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21. 发明申请

US20100295164A1 AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL 有权
标题翻译： AIRGAP MICR-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL
公开(公告)号：US20100295164A1
公开(公告)日：2010-11-25
申请号：US12471163
申请日：2009-05-22
申请人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
发明人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
IPC分类号： H01L23/498
CPC分类号： H01L21/563 , H01L24/01 , H01L24/13 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L33/62 , H01L2224/13016 , H01L2224/1703 , H01L2224/17051 , H01L2224/17505 , H01L2224/17517 , H01L2224/73204 , H01L2224/81192 , H01L2224/81855 , H01L2224/81902 , H01L2224/83192 , H01L2225/06527 , H01L2225/06575 , H01L2225/06593 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01042 , H01L2924/01045 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area. A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.
摘要翻译：封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料芯片和布置成在垫片芯片和弹簧芯片之间形成间隙的弹簧芯片，以及在间隙的一部分中的底部填充材料，以从垫片芯片和弹簧芯片形成模具。封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料芯片和弹簧芯片布置成在垫片芯片和弹簧芯片之间形成间隙，间隙中的底部填充材料从垫片芯片和弹簧芯片形成模具，以及底部填充材料和互连件之间的至少一个壁区。组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。

22. 发明申请

US20120088330A1 AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL 有权
标题翻译： AIRGAP MICR-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL
公开(公告)号：US20120088330A1
公开(公告)日：2012-04-12
申请号：US13269609
申请日：2011-10-09
申请人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
发明人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
IPC分类号： H01L21/50
CPC分类号： H01L21/563 , H01L24/01 , H01L24/13 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L33/62 , H01L2224/13016 , H01L2224/1703 , H01L2224/17051 , H01L2224/17505 , H01L2224/17517 , H01L2224/73204 , H01L2224/81192 , H01L2224/81855 , H01L2224/81902 , H01L2224/83192 , H01L2225/06527 , H01L2225/06575 , H01L2225/06593 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01042 , H01L2924/01045 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.
摘要翻译：组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。

23. 发明申请

US20060057031A1 Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal 有权
标题翻译：用于采用压力金属的液体拾取，运输和分配的毛细管通道探头
公开(公告)号：US20060057031A1
公开(公告)日：2006-03-16
申请号：US11267762
申请日：2005-11-03
申请人： Thomas Hantschel , David Fork , Eugene Chow , Dirk De Bruyker , Michel Rosa
发明人： Thomas Hantschel , David Fork , Eugene Chow , Dirk De Bruyker , Michel Rosa
IPC分类号： B01L3/00 , G01N33/00
CPC分类号： G01N35/1074 , B01J2219/00387 , B01L3/0244 , B01L3/0255 , B01L3/502715 , B01L2300/0819 , B01L2400/025 , B01L2400/0406 , B41J2/14314 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1643 , C40B60/14 , G01N35/1009 , G01N2035/00237 , G01N2035/1037 , G03F7/0002 , Y10T436/2575
摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
摘要翻译：公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

24. 发明授权

US09349558B2 Mechanically acuated heat switch 有权
标题翻译：机械式加热开关
公开(公告)号：US09349558B2
公开(公告)日：2016-05-24
申请号：US13312880
申请日：2011-12-06
申请人： David Eric Schwartz , Sean Roark Garner , Dirk De Bruyker , Ricardo Santos Roque
发明人： David Eric Schwartz , Sean Roark Garner , Dirk De Bruyker , Ricardo Santos Roque
IPC分类号： F28F27/00 , H01H37/02 , H01H57/00 , H01H59/00
CPC分类号： H01H37/02 , H01H57/00 , H01H59/0009
摘要： A heat switch has a first contact, a plug of thermally conductive material, and a mechanical actuator attached to the plug of thermally conductive material, the mechanical actuator arranged to move the plug into contact with the first contact in a first position and to move the plug out of contact with the first contact in a second position responsive to an input signal.
摘要翻译：热开关具有第一接触件，导热材料插塞和附接到导热材料插塞的机械致动器，所述机械致动器被布置成在第一位置移动插头与第一触头接触并移动在响应于输入信号的第二位置中与第一接触件断开接触。

25. 发明授权

US09182454B1 Steered-electron electric-field (SEEF) sensor program 有权
标题翻译：转向电子电场（SEEF）传感器程序
公开(公告)号：US09182454B1
公开(公告)日：2015-11-10
申请号：US13468801
申请日：2012-05-10
申请人： Kirt Reed Williams , Scott Limb , Dirk De Bruyker
发明人： Kirt Reed Williams , Scott Limb , Dirk De Bruyker
IPC分类号： G01R33/02 , G01R1/04 , G01R15/26
CPC分类号： H01J23/09 , G01R33/0213
摘要： Improved electric field (steered-electron electric-field, or SEEF) sensors and methods of manufacturing the same are provided. The SEEF sensors described herein may have increased sensitivity to low-frequency electric fields while being smaller than previously known sensors, and may allow for low-power electric field detection. The invention described herein allows for sensitive, long-term electric field monitoring for applications ranging from personnel detection to underground facility monitoring, as well as extraordinarily small vector sensing (full Poynting vector) for compact direction-finding of emitters of interest. Exemplary electric field sensors may accurately sense, measure, characterize and/or transmit electric field data over a wide frequency range. Importantly, such sensing, measuring, and/or characterizing do not require any physical or resistive contact between the sensor and a source of an electric field.
摘要翻译：提供改进的电场（转向电子电场或SEEF）传感器及其制造方法。本文所述的SEEF传感器可能具有对低频电场的增加的灵敏度，同时小于先前已知的传感器，并且可以允许低功率电场检测。本文所述的发明允许对从人员检测到地下设备监测的应用的敏感的长期电场监测以及用于紧凑的感兴趣的发射器的方向寻找的非常小的矢量感测（全坡普廷矢量）。示例性电场传感器可以在宽的频率范围内精确地感测，测量，表征和/或传输电场数据。重要的是，这种感测，测量和/或表征不需要传感器和电场源之间的任何物理或电阻接触。

