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    • 23. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US06740958B2
    • 2004-05-25
    • US10115101
    • 2002-04-04
    • Shinji NakazatoHideaki UchidaYoshikazu SaitoMasahiro YamamuraYutaka KobayashiTakahide IkedaRyoichi HoriGoro KitsukawaKiyoo ItohNobuo TanbaTakao WatanabeKatsuhiro ShimohigashiNoriyuki Homma
    • Shinji NakazatoHideaki UchidaYoshikazu SaitoMasahiro YamamuraYutaka KobayashiTakahide IkedaRyoichi HoriGoro KitsukawaKiyoo ItohNobuo TanbaTakao WatanabeKatsuhiro ShimohigashiNoriyuki Homma
    • H01L2900
    • H01L27/0623H01L27/0214H01L27/0218H01L27/0922H01L27/105H01L27/10805
    • Disclosed is a semiconductor device, such as a semiconductor memory device, having structure wherein invasion of minority carriers from the semiconductor substrate into components of the device, formed on the substrate, can be avoided. The semiconductor memory device can be an SRAM or DRAM, for example, and includes a memory array and peripheral circuit on a substrate. In one aspect of the present invention, a buried layer of the same conductivity type as that of the substrate, but with a higher impurity concentration than that of the substrate, is provided beneath at least one of the peripheral circuit and memory array. A further region can extend from the buried layer, for example, to the surface of the semiconductor substrate, the buried layer and further region in combination acting as a shield to prevent minority carriers from penetrating to the device elements. As a second aspect of the present invention, first carrier absorbing areas (to absorb minority carriers) are located between the memory array and the switching circuit of the peripheral circuit, and second carrier absorbing areas are provided to surround input protective elements of the device. As a third embodiment of the present invention, a plurality of isolation regions of the same conductivity type are provided, with unequal voltages applied to these isolation regions, or unequal voltages applied to the substrate, on the one hand, and to these isolation regions, on the other.
    • 公开了一种半导体器件,例如半导体存储器件,其结构可以避免少数载流子从半导体衬底侵入形成在衬底上的器件的部件。 半导体存储器件例如可以是SRAM或DRAM,并且在衬底上包括存储器阵列和外围电路。 在本发明的一个方面中,在外围电路和存储器阵列中的至少一个之下提供与衬底相同的导电类型但具有比衬底的杂质浓度更高的杂质浓度的掩埋层。 另外的区域可以例如从掩埋层延伸到半导体衬底的表面,掩埋层和组合的另外的区域用作屏蔽以防止少数载流子穿透到器件元件。 作为本发明的第二方面,第一载流子吸收区域(以吸收少数载流子)位于存储器阵列和外围电路的开关电路之间,并且第二载流子吸收区域被设置为环绕该器件的输入保护元件。 作为本发明的第三实施例,提供了相同导电类型的多个隔离区域,一方面施加到这些隔离区域的不同电压或施加到基板的不同电压以及这些隔离区域, 在另一。
    • 26. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US5148255A
    • 1992-09-15
    • US645351
    • 1991-01-23
    • Shinji NakazatoHideaki UchidaYoshikazu SaitoMasahiro YamamuraYutaka KobayashiTakahide IkedaRyoichi HoriGoro KitsukawaKiyoo ItohNobuo TanbaTakao WatanabeKatsuhiro ShimohigashiNoriyuki Homma
    • Shinji NakazatoHideaki UchidaYoshikazu SaitoMasahiro YamamuraYutaka KobayashiTakahide IkedaRyoichi HoriGoro KitsukawaKiyoo ItohNobuo TanbaTakao WatanabeKatsuhiro ShimohigashiNoriyuki Homma
    • H01L27/02H01L27/06H01L27/092H01L27/105H01L27/108
    • H01L27/10805H01L27/0214H01L27/0623H01L27/0922H01L27/0218H01L27/105
    • Disclosed is a semiconductor device, such as a semiconductor memory device, having structure wherein invasion of minority carriers from the semiconductor substrate into components of the device, formed on the substrate, can be avoided. The semiconductor memory device can be an SRAM or DRAM, for example, and includes a memory array and peripheral circuit on a substrate. In one aspect of the present invention, a buried layer of the same conductivity type as that of the substrate, but with a higher impurity concentration than that of the substrate, is provided beneath at least one of the peripheral circuit and memory array. A further region can extend from the buried layer, for example, to the surface of the semiconductor substrate, the buried layer and further region in combination acting as a shield to prevent minority carriers from penetrating to the device elements. As a second aspect of the present invention, first carrier absorbing areas (to absorb minority carriers) are located between the memory array and the switching circuit of the peripheral circuit, and second carrier absorbing areas are provided to surround input protective elements of the device. As a third embodiment of the present invention, a plurality of isolation regions of the same conductivity type are provided, with unequal voltages applied to these isolation regions, or unequal voltages applied to the substrate, on the one hand, and to these isolation regions, on the other.
