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21. 发明授权

US06286230B1 Method of controlling gas flow in a substrate processing system 失效
标题翻译：控制衬底处理系统中气体流动的方法
公开(公告)号：US06286230B1
公开(公告)日：2001-09-11
申请号：US09391012
申请日：1999-09-07
申请人： John M. White , Wendell T. Blonigan , Michael W. Richter
发明人： John M. White , Wendell T. Blonigan , Michael W. Richter
IPC分类号： F26B504
CPC分类号： H01L21/67173 , H01L21/67017 , Y10S414/139
摘要： A method of transferring and processing a substrate in an evacuable chamber which is located adjacent a process chamber and back-to-back process chambers, and other combinations of evacuable chambers and process chambers. The method includes the use of various isolation valves disposed between adjacent chambers, as well as gas flow valves and vacuum valves. By controlling the positions of the valves, the flow of gas to and from the different chambers can be controlled.
摘要翻译：一种在位于邻近处理室和背靠背处理室的可抽空室中以及可抽空室和处理室的其它组合之间传送和处理衬底的方法。该方法包括使用设置在相邻室之间的各种隔离阀以及气体流量阀和真空阀。通过控制阀的位置，可以控制进出不同室的气体流量。

22. 发明授权

US07735710B2 Substrate support 失效
标题翻译：基材支持
公开(公告)号：US07735710B2
公开(公告)日：2010-06-15
申请号：US10990094
申请日：2004-11-16
申请人： Shinichi Kurita , Wendell T. Blonigan , Suhail Anwar , Toshio Kiyotake , Hung T. Nguyen
发明人： Shinichi Kurita , Wendell T. Blonigan , Suhail Anwar , Toshio Kiyotake , Hung T. Nguyen
IPC分类号： H01L21/68
CPC分类号： H01L21/68 , H01L21/68728 , H01L21/68778 , H01L21/68792 , Y10S414/136 , Y10S414/139 , Y10S414/141
摘要： A method and apparatus for supporting a substrate is generally provided. In one aspect, an apparatus for supporting a substrate includes a support plate having a first body disposed proximate thereto. A first pushing member is radially coupled to the first body and adapted to urge the substrate in a first direction parallel to the support plate when the first body rotates. In another aspect, a load lock chamber having a substrate support that supports a substrate placed thereon includes a cooling plate that is moved to actuate at least one alignment mechanism. The alignment mechanism includes a pushing member that urges the substrate in a first direction towards a center of the support. The pushing member may additionally rotate about an axis perpendicular to the first direction.
摘要翻译：通常提供用于支撑衬底的方法和装置。在一个方面，一种用于支撑衬底的装置包括具有靠近其设置的第一主体的支撑板。第一推动构件径向耦合到第一主体并且适于在第一主体旋转时沿平行于支撑板的第一方向推动基板。在另一方面，具有支撑其上放置的基板的基板支撑件的装载锁定室包括移动以致动至少一个对准机构的冷却板。对准机构包括推动构件，其沿朝向支撑件的中心的第一方向推动基板。推动构件可以另外围绕垂直于第一方向的轴旋转。

23. 发明申请

US20100107672A1 DUAL SUBSTRATE LOADLOCK PROCESS EQUIPMENT 有权
标题翻译：双基板负载工艺设备
公开(公告)号：US20100107672A1
公开(公告)日：2010-05-06
申请号：US12691612
申请日：2010-01-21
申请人： Shinichi Kurita , Wendell T. Blonigan , Akihiro Hosokawa
发明人： Shinichi Kurita , Wendell T. Blonigan , Akihiro Hosokawa
IPC分类号： H01L21/677 , H01L23/34 , F25D23/12
CPC分类号： H01L21/68742 , B65G49/068 , B65G2249/02 , B65G2249/04 , C23C14/566 , C23C14/568 , C23C16/54 , H01L21/67103 , H01L21/67109 , H01L21/67167 , H01L21/67201 , H01L21/67739 , H01L21/67745 , H01L21/67748
摘要： One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.
摘要翻译：一个实施例涉及一种其中具有第一支撑结构的负载锁，用于支撑一个未处理的基板和其中的第二支撑结构以支撑一个处理的基板。第一支撑结构位于第二支撑结构的上方。负载锁包括用于控制支撑结构的垂直位置的电梯。负载锁还包括第一孔，以允许将未处理的衬底插入到装载锁中并从加载锁中移除经处理的衬底，以及第二孔，以允许将未处理的衬底从负载锁上移除并将经处理的衬底插入负载锁。一个冷却板也位于负载锁中。冷却板包括适于在其上支撑经处理的基板的表面。加热装置可以位于第一支撑结构上方的装载锁中。

