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21. 发明授权

US07787349B2 Optical pickup lens and optical pickup apparatus 有权
标题翻译：光学拾取镜头和光学拾取装置
公开(公告)号：US07787349B2
公开(公告)日：2010-08-31
申请号：US11405436
申请日：2006-04-18
申请人： Koichiro Wakabayashi , Mitsuhiro Miyauchi , Yasuyuki Sugi , Yutaka Makino
发明人： Koichiro Wakabayashi , Mitsuhiro Miyauchi , Yasuyuki Sugi , Yutaka Makino
IPC分类号： G11B7/00
CPC分类号： G11B7/1374 , G11B7/13922 , G11B2007/0006
摘要： An optical pickup lens focuses laser beams having different wavelengths λ1, λ2 and λ3 on at least three kinds of optical discs. At least one side of the optical pickup lens has a concentric loop zonal structure for compensating wavefront aberration occurring when recording or reproducing an optical disc having a substrate thickness t1 by the laser beam having the wavelength λ1 and wavefront aberration occurring when recording or reproducing an optical disc having a substrate thickness t2 by the laser beam having the wavelength λ2. When recording or reproducing an optical disc having a substrate thickness t3 by the laser beam having the wavelength λ3, a phase difference given to the laser beam having the wavelength λ3 due to the concentric loop zonal structure is about 0.15λ or smaller.
摘要翻译：光拾取透镜将具有不同波长λ1，λ2和λ3的激光束聚焦在至少三种光盘上。光学拾取透镜的至少一侧具有同心环状区域结构，用于补偿当记录或再现具有波长λ1的激光束和当记录或再现光学时产生的波前像差而具有基板厚度t1的光盘时发生的波前像差通过具有波长λ2的激光束具有衬底厚度t2的光盘。当通过具有波长λ3的激光束记录或再现具有基板厚度t3的光盘时，由于同心环形区域结构而给予具有波长λ3的激光束的相位差为约0.15λ或更小。

22. 发明申请

US20100081269A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING ELECTRODE FOR EXTERNAL CONNECTION 有权
标题翻译：制造具有电极的半导体器件进行外部连接的方法
公开(公告)号：US20100081269A1
公开(公告)日：2010-04-01
申请号：US12570459
申请日：2009-09-30
申请人： Yutaka Makino , Masamitsu Ikumo , Hiroyuki Yoda
发明人： Yutaka Makino , Masamitsu Ikumo , Hiroyuki Yoda
IPC分类号： H01L21/768
CPC分类号： H01L24/11 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/03462 , H01L2224/0347 , H01L2224/0361 , H01L2224/03902 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/05027 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05572 , H01L2224/05647 , H01L2224/05655 , H01L2224/11009 , H01L2224/11462 , H01L2224/1147 , H01L2224/1181 , H01L2224/11849 , H01L2224/13006 , H01L2224/13076 , H01L2224/13082 , H01L2224/13111 , H01L2224/13116 , H01L2224/13155 , H01L2224/13566 , H01L2224/13687 , H01L2924/00013 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/13091 , H01L2924/19041 , H01L2924/00014 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2224/05552
摘要： A method for manufacturing semiconductor device which includes forming a first metal film over an electrode pad disposed on a substrate, forming a second metal film on the first metal film, forming a first oxide film on a surface of the first metal film and a second oxide film on a surface of the second metal film by oxidizing the surfaces of the first metal film and the second metal film, removing the first oxide film, and melting the second metal film after removing the first oxide film.
摘要翻译：一种半导体器件的制造方法，其特征在于，在设置在基板上的电极焊盘上形成第一金属膜，在所述第一金属膜上形成第二金属膜，在所述第一金属膜的表面上形成第一氧化膜，通过氧化第一金属膜和第二金属膜的表面，去除第一氧化物膜，以及在除去第一氧化物膜之后熔化第二金属膜，在第二金属膜的表面上形成膜。