    • 公开了一种半导体器件,例如半导体存储器件,其结构可以避免少数载流子从半导体衬底侵入形成在衬底上的器件的部件。 半导体存储器件例如可以是SRAM或DRAM,并且在衬底上包括存储器阵列和外围电路。 在本发明的一个方面中,在外围电路和存储器阵列中的至少一个之下提供与衬底相同的导电类型但具有比衬底的杂质浓度更高的杂质浓度的掩埋层。 另外的区域可以例如从掩埋层延伸到半导体衬底的表面,掩埋层和组合的另外的区域用作屏蔽以防止少数载流子穿透到器件元件。 作为本发明的第二方面,第一载流子吸收区域(以吸收少数载流子)位于存储器阵列和外围电路的开关电路之间,并且第二载流子吸收区域被设置为环绕该器件的输入保护元件。 作为本发明的第三实施例,提供了相同导电类型的多个隔离区域,一方面施加到这些隔离区域的不同电压或施加到基板的不同电压以及这些隔离区域, 在另一。
    • 27. 发明授权
    • Semiconductor integrated circuit
    • 半导体集成电路
    • US4928265A
    • 1990-05-22
    • US266148
    • 1988-11-02
    • Hisayuki HiguchiNoriyuki HommaMakoto SuzukiSuguru Tachibana
    • Hisayuki HiguchiNoriyuki HommaMakoto SuzukiSuguru Tachibana
    • G11C11/416
    • G11C11/416
    • Considering the dispersion in the access time of semiconductor memories, at least a first and a second memory circuit are connected to the output of a sense amplifier. The output of the sense amplifier is an input to these two memory circuits alternatively at different timings. The data stored in these memory circuits are alternately transferred to a data output circuit. Even when the access time becomes long, the desired sense data can be successively read out from the output of the data output circuit at a short time interval determined by the clock cycle. When the access time becomes short and even when a second data is generated from the output of the sense amplifier at the timing of transferring a first data in the first memory circuit to the data output circuit, the first data held in the first memory circuit is prevented from being renewed by the second data. In this case too, the desired sense data can be successively read out from the output of the data output circuit at a time interval determined by the clock cycle.
    • 考虑到半导体存储器的访问时间的偏差,至少第一和第二存储器电路连接到读出放大器的输出。 读出放大器的输出是以不同的定时交替地输入到这两个存储器电路。 存储在这些存储器电路中的数据被交替地传送到数据输出电路。 即使当访问时间变长时,可以在由时钟周期确定的短时间间隔内从数据输出电路的输出端连续地读出期望的感测数据。 当访问时间变短时,即使在将第一存储器电路中的第一数据传送到数据输出电路的定时从读出放大器的输出产生第二数据时,保持在第一存储器电路中的第一数据为 防止第二个数据被更新。 在这种情况下,也可以在由时钟周期确定的时间间隔内从数据输出电路的输出端连续读出期望的检测数据。
    • 29. 发明授权
    • BI-MOS semiconductor memory having high soft error immunity
    • 具有高软错误抗扰度的BI-MOS半导体存储器
    • US4866673A
    • 1989-09-12
    • US38940
    • 1987-04-16
    • Hisayuki HiguchiMakoto SuzukiNoriyuki HommaKiyoo Itoh
    • Hisayuki HiguchiMakoto SuzukiNoriyuki HommaKiyoo Itoh
    • G11C11/41G11C11/416G11C11/418G11C11/419
    • G11C11/418G11C11/419
    • A semiconductor memory is provided having high reliability, and which particularly prevents data destruction by .alpha. rays, and the like. In a semiconductor memory for detecting memory data from the conduction ratio between a transistor of a flip-flop type memory cell connected to selected word line and data line pairs and a load device of the data line, an arrangement is provided for setting the word line voltage to a voltage lower than the sum of the data line voltage and the threshold voltage of a data transfer MOS transistor of the memory cell. The signal read out from the memory cell is then applied through the data line to a differential amplifier using the base or gate of a junction type transistor as its input. Particularly to set the word line voltage to a voltage lower than the sum of the data line voltage and the threshold voltage of the data transfer MOS transistor of the memory cell, a device having high driving capability such as a bipolar transistor is used as the load of the data line. The word line voltage is changed over to two stages so that the data line voltage V.sub.D and the word line voltage V.sub.W satisfy the relation V.sub.W V.sub.D +V.sub.TH in a write cycle (where V.sub.TH is the threshold voltage of NMOS inside the memory cell).
    • 提供具有高可靠性的半导体存储器,并且特别地防止由α射线引起的数据破坏等。 在用于根据连接到所选字线的触发器型存储单元的晶体管与数据线对之间的导通率以及数据线的负载装置的导通比来检测存储器数据的半导体存储器中,提供了用于设置字线 电压低于数据线电压和存储单元的数据传输MOS晶体管的阈值电压之和的电压。 从存储单元读出的信号然后通过数据线施加到使用结型晶体管的基极或栅极作为其输入的差分放大器。 特别是为了将字线电压设定为低于数据线电压和存储单元的数据传输MOS晶体管的阈值电压之和的电压,使用诸如双极型晶体管的具有高驱动能力的器件作为负载 的数据线。 字线电压转换为两级,使得数据线电压VD和字线电压VW在读周期中满足关系VW VD + VTH(其中VTH 是存储单元内的NMOS的阈值电压)。