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    • 21. 发明申请
    • Substrate processing apparatus and transfer positioning method thereof
    • 基板处理装置及其转印定位方法
    • US20060138367A1
    • 2006-06-29
    • US11304685
    • 2005-12-16
    • Keisuke Kondoh
    • Keisuke Kondoh
    • G01N21/86G01V8/00
    • H01L21/67259
    • A substrate processing apparatus has a transfer mechanism arranged on a transfer base and configured to transfer a processing substrate between predetermined transfer positions, a mapping sensor arranged on the transfer base and configured to detect an arrangement state of a processing substrate inside a processing substrate accommodating case which accommodates a plurality of processing substrate in a shelf-like form, and a Z-axis teaching jig provided on or in the vicinity of one of the transfer positions. This substrate processing apparatus detects, by the mapping sensor, a height of the Z-axis teaching jig so as to perform teaching of Z-axis to the transfer mechanism with respect to the one of the transfer positions.
    • 一种基板处理装置,具有设置在转印基板上的转印机构,其被配置为在预定的转印位置之间转印处理基板,布置在转印基板上的配置在检测处理基板容纳壳体内部的处理基板的配置状态 其容纳多个处于搁置状态的处理基板,以及设置在其中一个转印位置上或其附近的Z轴示教夹具。 该基板处理装置通过映射传感器检测Z轴示教夹具的高度,以便相对于传送位置之一对传送机构进行Z轴的教导。
    • 22. 发明授权
    • Positioning substrate for semiconductor process
    • 半导体工艺定位基板
    • US06950721B2
    • 2005-09-27
    • US10391574
    • 2003-03-20
    • Makoto TashiroKeisuke KondohHiroaki Saeki
    • Makoto TashiroKeisuke KondohHiroaki Saeki
    • H01L21/027H01L21/02H01L21/68G06F7/00
    • H01L21/68Y10S414/135
    • A positioning substrate is used for performing a teaching operation on a transfer mechanism for transferring a target substrate in a semiconductor processing system. The positioning substrate includes a substrate body made of a material selected from the group consisting of the same material as the target substrate, semiconductor, compound semiconductor, and ceramic. The substrate body has an outer contour sized to be handled by the transfer mechanism as an alternative to the target substrate. The positioning substrate also includes a positioning assistant having a combination of a positioning hole and a positioning reference line formed in the substrate body. The positioning hole is formed to penetrate the substrate body in a thickness direction. The positioning reference line is formed on a surface of the substrate body to extend across an opening of the positioning hole and have a predetermined width.
    • 定位基板用于对在半导体处理系统中传送目标基板的转印机构进行示教操作。 定位基板包括由与靶基板,半导体,化合物半导体和陶瓷相同的材料组成的组中选择的材料制成的基板主体。 基板主体具有外形轮廓,其尺寸设置成由作为目标基板的替代的传送机构来处理。 定位基板还包括具有定位孔和形成在基板主体中的定位基准线的组合的定位辅助件。 定位孔形成为在厚度方向上穿透基体。 定位参考线形成在基体的表面上,以延伸穿过定位孔的开口并具有预定的宽度。
    • 23. 发明授权
    • Positional deviation detection apparatus and process system employing the same
    • 位置偏差检测装置及采用该位置检测装置的处理系统
    • US08395136B2
    • 2013-03-12
    • US12602174
    • 2008-05-22
    • Keisuke Kondoh
    • Keisuke Kondoh
    • G01N21/86G06M7/00
    • H01L21/67742H01L21/67766H01L21/681
    • In a positional deviation detection apparatus provided with a transfer mechanism where plural arm portions are connected pivotably and in series with each other, the transfer mechanism being adapted to hold and transfer an object to be processed with a distal end arm portion, there are provided an edge detection unit that detects at least an edge of the object to be detected held by the distal end arm portion, the edge detection unit being provided in an arm portion among the plural arm portions, except for the distal end arm portion; and a positional deviation detection portion that obtains positional deviation of the object to be processed, in accordance with a detected value of the edge detection unit.
