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21. 发明申请

US20090034215A1 Method and Apparatus for Providing Electrically Isolated Closely Spaced Features on a Printed Circuit Board 失效
标题翻译：在印刷电路板上提供电隔离密封特征的方法和装置
公开(公告)号：US20090034215A1
公开(公告)日：2009-02-05
申请号：US11830348
申请日：2007-07-30
申请人： Jerzy Wieglus , Daniel R. Gamota , Tomasz L. Klosowiak , John B. Szczech , Kin P. Tsui
发明人： Jerzy Wieglus , Daniel R. Gamota , Tomasz L. Klosowiak , John B. Szczech , Kin P. Tsui
IPC分类号： H05K7/00 , H01R43/00
CPC分类号： H05K3/04 , H01L21/4846 , H01L23/145 , H01L23/49838 , H01L23/49866 , H01L29/78603 , H01L2924/0002 , H05K1/0293 , H05K3/22 , H05K2201/068 , H05K2201/09727 , H05K2203/1105 , H05K2203/1476 , H05K2203/175 , Y10T29/49117 , H01L2924/00
摘要： A method and apparatus for forming controlled stress fractures in metal produces electrically isolated, closely spaced circuit sub-entities for use on a metallized printed wiring board. A polymeric substrate has a layer of metal adhered to the surface, and the metal layer is formed into entities. Each entity has a fracture initiating feature formed into it, which serves to initiate and/or direct a stress crack that is induced in the metal. The entities are fractured in a controlled manner by subjecting the substrate and the entities to mechanical stress by a rapid thermal excursion, creating a stress fracture in the entity extending from the fracture initiating feature. The stress fracture divides each entity into two or more sub-entities that are electrically isolated from each other by the stress fracture. The resulting structure can be used to form circuitry requiring very fine spaces for high density printed circuit boards. The rapid thermal stress may be induced by a high intensity, strobed xenon arc lamp.
摘要翻译：用于在金属中形成受控应力断裂的方法和装置产生用于金属化印刷线路板的电隔离，紧密间隔的电路子实体。聚合物基材具有粘附到表面的金属层，并且金属层形成为实体。每个实体具有形成在其中的断裂起始特征，其用于引发和/或引导在金属中诱发的应力裂纹。通过快速热偏移对衬底和实体进行机械应力，以受控的方式将实体断裂，在从断裂起始特征延伸的实体中产生应力断裂。应力断裂将每个实体分为两个或多个通过应力断裂彼此电隔离的子实体。所得到的结构可用于形成对于高密度印刷电路板需要非常精细空间的电路。快速热应力可能由高强度，选通的氙弧灯引起。

22. 发明授权

US06992321B2 Structure and method for fabricating semiconductor structures and devices utilizing piezoelectric materials 失效
公开(公告)号：US06992321B2
公开(公告)日：2006-01-31
申请号：US09903784
申请日：2001-07-13
申请人： Aroon Tungare , Tomasz L. Klosowiak
发明人： Aroon Tungare , Tomasz L. Klosowiak
IPC分类号： H01L21/00
CPC分类号： C30B25/02 , C30B25/18 , C30B29/40 , C30B29/403 , C30B29/406 , C30B29/48 , H01L21/02381 , H01L21/02488 , H01L21/02505 , H01L21/02513 , H01L21/02521 , H01L41/0815 , H01L41/319
摘要： High quality epitaxial layers of piezoelectric monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the piezoelectric monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying piezoelectric monocrystalline material layer.

23. 发明授权

US06963680B2 Optical communication device for rotary motion assemblies 有权
标题翻译：用于旋转运动组件的光通信装置
公开(公告)号：US06963680B2
公开(公告)日：2005-11-08
申请号：US10431735
申请日：2003-05-08
申请人： Robert Lempkowski , Tomasz L. Klosowiak , Huinan Yu
发明人： Robert Lempkowski , Tomasz L. Klosowiak , Huinan Yu
IPC分类号： G02B6/36 , H04M1/02 , G02B6/26
CPC分类号： G02B6/3604 , H04M1/0216
摘要： An optical communication between a first and second body portion connected by a rotatable member is established. A first optical fiber is attached to the first body portion and a second optical fiber is attached to the second body portion in a manner to allow the first and second optical fibers to be co-aligned with each other and with the rotatable member axis of rotation within the rotatable member. An optical signal emitted from a source on an input circuit board on the first body will transfer through the first optical fiber and be transmitted from the first fiber to the second optical fiber while concentrically aligned within the rotatable member, establishing optical communication between the source on the first body portion and a display device on the second body portion.
摘要翻译：建立由可旋转构件连接的第一和第二主体部分之间的光学连接。第一光纤被附接到第一主体部分，并且第二光纤以允许第一和第二光纤彼此共同对准并且具有可旋转构件的旋转轴线的方式附接到第二主体部分在可旋转构件内。从第一主体上的输入电路板上的源发射的光信号将通过第一光纤传输，并从第一光纤传输到第二光纤同心对准在可旋转部件内，建立光源之间的光通信第一主体部分和第二主体部分上的显示装置。

