公告)日：2010-09-23
申请号：US12663841
申请日：2008-06-27
申请人： Seok-Won Lee , Kelline M. Rodems , David W. Oelschlager , Uday Kumar Veeramallu , Joseph F. Buechler , Paul H. McPherson
发明人： Seok-Won Lee , Kelline M. Rodems , David W. Oelschlager , Uday Kumar Veeramallu , Joseph F. Buechler , Paul H. McPherson
IPC分类号： G01N33/53
CPC分类号： G01N33/6893 , G01N2333/521 , G01N2800/26 , G01N2800/50 , G01N2800/56
摘要： The present invention relates to methods and compositions for diagnosing SIRS, sepsis, severe sepsis, septic shock, or MODS in a subject, or assigning a prognostic risk for one or more clinical outcomes for a subject suffering from SIRS, sepsis, severe sepsis, septic shock, or MODS, the method comprising performing an immunoassay for CCL23 splice variant.
摘要翻译：本发明涉及用于诊断受试者的SIRS，败血症，严重败血症，败血性休克或MODS的方法和组合物，或为患有SIRS，败血症，严重败血症，败血症的受试者分配一种或多种临床结果的预后风险休克或MODS，所述方法包括对CCL23剪接变体进行免疫测定。

26. 发明申请

US20060006486A1 Image sensor package and method of manufacturing the same 有权
标题翻译：图像传感器封装及其制造方法
公开(公告)号：US20060006486A1
公开(公告)日：2006-01-12
申请号：US11150825
申请日：2005-06-10
申请人： Byoung-Rim Seo , Jae-Cheon Do , Yung-Cheol Kong , Seok-Won Lee
发明人： Byoung-Rim Seo , Jae-Cheon Do , Yung-Cheol Kong , Seok-Won Lee
IPC分类号： H01L31/0203
CPC分类号： H01L27/14625 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.
摘要翻译：图像传感器封装组装方法包括提供其上安装有多个图像传感器的基板; 提供具有多个壳体的壳体带，所述多个壳体对应于所述基板上的所述图像传感器的布置而布置，每个所述壳体具有对应于相应图像传感器的有效表面的孔，以及封闭相应图像传感器的边缘的空腔 ; 在将所述壳体条附接到所述基底上之后，附接透明盖板，其将所述壳体的所述孔密封在所述壳体条上; 并通过连续地切割透明盖，壳体条和基底来分离图像传感器封装。可以实现提高产量和生产效率。

27. 发明授权

US06831424B2 Light source device of a liquid crystal display 失效
标题翻译：液晶显示器的光源装置
公开(公告)号：US06831424B2
公开(公告)日：2004-12-14
申请号：US09976125
申请日：2001-10-12
申请人： Sang-Hyuck Youn , Seok-Won Lee , Jeong-Hwan Lee
发明人： Sang-Hyuck Youn , Seok-Won Lee , Jeong-Hwan Lee
IPC分类号： H05B4116
CPC分类号： H05B41/00 , G02F1/133604 , G02F1/133615 , G02F2001/133612 , H05B41/02
摘要： Disclosed is a light source device capable of minimizing leakage of power supplied to a lamp of a liquid crystal display device. A plurality of power supply lines is extended between the lamp for generating light and an inverting board for receiving the power source from the outside to supply power to the lamp. The plurality of the power supply lines is coated with a shrinkable tube to be spaced apart from one another. Accordingly, the leakage of the power source that is generated from the first, second, third and fourth power supply lines due to a coupling phenomenon thereof is minimized.
摘要翻译：公开了能够最小化供给液晶显示装置的灯的电力的泄漏的光源装置。在用于产生光的灯和用于从外部接收电源以向灯供电的反相板之间延伸多个电源线。多个电源线被可收缩管涂覆以彼此间隔开。因此，由于其耦合现象而从第一，第二，第三和第四电源线产生的电源的泄漏最小化。

28. 发明授权

US5964569A Panel positioning device 失效
标题翻译：面板定位装置
公开(公告)号：US5964569A
公开(公告)日：1999-10-12
申请号：US940982
申请日：1997-09-30
申请人： Seok-Won Lee
发明人： Seok-Won Lee
IPC分类号： G09F9/00 , G02F1/133 , G02F1/1333 , B25J15/00
CPC分类号： G02F1/1333 , G02F2001/133354 , Y10S248/913 , Y10S269/903
摘要： An improved panel positioning device which can be easily and accurately regulated by linearly regulating a heightwise displacement of the panel. A panel is mounted to an upper portion of a holder, and the holder is pivotally mounted to a holder support plate, a first regulating plate provided with first and second side plates on both sides is located below the holder support plate. First through fifth regulating knobs regulates a pivot angle, a lengthwise position, a widthwise position, a pivot angle about a lengthwise axis, and a heightwise position of the holder respectively. A third regulating plate for regulating the heightwise position of the holder is mounted to a side frame so as to be lengthwisely moved and is engaged with the fifth regulating knob at one side thereof. A first pin is fixed to the second regulating plate, and a linear inclined slit which extends from an upper portion of one lengthwise side thereof to a lower end of the other lengthwise side thereof and into which the first pin is inserted and penetrated is formed at one width side thereof. When the fifth regulating knob is rotated, the first pin of the second regulating plate is guided by the inclined slit. The second regulating plate is heightwisely moved with respect to the side frame and linearly proportional to the rotational displacement of the fifth regulating knob, and thus regulating the heightwise displacement of the panel easily and accurately.
摘要翻译：一种改进的面板定位装置，其可以通过线性调节面板的高度位移来容易且精确地调节。面板安装在支架的上部，支架枢转地安装在支架支撑板上，设置在两侧的第一和第二侧板的第一调节板位于支架支撑板的下方。第一至第五调节旋钮分别调节摆动角度，纵向位置，宽度方向位置，绕纵向轴线的转动角度和支架的高度位置。用于调节保持器的高度位置的第三调节板安装在侧框架上以便纵向移动并且在其一侧与第五调节旋钮接合。第一销被固定到第二调节板上，并且从其一个纵向侧的上部延伸到另一个纵向侧的下端，并且第一销被插入并穿过该线性倾斜狭缝形成在其宽度一侧。当第五调节旋钮旋转时，第二调节板的第一销由倾斜狭缝引导。第二调节板相对于侧框架高度移动并与第五调节旋钮的旋转位移成线性比例，从而容易且准确地调节面板的高度位移。

