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    • 21. 发明授权
    • Method of producing a semiconductor device
    • 半导体装置的制造方法
    • US06716718B2
    • 2004-04-06
    • US09972147
    • 2001-10-09
    • Hiroyuki NagataniKouji Taniguchi
    • Hiroyuki NagataniKouji Taniguchi
    • H01L2176
    • H01L21/76235
    • A trench is formed by performing an anisotropic etching treatment on a silicon substrate with the use of a mask pattern including a pad oxide film, a polysilicon film, and a silicon nitride film formed on the silicon substrate, as a mask. Next, the side surface of the polysilicon film is retreated by etching so that the part of an oxide film formed on the side surface of the polysilicon film may not be hung over the part of an oxide film formed on the side surface of the pad oxide film. Next, an oxide film is formed by performing a thermal oxidation treatment on the inner wall surface of the trench including the exposed side surface of the polysilicon film. This produces a semiconductor device that prevents voids from being formed in a trench isolation structure.
    • 通过使用包括形成在硅衬底上的衬垫氧化物膜,多晶硅膜和氮化硅膜的掩模图案作为掩模,在硅衬底上进行各向异性蚀刻处理来形成沟槽。 接下来,通过蚀刻来回退多晶硅膜的侧表面,使得形成在多晶硅膜的侧表面上的氧化膜的部分不会悬挂在形成在衬垫氧化物的侧表面上的氧化膜的部分上 电影。 接下来,通过对包括多晶硅膜的暴露侧表面的沟槽的内壁表面进行热氧化处理来形成氧化物膜。 这产生了防止在沟槽隔离结构中形成空隙的半导体器件。