    • 在设置有多个臂部可枢转地并且彼此串联连接的传送机构的位置偏差检测装置中,传送机构适于用远端臂部保持和传送被处理物体, 边缘检测单元,其检测由所述前端臂部保持的所述被检测体的至少一边缘,所述边缘检测单元设置在所述多个臂部中的除了所述前端臂部之外的臂部; 以及位置偏差检测部,其根据边缘检测部的检测值取得被处理物的位置偏差。
    • 25. 发明申请
    • SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE SUPPORTING METHOD, SEMICONDUCTOR MANUFACTURING APPARATUS AND STORAGE MEDIUM
    • 基板支撑装置,基板支撑方法,半导体制造装置和存储介质
    • US20090087932A1
    • 2009-04-02
    • US12209687
    • 2008-09-12
    • Keisuke Kondoh
    • Keisuke Kondoh
    • H01L21/00H01L21/306H01L21/30
    • H01L21/67248H01L21/67196H01L21/67742H01L21/6838H01L21/68707
    • A substrate supporting apparatus includes a substrate supporting portion having a substrate supporting surface facing a rear surface of a substrate; plural protruding portions provided on the substrate supporting surface, for preventing the substrate from being slid on the substrate supporting surface by friction force generated in relation with the substrate; a gas discharge opening provided in the substrate supporting surface, for discharging gas toward the rear surface of the substrate; a gas flow path whose one end is connected to the gas discharge opening; and a temperature control unit for controlling temperature of the gas flowing through the gas flow path, wherein the gas discharged to the rear surface of the substrate flows in a gap between the substrate supporting surface and the substrate, and by Bernoulli effect causing reduction of pressure of the gap, the substrate is attracted to the substrate supporting portion, thereby supporting the substrate.
    • 基板支撑装置包括:基板支撑部,其具有面向基板的后表面的基板支撑面; 多个突出部,设置在基板支撑面上,用于防止基板通过与基板相关产生的摩擦力在基板支撑面上滑动; 气体排出口,设置在所述基板支撑表面中,用于朝向所述基板的后表面排出气体; 气体流路,其一端与气体排出口连接; 以及温度控制单元,用于控制流过气体流路的气体的温度,其中排出到基板的后表面的气体在基板支撑表面和基板之间的间隙中流动,并且通过伯努利效应导致压力降低 的间隙,衬底被吸引到衬底支撑部分,从而支撑衬底。
    • 27. 发明申请
    • Single-wafer type substrate processing apparatus having a carry-in port provided with first and second placement tables arranged in a line
    • 具有输入端口的单晶片型基板处理装置,该输入端口设置有一列排列的第一和第二布置台
    • US20080236755A1
    • 2008-10-02
    • US12076975
    • 2008-03-26
    • Keisuke KondohShin Osada
    • Keisuke KondohShin Osada
    • H01L21/306B05C13/02B05C11/00
    • H01L21/67775
    • A single-wafer type substrate processing apparatus includes: a plurality of process modules connected to a substrate transfer chamber; a carry-in port having a plurality of first placement tables arranged in a horizontal direction so that a substrate carrier is placed thereon; a second placement table installed on the left or right of an area where the first placement tables are arranged in the horizontal direction so that the substrate carrier is temporarily placed thereon; and a transfer mechanism transferring the substrate carrier from the second placement table to one of the first placement tables. When viewed in a direction perpendicular to the horizontal direction, an outer end of the second placement table in the horizontal direction is inside one of a maintenance area and a footprint area of the plurality of single-wafer type process modules as a whole, which one area is larger than the other in the horizontal direction.
    • 单晶片型基板处理装置包括:连接到基板传送室的多个处理模块; 具有沿水平方向布置的多个第一放置台的携带口,使得基板载体位于其上; 安装在第一放置台沿水平方向布置的区域的左侧或右侧的第二放置台,使得基板载体暂时放置在其上; 以及将所述基板载体从所述第二放置台传递到所述第一放置台之一的传送机构。 当沿垂直于水平方向的方向观察时,第二放置台的水平方向的外端在整个多个单晶片型处理模块的维护区域和覆盖区域之一内,其中一个 区域在水平方向大于另一个。
    • 28. 发明授权
    • Opening/closing mechanism for vacuum processing apparatus and vacuum processing apparatus using the same
    • 真空处理装置的开闭机构及使用其的真空处理装置
    • US07198251B2
    • 2007-04-03
    • US11312607
    • 2005-12-21
    • Keisuke Kondoh
    • Keisuke Kondoh
    • F16K25/00
    • F16K51/02F16K31/54
    • An opening/closing mechanism for a vacuum processing apparatus comprises a link mechanism comprising a supporting member having first and second valve elements for closing first and second opening portions, and a base end side member rotatably attached at a rear edge portion side of the supporting member through a rotation axis, a guide mechanism rotatably supporting the supporting member to a horizontal moving direction of the first and second valve elements while restricting the vertical moving range of the supporting member, first and second guide members which move the rotation axis of the link mechanism to a vertical direction and at the top portion to the horizontal direction, and first and second vertical moving mechanisms which vertically move the first guide member, the second guide member and the base edge side member.