24. 发明授权

US07641247B2 End effector assembly for supporting a substrate 有权
标题翻译：用于支撑衬底的末端执行器组件
公开(公告)号：US07641247B2
公开(公告)日：2010-01-05
申请号：US10321826
申请日：2002-12-17
申请人： Wendell T. Blonigan , Takayuki Matsumoto , William N. Sterling , Billy C. Leung
发明人： Wendell T. Blonigan , Takayuki Matsumoto , William N. Sterling , Billy C. Leung
IPC分类号： B25J15/00 , B65G49/07
CPC分类号： H01L21/68707 , Y10S294/902 , Y10S414/141
摘要： Generally, an end effector assembly for a substrate transfer robot is provided. In one embodiment, an end effector assembly for supporting a quadrilateral substrate during substrate transfer includes an end effector having an inner edge support disposed on a first end and a first outer edge support disposed on a distal end. The first end of the end effector is adapted for coupling to a robot linkage. The first inner edge support has a face that is oriented parallel to and facing the face of the first outer edge support. This configuration of edge supports captures the substrate to the end effector thereby minimizing substrate slippage during transfer. In another embodiment, lateral guides may be utilized to further enhance capturing the substrate along the edges of the substrate open between the inner and outer edge supports.
摘要翻译：通常，提供了一种用于衬底传送机器人的端部执行器组件。在一个实施例中，用于在衬底传送期间支撑四边形衬底的端部执行器组件包括端部执行器，其具有设置在第一端上的内边缘支撑件和设置在远端上的第一外边缘支撑件。端部执行器的第一端适于联接到机器人联动装置。第一内边缘支撑件具有平行于并面向第一外边缘支撑件的面的面。边缘支撑件的这种构造将基板捕获到端部执行器，从而最小化转移期间的基板滑移。在另一个实施例中，可以使用横向引导件来进一步增强沿着在内边缘支撑件和外边缘支撑件之间打开的基板的边缘捕获基板。

25. 发明授权

US07031600B2 Method and apparatus for silicon oxide deposition on large area substrates 有权
公开(公告)号：US07031600B2
公开(公告)日：2006-04-18
申请号：US10409466
申请日：2003-04-07
申请人： Sanjay D. Yadav , Quanyuan Shang , Wendell T. Blonigan
发明人： Sanjay D. Yadav , Quanyuan Shang , Wendell T. Blonigan
IPC分类号： C23C14/00
CPC分类号： C23C16/402 , C23C16/4485
摘要： A method and apparatus for depositing a dielectric material at a rate of at least 3000 Angstroms per minute on a large area substrate that has a surface area of at least about 0.35 square meters is provided. In one embodiment, the dielectric material is silicon oxide. Also provided is a large area substrate having a layer of dielectric material deposited by a process yielding a deposition rate in excess of about 3000 Angstroms per minute and a processing chamber for fabricating the same.

26. 发明授权

US06949143B1 Dual substrate loadlock process equipment 有权
标题翻译：双基板负载锁定工艺设备
公开(公告)号：US06949143B1
公开(公告)日：2005-09-27
申请号：US09464362
申请日：1999-12-15
申请人： Shinichi Kurita , Wendell T. Blonigan , Akihiro Hosokawa
发明人： Shinichi Kurita , Wendell T. Blonigan , Akihiro Hosokawa
IPC分类号： G02F1/13 , B65G49/06 , C23C14/56 , C23C16/44 , H01L21/00 , H01L21/205 , H01L21/302 , H01L21/3065 , H01L21/677 , H01L21/687 , C23C16/00
CPC分类号： H01L21/68742 , B65G49/068 , B65G2249/02 , B65G2249/04 , C23C14/566 , C23C14/568 , C23C16/54 , H01L21/67103 , H01L21/67109 , H01L21/67167 , H01L21/67201 , H01L21/67739 , H01L21/67745 , H01L21/67748
摘要： One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as wall as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.
摘要翻译：一个实施例涉及一种其中具有第一支撑结构的负载锁，用于支撑一个未处理的基板和其中的第二支撑结构以支撑一个处理的基板。第一支撑结构位于第二支撑结构的上方。负载锁包括用于控制支撑结构的垂直位置的电梯。负载锁还包括第一孔，以允许将未处理的衬底插入到装载锁中，并且将加工的衬底从负载锁上移除，作为壁作为第二孔，以允许将未加工的衬底从负载锁中移除并将处理的衬底插入负载锁。一个冷却板也位于负载锁中。冷却板包括适于在其上支撑经处理的基板的表面。加热装置可以位于第一支撑结构上方的装载锁中。

27. 发明授权

US06916147B2 Substrate storage cassette with substrate alignment feature 失效
标题翻译：具有基板对准特征的基板存储盒
公开(公告)号：US06916147B2
公开(公告)日：2005-07-12
申请号：US10280451
申请日：2002-10-25
申请人： Dongchoon Suh , Wendell T. Blonigan , Rolf A. Guenther
发明人： Dongchoon Suh , Wendell T. Blonigan , Rolf A. Guenther
IPC分类号： H01L21/673 , H01L21/677 , B65B21/02 , B65B69/00 , B65G65/04 , B65G65/34
CPC分类号： H01L21/6732 , H01L21/67772 , Y10S414/136
摘要： A substrate storage cassette and a method of orienting a substrate disposed therein are provided. In one embodiment, the substrate storage cassette includes a plurality of flanges pairs disposed between a first lateral sidewall coupled in a spaced-apart relation to a second lateral sidewall. Each of the flange pairs adapted to support a substrate thereon. At least a first alignment feature disposed between the flange pair and adapted to mate with an orientation feature of the substrate when the substrate is in a predefined orientation.
摘要翻译：提供了基板存储盒和设置在其中的基板的定向方法。在一个实施例中，衬底存储盒包括多个凸缘对，其设置在以与第二侧壁侧壁间隔开的关系连接的第一侧壁之间。每个凸缘对适于在其上支撑基底。至少第一对准特征设置在所述凸缘对之间并且当所述基板处于预定义取向时适于与所述基板的取向特征配合。