29. 发明授权

US5936757A Thin film actuated mirror array 失效
标题翻译：薄膜致动反射镜阵列
公开(公告)号：US5936757A
公开(公告)日：1999-08-10
申请号：US877645
申请日：1997-06-17
申请人： Dong-Kuk Kim , Jeong-Beom Ji , Seok-Won Lee
发明人： Dong-Kuk Kim , Jeong-Beom Ji , Seok-Won Lee
IPC分类号： G02B26/08 , G02B26/00
CPC分类号： G02B26/0858
摘要： There is provided an array of M.times.N thin film actuated mirrors for use in an optical projection system comprising an active matrix, an array of M.times.N thin film actuating structures, each of the thin film actuating structures including at least a thin film layer of a motion-inducing material, a pair of electrodes, each of the electrodes being provided on top and bottom of the thin film motion-inducing layer, an array of M.times.N supporting members, each of the supporting members being used for holding each of the actuating structures in place by cantilevering each of the actuating structures and also for electrically connecting each of the actuating structures and the active matrix, and an array of M.times.N mirrors for reflecting light beams, each of the mirrors being placed on top of each of the actuating structures. An electrical signal is applied across the thin film layer of the motion-inducing material located between the pair of electrodes in each of the actuating structures, causing a deformation thereof, which will in turn deform the mirror placed on top thereof.
摘要翻译：提供了一种用于光学投影系统的MxN薄膜致动反射镜阵列，该光学投影系统包括有源矩阵，MxN薄膜致动结构的阵列，每个薄膜致动结构至少包括一个运动 - 诱导材料，一对电极，每个电极设置在薄膜运动感应层的顶部和底部，MxN支撑构件的阵列，每个支撑构件用于将每个致动结构保持在适当位置通过悬吊每个致动结构以及用于电连接致动结构和有源矩阵中的每一个以及用于反射光束的MxN反射镜阵列，每个反射镜被放置在每个致动结构的顶部。在每个致动结构中的每一个致动结构中的电极之间施加电信号穿过位于一对电极之间的运动感应材料的薄膜层，从而导致其变形，这反过来又将放置在其顶部上的反射镜变形。

30. 发明授权

US5900998A Thin film actuated mirror array and method for the manufacture thereof 失效
标题翻译：薄膜致动反射镜阵列及其制造方法
公开(公告)号：US5900998A
公开(公告)日：1999-05-04
申请号：US877084
申请日：1997-06-17
申请人： Dong-Kuk Kim , Jeong-Beom Ji , Seok-Won Lee
发明人： Dong-Kuk Kim , Jeong-Beom Ji , Seok-Won Lee
IPC分类号： H04N9/31 , B81B3/00 , B81C1/00 , G02B26/08 , G02F1/29 , G09F19/16 , G09F19/18 , H01L41/09 , H04N5/74 , G02B7/182 , G02B5/08
CPC分类号： G02B26/0858 , Y10S359/904
摘要： There is provided an array of M.times.N thin film actuated mirrors for use in an optical projection system comprising an active matrix, an array of M.times.N thin film actuating structures, each of the thin film actuating structures including at least a thin film layer of a motion-inducing material, a pair of electrodes, each of the electrodes being provided on top and bottom of the thin film motion-inducing layer, an array of M.times.N supporting members, each of the supporting members being used for holding each of the actuating structures in place by cantilevering each of the actuating structures and also for electrically connecting each of the actuating structures and the active matrix, and an array of M.times.N mirrors for reflecting light beams, each of the mirrors being placed on top of each of the actuating structures. An electrical signal is applied across the thin film layer of the motion-inducing material located between the pair of electrodes in each of the actuating structures, causing a deformation thereof, which will in turn deform the mirror placed on top thereof.
摘要翻译：提供了一种用于光学投影系统的MxN薄膜致动反射镜阵列，该光学投影系统包括有源矩阵，MxN薄膜致动结构的阵列，每个薄膜致动结构至少包括一个运动 - 诱导材料，一对电极，每个电极设置在薄膜运动感应层的顶部和底部，MxN支撑构件的阵列，每个支撑构件用于将每个致动结构保持在适当位置通过悬吊每个致动结构以及用于电连接致动结构和有源矩阵中的每一个以及用于反射光束的MxN反射镜阵列，每个反射镜被放置在每个致动结构的顶部。在每个致动结构中的每一个致动结构中的电极之间施加电信号穿过位于一对电极之间的运动感应材料的薄膜层，从而导致其变形，这反过来又将放置在其顶部上的反射镜变形。

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