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21. 发明授权

US6099390A Polishing pad for semiconductor wafer and method for polishing semiconductor wafer 失效
标题翻译：用于半导体晶片的抛光垫和用于抛光半导体晶片的方法
公开(公告)号：US6099390A
公开(公告)日：2000-08-08
申请号：US285647
申请日：1999-04-05
申请人： Mikio Nishio , Tomoyasu Murakami
发明人： Mikio Nishio , Tomoyasu Murakami
IPC分类号： B24B37/20 , B24B37/24 , B24B37/26 , B24D11/00 , H01L21/304 , B24B1/00
CPC分类号： B24B37/26
摘要： A polishing pad used for polishing a film on a semiconductor wafer and made of a plastic includes a polishing pad body, and a large number of convex portions, which are provided on the surface of the polishing pad body just like so many islands and each have a flat top surface. An average length L of respective sides or diameters of the convex portions on the top surface thereof is in the range from 0.1 mm to 5.0 mm, both inclusive; an average height H of the convex portions is in the range from 0.1 mm to 0.5 mm, both inclusive; and H.ltoreq.L.ltoreq.2S is met, where S is an average space between the convex portions.
摘要翻译：用于在半导体晶片上抛光并由塑料制成的薄膜的抛光垫包括抛光垫体和大量的凸起部分，它们像抛光垫体的表面一样设置在许多岛上并且各自具有平顶面。上表面的凸部的各个侧面或直径的平均长度L在0.1mm〜5.0mm的范围内; 凸部的平均高度H在0.1mm〜0.5mm的范围内; 并且满足H

22. 发明授权

US5709249A Locking structure 失效
标题翻译：锁定结构
公开(公告)号：US5709249A
公开(公告)日：1998-01-20
申请号：US493567
申请日：1995-06-22
申请人： Eiji Okada , Tomoyasu Murakami , Mitsunari Tashiro
发明人： Eiji Okada , Tomoyasu Murakami , Mitsunari Tashiro
IPC分类号： F16B5/00 , B65D43/00 , H02G3/04
CPC分类号： H02G3/0418
摘要： A locking structure including a case having a bottom plate and a pair of side walls extending upward from both side edges of the bottom plate. The locking structure further includes a cover for closing the opening defined between the top ends of the pair of side walls, stopping projections provided on each side wall of the case, and engaging frames each of which is formed at each side end of the cover and has a window to be engaged with each stopping projection. A portion near the opening of each engaging frame and a portion near the opening of each stopping projection facing that engaging frame defining a space therebetween.
摘要翻译：一种锁定结构，包括具有底板的壳体和从底板的两个侧边缘向上延伸的一对侧壁。锁定结构还包括用于封闭限定在一对侧壁的顶端之间的开口的盖，设置在壳体的每个侧壁上的止动突起以及形成在盖的每个侧端处的接合框架，具有与每个停止突起接合的窗口。靠近每个接合框架的开口的部分和靠近每个止动突起的开口的部分，该部分面向着在其间限定空间的接合框架。

23. 发明申请

US20090011065A1 Dry etching method, fine structure formation method, mold and mold fabrication method 有权
标题翻译：干蚀刻法，精细结构形成法，模具和模具制造方法
公开(公告)号：US20090011065A1
公开(公告)日：2009-01-08
申请号：US11659109
申请日：2006-05-23
申请人： Hideo Nakagawa , Masaru Sasago , Tomoyasu Murakami
发明人： Hideo Nakagawa , Masaru Sasago , Tomoyasu Murakami
IPC分类号： B23K10/00 , B44C1/22
CPC分类号： C03B11/082 , B81C1/00531 , B81C2201/0143 , C03B11/084 , C03B2215/07 , C03B2215/412 , C04B41/009 , C04B41/5346 , C04B41/91 , C23F4/00 , G02B6/136 , Y02P40/57 , C04B41/0054 , C04B35/56
摘要： A WC substrate 7 is etched by using plasma 50 generated from a gas including a chlorine atom.
摘要翻译：通过使用由包括氯原子的气体产生的等离子体50来蚀刻WC衬底7。

24. 发明申请

US20070187362A1 Dry etching method, fine structure formation method, mold and mold fabrication method 失效
标题翻译：干蚀刻法，精细结构形成法，模具和模具制造方法
公开(公告)号：US20070187362A1
公开(公告)日：2007-08-16
申请号：US11475190
申请日：2006-06-27
申请人： Hideo Nakagawa , Masaru Sasago , Tomoyasu Murakami
发明人： Hideo Nakagawa , Masaru Sasago , Tomoyasu Murakami
IPC分类号： C03C25/68 , C23F1/00
CPC分类号： C23F4/00 , G02B2006/12166 , G02B2006/12197
摘要： A substance including tungsten and carbon is etched by using plasma. The plasma is generated from a mixed gas of a gas including a fluorine atom, a gas including a nitrogen atom and a gas including a hydrocarbon molecule.
摘要翻译：通过使用等离子体蚀刻包括钨和碳的物质。等离子体由包括氟原子的气体，包括氮原子的气体和包括烃分子的气体的混合气体产生。