23. 发明申请

US20080019256A1 Objective lens and optical pickup system 审中-公开
标题翻译：物镜和光学拾取系统
公开(公告)号：US20080019256A1
公开(公告)日：2008-01-24
申请号：US11826623
申请日：2007-07-17
申请人： Mitsuhiro Miyauchi , Koichiro Wakabayashi , Yoshikazu Mitsui , Yasuyuki Sugi , Yutaka Makino
发明人： Mitsuhiro Miyauchi , Koichiro Wakabayashi , Yoshikazu Mitsui , Yasuyuki Sugi , Yutaka Makino
IPC分类号： G02B3/02 , G11B7/00 , G11B7/135
CPC分类号： G11B7/1275 , G11B7/1374 , G11B7/13922 , G11B2007/0006
摘要： There is provided an optical pickup system which includes a first light source emitting first light having a wavelength λ1, a second light source emitting second light having a wavelength λ2 longer than the wavelength λ1, a third light source emitting third light having a wavelength λ3 longer than the wavelength λ2, and an objective lens focusing the first light on an information recording surface of a first optical recording medium, focusing the second light on an information recording surface of a second optical recording medium, and focusing the third light on an information recording surface of a third optical recording medium. In the optical pickup system, at least one lens surface of the objective lens is divided into a plurality of concentric sections with an optical axis, having a step at each boundary between the sections, each of the sections has a different aspherical shape and m1>m2>0 and −0.060≦m3≦−0.020 are satisfied where an imaging magnification at the first light is m1, an imaging magnification at the second light is m2, and an imaging magnification at the third light is m3 in the objective lens. This enables a decrease in aberration at the first light and the second light and an increase in object distance at the third light. Further, this step enables the shared use of a photodetector for detecting the first light and a photodetector for detecting the second light.
摘要翻译：提供了一种光学拾取系统，其包括发射具有波长λ1的第一光的第一光源，发射波长λ2长于波长λ1的第二光的第二光源，发射第三光的第三光源，其具有波长λ3长于波长λ2，以及将第一光聚焦在第一光学记录介质的信息记录表面上的物镜，将第二光聚焦在第二光学记录介质的信息记录表面上，并将第三个光在第三光记录介质的信息记录表面上的光。在光学拾取系统中，物镜的至少一个透镜表面被分成具有光轴的多个同心部分，在各部分之间的每个边界处具有台阶，每个部分具有不同的非球面形状，并且m 1 在第一光的成像倍率为m 1，第二光的成像倍数为m 2，第三光的成像倍率为第二光的成像倍率为m 2时，满足m 2> 0且-0.060 <= m 3 <= - 0.020 m 3在物镜中。这使得能够减少第一光和第二光的像差以及在第三光下物体距离的增加。此外，该步骤能够共享使用用于检测第一光的光电检测器和用于检测第二光的光电检测器。

24. 发明申请

US20060262707A1 Objective lens and optical pickup apparatus using the same 审中-公开
标题翻译：物镜和使用其的光学拾取装置
公开(公告)号：US20060262707A1
公开(公告)日：2006-11-23
申请号：US11434212
申请日：2006-05-16
申请人： Mitsuhiro Miyauchi , Koichiro Wakabayashi , Yasuyuki Sugi , Yutaka Makino
发明人： Mitsuhiro Miyauchi , Koichiro Wakabayashi , Yasuyuki Sugi , Yutaka Makino
IPC分类号： G11B7/135
CPC分类号： G11B7/1275 , G11B7/1353 , G11B7/1374 , G11B7/139 , G11B7/13922 , G11B2007/0006
摘要： A lens surface of an objective lens is divided into a plurality of zones concentric about an optical axis. The lens surface includes an inner area and an outer area located outside the inner area. The inner area focuses the first light beam on the information recording surface of the first optical recording medium and focuses the second light beam on the information recording surface of the second optical recording medium. The outer area causes the first light beam to become flare and focuses the second light beam on the information recording surface of the second optical recording medium.
摘要翻译：物镜的透镜表面被分成与光轴同心的多个区域。透镜表面包括位于内部区域外部的内部区域和外部区域。内部区域将第一光束聚焦在第一光学记录介质的信息记录表面上，并将第二光束聚焦在第二光学记录介质的信息记录表面上。外部区域使得第一光束变得耀斑，并将第二光束聚焦在第二光学记录介质的信息记录表面上。