    • 一种用于真空处理装置的开闭机构包括:连杆机构,包括具有用于封闭第一和第二开口部的第一和第二阀元件的支撑构件,以及可旋转地安装在支撑构件的后边缘部侧的基端侧构件 通过旋转轴,引导机构在限制支撑构件的垂直移动范围的同时,将支撑构件可旋转地支撑在第一和第二阀元件的水平移动方向上,第一和第二引导构件使连杆机构的旋转轴线移动 第一和第二垂直移动机构,其垂直移动第一引导构件,第二引导构件和基部边缘侧构件。
    • 29. 发明授权
    • Carrying device
    • 携带装置
    • US06699003B2
    • 2004-03-02
    • US10218997
    • 2002-08-15
    • Hiroaki SaekiKeisuke Kondoh
    • Hiroaki SaekiKeisuke Kondoh
    • B66C2300
    • H01L21/687B25J9/1065B25J9/107H01L21/67742Y10S414/13Y10T74/20305Y10T74/20329
    • In most cases, a hot, corrosive atmosphere is created in, for example, a semiconductor wafer processing chamber. When an arm including belts, such as steel belts, is moved into such a semiconductor wafer processing chamber, the belts are exposed to the hot, corrosive atmosphere. Belts, such as steel belts, have limited heat resistance and corrosion resistance and the hot, corrosive atmosphere in the processing chamber shortens the life of the belts. A carrying device of the present invention has a frog leg type arm (3) and a wafer holder (4) connected to the frog leg type arm (3). The wafer holder (4) is pivotally connected to front end parts of a first front arm (8A) and a second front arm (8B) by coaxial joints (10). The wafer holder (4) is linked to the first front arm (8A) and the second front arm (8B) by a posture maintaining linkage (5) including two antiparallel linkages capable of controlling the turning of the wafer holder (4) relative to the first and the second front arms (8A, 8B).
    • 在大多数情况下,在例如半导体晶片处理室中产生热的腐蚀性气体。 当包括诸如钢带的带的臂移动到这种半导体晶片处理室中时,带暴露于热的腐蚀性气氛中。 皮带,如钢带,具有有限的耐热性和耐腐蚀性,加工室内的热腐蚀性气氛缩短了皮带的使用寿命。 本发明的携带装置具有连接到青蛙腿型臂(3)的蛙腿式臂(3)和晶片保持架(4)。 晶片保持架(4)通过同轴接头(10)枢转地连接到第一前臂(8A)和第二前臂(8B)的前端部分。 晶片保持器(4)通过包括两个能够控制晶片保持器(4)的相对转动的两个反平行连杆的姿态保持连杆(5)连接到第一前臂(8A)和第二前臂(8B) 第一和第二前臂(8A,8B)。
    • 30. 发明授权
    • Substrate processing apparatus and transfer positioning method thereof
    • 基板处理装置及其转印定位方法
    • US07361920B2
    • 2008-04-22
    • US11304685
    • 2005-12-16
    • Keisuke Kondoh
    • Keisuke Kondoh
    • G01N21/86G01R31/26
    • H01L21/67259
    • A substrate processing apparatus has a transfer mechanism arranged on a transfer base and configured to transfer a processing substrate between predetermined transfer positions, a mapping sensor arranged on the transfer base and configured to detect an arrangement state of a processing substrate inside a processing substrate accommodating case which accommodates a plurality of processing substrate in a shelf-like form, and a Z-axis teaching jig provided on or in the vicinity of one of the transfer positions. This substrate processing apparatus detects, by the mapping sensor, a height of the Z-axis teaching jig so as to perform teaching of Z-axis to the transfer mechanism with respect to the one of the transfer positions.
    • 一种基板处理装置,具有设置在转印基板上的转印机构,其被配置为在预定的转印位置之间转印处理基板,布置在转印基板上的配置在检测处理基板容纳壳体内部的处理基板的配置状态 其容纳多个处于搁置状态的处理基板,以及设置在其中一个转印位置上或其附近的Z轴示教夹具。 该基板处理装置通过映射传感器检测Z轴示教夹具的高度,以便相对于传送位置之一对传送机构进行Z轴的教导。