25. 发明授权

US07189930B2 Grommet 有权
标题翻译：索环
公开(公告)号：US07189930B2
公开(公告)日：2007-03-13
申请号：US11353064
申请日：2006-02-14
申请人： Tomoyasu Murakami
发明人： Tomoyasu Murakami
IPC分类号： H02G3/18
CPC分类号： H02G3/22 , B60R16/0222 , Y10T16/05
摘要： A grommet includes a cylindrical portion that operable to fit on an outer circumference of an electric wire which passes through a trough hole in a panel, a panel fitting portion on which an inner circumferential edge of the through hole in the panel is fitted, and a connecting portion that connects the cylindrical portion and the panel fitting portion. The panel fitting portion includes a seal projection that is brought into press contact with the panel, and a seal protection wall is provided on the panel fitting portion for reducing the influence to the panel fitting portion caused by a flow of injected water from external.
摘要翻译：索环包括可操作以装配在通过面板中的槽孔的电线的外圆周上的圆柱形部分，面板装配部分，面板中的通孔的内周边缘在其上装配，以及连接部分，其连接圆柱形部分和面板装配部分。面板装配部分包括与面板压接的密封突起，并且在面板装配部分上设有密封保护壁，用于减少由外部注入的水流引起的对面板装配部分的影响。

26. 发明授权

US6074289A Apparatus for holding substrate to be polished 失效
标题翻译：用于保持要抛光的基板的装置
公开(公告)号：US6074289A
公开(公告)日：2000-06-13
申请号：US991640
申请日：1997-12-16
申请人： Tomoyasu Murakami , Mikio Nishio , Mitsunari Satake
发明人： Tomoyasu Murakami , Mikio Nishio , Mitsunari Satake
IPC分类号： B24B37/04 , B24B37/30 , B24B41/06 , H01L21/304 , H01L21/306 , H01L21/683 , B24B7/22
CPC分类号： H01L21/6838 , B24B37/30 , B24B41/06 , H01L21/67092 , H01L21/30625
摘要： An apparatus for holding a substrate to be polished comprises: a rotating rotary shaft; a substrate holding head in the form of a disc; a sealing member provided to the back face of the substrate holding head; a guiding member which is provided to the back face of the substrate holding head to be located outside the sealing member; and a fluid flow path which vertically penetrates the inside of the substrate holding head. The fluid flow path allows an air under pressure introduced from the upper end side thereof to flow out through the opening at the lower end thereof to a space. The sealing member is formed with a ventilation body having a large number of successive vent openings in the inside such as nonwoven fabric.
摘要翻译：用于保持待抛光的基板的装置包括：旋转的旋转轴; 盘状的基板保持头; 设置在所述基板保持头的背面的密封构件; 引导构件，其设置在所述基板保持头的背面以位于所述密封构件的外部; 以及垂直地穿过基板保持头内部的流体流路。流体流路允许从其上端侧引入的压力下方的空气通过其下端的开口流出到空间。密封构件形成有在内部具有大量连续排气孔的通风体，例如无纺织物。

27. 发明授权

US6012967A Polishing method and polishing apparatus 失效
标题翻译：抛光方法和抛光装置
公开(公告)号：US6012967A
公开(公告)日：2000-01-11
申请号：US979693
申请日：1997-11-26
申请人： Mitsunari Satake , Mikio Nishio , Tomoyasu Murakami
发明人： Mitsunari Satake , Mikio Nishio , Tomoyasu Murakami
IPC分类号： B24B1/00 , B24B37/015 , H01L21/304
CPC分类号： B24B37/015 , B24B37/107 , B24B37/34 , B24B49/14 , B24B57/02 , H01L21/31053 , H01L21/3212
摘要： A rotatable platen has a polishing pad adhered to the top surface thereof. A carrier for holding a substrate and a slurry supply pipe for supplying an abrasive slurry onto the near-center region of the polishing pad are provided above the polishing pad. Two lamps for partially irradiating the surface of the polishing pad with visible light or infrared light are provided at respective locations above the polishing pad and upstream of the carrier in the direction of rotation of the platen. Of the area of the polishing pad in contact with the substrate, a region closer to the center of rotation of the polishing pad and a region farther away therefrom are heated by the two lamps.
摘要翻译：可旋转压板具有粘附到其顶表面的抛光垫。在抛光垫的上方设置用于保持基板的载体和用于将磨料浆料供给到抛光垫的近中心区域的浆料供给管。用于以可见光或红外光部分地照射抛光垫的表面的两个灯被设置在抛光垫上方的相应位置和载体的上游沿着压板的旋转方向。在与基板接触的抛光垫的区域中，靠近抛光垫的旋转中心的区域和远离抛光垫的区域被两个灯加热。

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