25. 发明申请

US20060083122A1 Pickup lens with phase compensator and optical pickup apparatus using the same 失效
标题翻译：带有相位补偿器的拾取镜头和使用其的光学拾取装置
公开(公告)号：US20060083122A1
公开(公告)日：2006-04-20
申请号：US11252804
申请日：2005-10-19
申请人： Koichiro Wakabayashi , Keiko Hirao , Mitsuhiro Miyauchi , Yutaka Makino , Yasuyuki Sugi , Yoshikazu Mitsui
发明人： Koichiro Wakabayashi , Keiko Hirao , Mitsuhiro Miyauchi , Yutaka Makino , Yasuyuki Sugi , Yoshikazu Mitsui
IPC分类号： G11B7/00
CPC分类号： G11B7/1369 , G11B7/13925 , G11B2007/0006
摘要： A pickup lens with a phase compensator is composed of a condenser lens and a phase compensator. At least one surface of the condenser lens has a step-like annular zone structure to compensate wavefront aberration generated when recording and reproducing data on an information recording medium having a substrate thickness of t1 with a laser beam having a wavelength λ1 and wavefront aberration generated when recording and reproducing data on an information recording medium having a substrate thickness of t2 with a laser beam having a wavelength λ2. The phase compensator compensates wavefront aberration generated when recording and reproducing data on an information recording medium having a substrate thickness of t3 with a laser beam having a wavelength λ3.
摘要翻译：具有相位补偿器的拾取镜头由聚光透镜和相位补偿器组成。聚光透镜的至少一个表面具有阶梯状环形区域结构，以补偿在具有波长λ1和波前像差的激光束在基板厚度为t 1的信息记录介质上记录和再现数据时产生的波前像差在具有波长λ2的激光束的基板厚度为t 2的信息记录介质上记录和再现数据时产生的相位补偿器补偿当在具有基板厚度的信息记录介质上记录和再现数据时产生的波前像差 t 3具有波长λ3的激光束。

26. 发明授权

US06548898B2 External connection terminal and semiconductor device 有权
标题翻译：外部连接端子和半导体器件
公开(公告)号：US06548898B2
公开(公告)日：2003-04-15
申请号：US09895330
申请日：2001-07-02
申请人： Hirohisa Matsuki , Yutaka Makino , Masamitsu Ikumo , Mitsutaka Sato , Tetsuya Fujisawa , Yoshitaka Aiba
发明人： Hirohisa Matsuki , Yutaka Makino , Masamitsu Ikumo , Mitsutaka Sato , Tetsuya Fujisawa , Yoshitaka Aiba
IPC分类号： H01L2352
CPC分类号： H01L24/05 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/94 , H01L24/96 , H01L2224/02126 , H01L2224/03462 , H01L2224/0401 , H01L2224/04026 , H01L2224/05 , H01L2224/05554 , H01L2224/05568 , H01L2224/05571 , H01L2224/05572 , H01L2224/13006 , H01L2224/13021 , H01L2224/13022 , H01L2224/13023 , H01L2224/13099 , H01L2224/1358 , H01L2224/16 , H01L2224/274 , H01L2224/814 , H01L2924/0001 , H01L2924/00011 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/13091 , H01L2924/15787 , H01L2924/351 , H05K3/244 , H01L2924/00 , H01L2224/05552 , H01L2224/81805
摘要： A structure in which a phosphorus-nickel layer, a rich phosphorus nickel layer that contains phosphorus or boron higher than this phosphorus-nickel layer, a nickel-tin ally layer, a tin-rich tin alloy layer, and a tin alloy solder layer are formed in sequence on an electrode. Accordingly, adhesiveness between a metal pattern used as the electrode, the wiring, or the pad and the solder can be improved.
摘要翻译：其中磷镍层，含有比该磷 - 镍层高的磷或硼的富磷镍层，镍锡合金层，富锡锡合金层和锡合金焊料层的结构是在电极上依次形成。因此，可以提高用作电极的金属图案，布线或焊盘和焊料之间的粘合性。