24. 发明授权

US06498358B1 Structure and method for fabricating an electro-optic system having an electrochromic diffraction grating 有权
$Structure and method for fabricating an electro-optic system having an electrochromic diffraction grating$
标题翻译：用于制造具有电致变色衍射光栅的电光系统的结构和方法
公开(公告)号：US06498358B1
公开(公告)日：2002-12-24
申请号：US09908898
申请日：2001-07-20
申请人： Lawrence E. Lach , Robert Lempkowski , Tomasz L. Klosowiak , Keryn Lian
发明人： Lawrence E. Lach , Robert Lempkowski , Tomasz L. Klosowiak , Keryn Lian
IPC分类号： H01L310336
CPC分类号： G02F1/292 , G02F1/025 , G02F1/1523 , H01L21/0237 , H01L21/02381 , H01L21/02439 , H01L21/02488 , H01L21/02521 , H01L21/8258 , H01L27/0605
摘要： A semiconductor structure for implementing optical beam switching includes a monocrystalline silicon substrate and an amorphous oxide material overlying the monocrystalline silicon substrate. A monocrystalline perovskite oxide material overlies the amorphous oxide material and a monocrystalline compound semiconductor material overlies the monocrystalline perovskite oxide material. An optical source component that is operable to transmit radiant energy is formed within the monocrystalline compound semiconductor layer. A diffraction grating including an electrochromic portion is optically coupled to the optical source component.
摘要翻译：用于实现光束切换的半导体结构包括单晶硅衬底和覆盖在单晶硅衬底上的无定形氧化物材料。单晶钙钛矿氧化物材料覆盖无定形氧化物材料，单晶化合物半导体材料覆盖在单晶钙钛矿氧化物材料上。在单晶化合物半导体层内形成可操作以透射辐射能的光源组件。包括电致变色部分的衍射光栅光学耦合到光源部件。

25. 发明授权

US5386341A Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape 失效
标题翻译：柔性基板以U形折叠，其中刚性板位于U形凹口中
公开(公告)号：US5386341A
公开(公告)日：1995-01-31
申请号：US143594
申请日：1993-11-01
申请人： William L. Olson , David W. Currier , Tomasz L. Klosowiak , Mark Fulcher
发明人： William L. Olson , David W. Currier , Tomasz L. Klosowiak , Mark Fulcher
IPC分类号： H01L23/13 , H01L23/498 , H01L23/538 , H05K7/20 , H05K1/00
CPC分类号： H01L23/13 , H01L23/49816 , H01L23/5387 , H01L2224/16225 , H01L2224/16227 , H01L2924/09701 , H01L2924/15311
摘要： Semiconductor carrier assemblies (10, 40) use a flexible substrate (11) to connect to at least one semiconductor device (19). Preferably the flexible substrate (11) also connects to a circuit component, preferably a circuit board (31). The flexible substrate (11) is configured in a U-shaped configuration having at least one rigidizer plate (25; 41, 42) positioned in the notch of the U. Interconnections between the semiconductor device (19) and the flexible substrate (11), and, preferably, the circuit component (31) are provided by solder connections (22, 28). Preferably, two rigidizer plates (41,42) having different temperature coefficients of expansion are positioned in the notch of the U of the flexible substrate (11) and preferably a low modulus adhesive layer (50, 51, 47) is utilized in the assembly to minimize thermal stress.
摘要翻译：半导体载体组件（10,40）使用柔性基板（11）连接至少一个半导体器件（19）。优选地，柔性基板（11）还连接到电路部件，优选地电路板（31）。柔性基板（11）构造成具有至少一个刚性化板（25; 41,42）的U形构造，该刚性板位于U形槽的凹口中。半导体器件（19）和柔性基板（11）之间的互连。，并且优选地，电路部件（31）由焊料连接（22,28）提供。优选地，具有不同温度膨胀系数的两个刚性板（41,42）位于柔性基板（11）的U形凹槽中，并且优选地在该组件中使用低模量粘合剂层（50,51,47）以最小化热应力。

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