28. 发明授权

US06359250B1 RF matching network with distributed outputs 失效
标题翻译：射频匹配网络与分布式输出
公开(公告)号：US06359250B1
公开(公告)日：2002-03-19
申请号：US09664983
申请日：2000-09-18
申请人： Wendell T. Blonigan , Carl A. Sorensen
发明人： Wendell T. Blonigan , Carl A. Sorensen
IPC分类号： B23K1000
CPC分类号： H01J37/32174 , H01J37/32082
摘要： An apparatus for distributing RF power outputs to a first electrode in a parallel plate electrode system for generating plasma in depositing films on a substrate. A RF power output is applied to a distributed RF matching network to excite a plasma from a process gas stream to deposit a uniform film onto the substrate. The distributed matching network includes a load capacitor for receiving a radio frequency power input and an inductor having first and second ends with the first end coupled to the load capacitor. The matching network also includes multiple drive capacitors each of which couples the second end of the inductor to a different one of multiple points distributed on the first electrode. The capacitance of each drive capacitor is user-selectable, and the points on the backing plate to which the drive capacitors are coupled are user-selectable.
摘要翻译：一种用于在平行板电极系统中的第一电极上分配RF功率输出的装置，用于在衬底上沉积膜中产生等离子体。将RF功率输出施加到分布式RF匹配网络，以从工艺气流中激发等离子体以将均匀的膜沉积到衬底上。分布式匹配网络包括用于接收射频功率输入的负载电容器和具有第一端和第二端的电感器，其第一端耦合到负载电容器。匹配网络还包括多个驱动电容器，每个驱动电容器将电感器的第二端耦合到分布在第一电极上的多个点中的不同的一个。每个驱动电容器的电容可由用户选择，驱动电容耦合到背板上的点可由用户选择。

29. 发明授权

US07651315B2 Large area substrate transferring method for aligning with horizontal actuation of lever arm 有权
标题翻译：大面积基板转印方法，用于与杆臂的水平致动对齐
公开(公告)号：US07651315B2
公开(公告)日：2010-01-26
申请号：US11621039
申请日：2007-01-08
申请人： Shinichi Kurita , Wendell T. Blonigan , Yoshiaki Tanase
发明人： Shinichi Kurita , Wendell T. Blonigan , Yoshiaki Tanase
IPC分类号： B65G47/90 , B21B39/22
CPC分类号： H01L21/67201 , B65G49/064 , B65G49/067 , B65G49/068 , B65G2249/02 , H01L21/67236 , Y10S414/136 , Y10S414/137 , Y10S414/139
摘要： A load lock chamber and method for transferring large area substrates is provided. In one embodiment, a load lock chamber suitable for transferring large area substrates includes a plurality of vertically stacked single substrate transfer chambers. The configuration of vertically stacked single substrate transfer chambers contributes to reduced size and greater throughput as compared to conventional state of the art, dual slot dual substrate designs. Moreover, the increased throughput has been realized at reduced pumping and venting rates, which corresponds to reduced probability of substrate contamination due to particulates and condensation.
摘要翻译：提供了一种负载锁定室和用于传送大面积基板的方法。在一个实施例中，适于传送大面积衬底的负载锁定室包括多个垂直堆叠的单个衬底传送室。垂直堆叠的单个基板传送室的配置与现有技术的双槽双面基板设计相比，有助于减小尺寸和更大的通量。此外，在减少的泵送和排气速率下已经实现了增加的产量，这对应于由于颗粒和冷凝引起的底物污染的可能性降低。

30. 发明授权

US07316966B2 Method for transferring substrates in a load lock chamber 有权
标题翻译：在负载锁定室中传送基板的方法
公开(公告)号：US07316966B2
公开(公告)日：2008-01-08
申请号：US11278318
申请日：2006-03-31
申请人： Shinichi Kurita , Wendell T. Blonigan
发明人： Shinichi Kurita , Wendell T. Blonigan
IPC分类号： H01L21/20
CPC分类号： H01L21/67201 , H01L21/67196 , H01L21/67748
摘要： Provided herein is a substrate processing system, which comprises a cassette load station; a load lock chamber; a centrally located transfer chamber; and one or more process chambers located about the periphery of the transfer chamber. The load lock chamber comprises double dual slot load locks constructed at same location. Such system may be used for processing substrates for semiconductor manufacturing.
摘要翻译：本文提供了一种基板处理系统，其包括盒式装载台; 负载锁定室; 位于中心的传送室; 以及位于传送室的周边周围的一个或多个处理室。负载锁定室包括在相同位置构造的双重双槽加载锁。这种系统可用于处理用于半导体制造的衬底。

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