27. 发明授权

US06218281B1 Semiconductor device with flip chip bonding pads and manufacture thereof 有权
标题翻译：具有倒装芯片接合焊盘的半导体器件及其制造
公开(公告)号：US06218281B1
公开(公告)日：2001-04-17
申请号：US09192443
申请日：1998-11-16
申请人： Eiji Watanabe , Hirohisa Matsuki , Kenichi Kado , Kenichi Nagashige , Masanori Onodera , Kunio Kodama , Hiroyuki Yoda , Joji Fujimori , Minoru Nakada , Yutaka Makino
发明人： Eiji Watanabe , Hirohisa Matsuki , Kenichi Kado , Kenichi Nagashige , Masanori Onodera , Kunio Kodama , Hiroyuki Yoda , Joji Fujimori , Minoru Nakada , Yutaka Makino
IPC分类号： H01L2144
CPC分类号： H01L24/11 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/0231 , H01L2224/02377 , H01L2224/03462 , H01L2224/039 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/05569 , H01L2224/05571 , H01L2224/05647 , H01L2224/11462 , H01L2224/1147 , H01L2224/1191 , H01L2224/13024 , H01L2224/13082 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/81805
摘要： A semiconductor substrate is prepared which has a principal surface, an exposed pad made of conductive material being formed in a partial area of the principal surface, and the other area of the principal surface being covered with a first insulating film. A base conductive film is formed on the first insulating film and the pad. A photoresist film having a thickness of 50 &mgr;m or thicker is formed on the base conductive film. An opening is formed through the photoresist film in an area corresponding to the pad to expose a partial surface area of the base conductive film. A conductive bump electrode is deposited on the base conductive film exposed on a bottom of the opening. The photoresist film is removed. This method is suitable for making a fine pitch between bump electrodes.
摘要翻译：制备半导体衬底，其具有主表面，由导电材料制成的裸露焊盘形成在主表面的局部区域中，并且主表面的另一区域被第一绝缘膜覆盖。在第一绝缘膜和垫上形成基底导电膜。在基底导电膜上形成厚度为50μm以上的光刻胶膜。在与该焊盘相对应的区域中形成通过光致抗蚀剂膜的开口以暴露基底导电膜的部分表面区域。导电凸块电极沉积在暴露在开口底部的基底导电膜上。除去光致抗蚀剂膜。该方法适用于在凸块电极之间形成细间距。

28. 发明授权

US4817849A Method for bonding semiconductor laser element and apparatus therefor 失效
标题翻译：半导体激光元件接合方法及其装置
公开(公告)号：US4817849A
公开(公告)日：1989-04-04
申请号：US93678
申请日：1987-09-08
申请人： Akihiro Yamamoto , Yutaka Makino , Shinji Kaino
发明人： Akihiro Yamamoto , Yutaka Makino , Shinji Kaino
IPC分类号： H01L21/52 , H01S5/00 , H01S5/022 , H01S3/18 , B23K11/00 , B23K11/32
CPC分类号： H01S5/02252 , H01L2224/48091 , H01S5/02256 , Y10T29/49004 , Y10T29/49133
摘要： A method for bonding a semiconductor laser element, wherein a laser chip (4) is mounted on a stem (1) and a driving electric power is supplied to the laser chip through members for mounting the laser chip so that the laser chip emits a laser light, then the direction of the laser light is examined, and position of the laser chip is adjusted, in a manner that the direction of the laser light becomes within a predetermined range, and subsequently the laser chip is bonded on the pedestal (2) upon detection of entering the direction in the range, by flowing a large current through in the pedestal (2).
摘要翻译：一种用于接合半导体激光元件的方法，其中激光芯片（4）安装在杆（1）上，驱动电力通过用于安装激光芯片的部件提供给激光芯片，使得激光芯片发射激光光，然后检查激光的方向，并且以激光的方向变为预定范围的方式调整激光芯片的位置，随后将激光芯片接合在基座（2）上，在通过使基座（2）中流过大电流的情况下，检测到在该范围内进入方向。

29. 发明授权

US09007147B2 Branching filter, and wireless communication module and wireless communication device using same 有权
标题翻译：分支滤波器，无线通信模块和使用无线通信模块的无线通信设备
公开(公告)号：US09007147B2
公开(公告)日：2015-04-14
申请号：US13121071
申请日：2009-08-31
申请人： Yutaka Makino
发明人： Yutaka Makino
IPC分类号： H01P1/213 , H03H7/00 , H01P1/203 , H03H1/00
CPC分类号： H01P1/20345 , H01P1/2135 , H03H2001/0085
摘要： Provided are a branching filter capable of well branching two electrical signals having a wide frequency band, and a wireless communication module and wireless communication device using same. The branching filter is provided with an input terminal (11), a first output terminal (12a), a second output terminal (12b), a first line conductor (14a) which is electromagnetically coupled to a resonator (13a) of an input stage so as to interconnect the input terminal (11) and the first output terminal (12a), a capacitor (15a) which interconnects the first line conductor (14a) and ground, and a second line conductor (14b) which is electromagnetically coupled to a resonator (13b) of an output stage and is connected to the second output terminal (12b), wherein a low pass filter is configured from the first line conductor (14a) and the capacitor (15a), and a band pass filter is configured from the first line conductor (14a), the second line conductor (14b), and a plurality of resonators. The branching filter eliminates the need for a phase circuit and thus is capable of well branching two signals having a wide frequency band.
摘要翻译：提供了能够良好地分支具有宽频带的两个电信号的分波器滤波器，以及使用它的无线通信模块和无线通信装置。分路滤波器设置有输入端子（11），第一输出端子（12a），第二输出端子（12b），电磁耦合到输入级的谐振器（13a）的第一线路导体（14a）以将互连第一线路导体（14a）和地线的电容器（15a）和与第一线路导体（14a）电连接的第二线路导体（14b）互连，以便互连输入端子（11）和第一输出端子谐振器（13b）并连接到第二输出端子（12b），其中低通滤波器由第一线路导体（14a）和电容器（15a）构成，带通滤波器由第一线路导体（14a），第二线路导体（14b）和多个谐振器。分路滤波器消除了对相位电路的需要，因此能够良好地分支具有宽频带的两个信号。

30. 发明授权

US08302843B2 Process for producing semiconductor device and apparatus therefor 有权
标题翻译：用于制造半导体器件的方法及其装置
公开(公告)号：US08302843B2
公开(公告)日：2012-11-06
申请号：US12412970
申请日：2009-03-27
申请人： Hiroyuki Matsui , Yutaka Makino , Yoshito Akutagawa
发明人： Hiroyuki Matsui , Yutaka Makino , Yoshito Akutagawa
IPC分类号： B23K31/02
CPC分类号： H01L21/67098 , H01L21/67115 , H01L24/11 , H01L24/742 , H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/1146 , H01L2224/1147 , H01L2224/1181 , H01L2224/11849 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/16 , H01L2224/81012 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/014 , H01L2924/19043 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2224/05599
摘要： A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump.
摘要翻译：一种制造半导体器件的方法，包括：首先通过仅加热形成在半导体衬底的一个主表面上的电极上的凸起的上部来进行熔融; 并且还通过加热凸块的下部来熔化整个凸块。

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