26. 发明申请

US20080141877A1 DIGITAL PRINTING PLATE AND SYSTEM WITH ELECTROSTATICALLY LATCHED DEFORMABLE MEMBRANES 有权
标题翻译：数字打印板和系统与静电拼接可变形膜
公开(公告)号：US20080141877A1
公开(公告)日：2008-06-19
申请号：US11613159
申请日：2006-12-19
申请人： Dirk De Bruyker , JengPing Lu , Jurgen H. Daniel , Eugene M. Chow , Armin R. Volkel
发明人： Dirk De Bruyker , JengPing Lu , Jurgen H. Daniel , Eugene M. Chow , Armin R. Volkel
IPC分类号： B41M1/10
CPC分类号： B41M1/10 , B41M1/04 , B41M1/06 , H05K3/207 , H05K2201/091 , H05K2203/105
摘要： A printing surface includes a substrate having latching electrodes on a first surface, a spacer layer on the first surface of the substrate, the spacer layer patterned to form wells such that the latching electrodes reside in the wells, a deformable membrane, the membrane having conductive regions, on the spacer layer to enclose the wells, each enclosed well and its associated region of the membrane forming a pixel membrane, and actuation circuitry to actuate the electrodes to cause selected ones of the pixel membranes to remain in a deflected state when the pixel membranes receive an impulse to return to an undeflected state.
摘要翻译：打印表面包括在第一表面上具有锁定电极的基板，在基板的第一表面上的间隔层，图案化的间隔层以形成孔，使得锁定电极驻留在孔中，可变形的膜，该膜具有导电区域，在间隔层上包围孔，每个封闭的井及其膜的相关区域形成像素膜，以及致动电路，用于致动电极，以使像素膜中选定的像素膜保持在偏转状态，当像素膜受到冲击以返回到未偏转的状态。

27. 发明授权

US09010409B2 Thermal switch using moving droplets 有权
标题翻译：使用移动液滴的热开关
公开(公告)号：US09010409B2
公开(公告)日：2015-04-21
申请号：US13299729
申请日：2011-11-18
申请人： Dirk De Bruyker , David Eric Schwartz , Ricardo Santos Roque , Sean Roark Garner , Matthew D. Eisaman , Joseph Robert Johnson
发明人： Dirk De Bruyker , David Eric Schwartz , Ricardo Santos Roque , Sean Roark Garner , Matthew D. Eisaman , Joseph Robert Johnson
IPC分类号： F28F7/00 , H01L23/34 , F28F13/00
CPC分类号： H01L23/34 , F28F2013/008 , H01L2924/0002 , Y10T137/0391 , Y10T137/206 , H01L2924/00
摘要： A thermal switch has a first substrate, a thermally conductive region on the first substrate, a thermally insulative region on the first substrate adjacent the thermally conductive region, a second substrate arranged adjacent the first substrate, a droplet of thermally conductive liquid between the first and second substrate adjacent the thermally conductive region and the thermally insulative region, and an actuator arranged on one of the first or second substrates to cause the droplet to move between the thermally conductive region and the thermally insulative region on the first substrate.
摘要翻译：热开关具有第一衬底，第一衬底上的导热区域，邻近导热区域的第一衬底上的热绝缘区域，邻近第一衬底布置的第二衬底，第一衬底和第二衬底之间的导热液滴，邻近导热区域和热绝缘区域的第二基板和布置在第一或第二基板中的一个上的致动器，以使液滴在第一基板上的导热区域和热绝缘区域之间移动。

28. 发明授权

US08685216B2 Apparatus and method for improved electrostatic drop merging and mixing 有权
标题翻译：改进静电滴合并和混合的装置和方法
公开(公告)号：US08685216B2
公开(公告)日：2014-04-01
申请号：US11018757
申请日：2004-12-21
申请人： Dirk De Bruyker , Michael I. Recht , Jürgen H. Daniel
发明人： Dirk De Bruyker , Michael I. Recht , Jürgen H. Daniel
IPC分类号： B03C5/02
CPC分类号： B01F13/0076 , B01F13/0071 , B01L3/5027 , B41J2002/14395
摘要： An apparatus for merging and mixing two droplets using electrostatic forces includes a substrate on which are disposed a first originating electrode, a center electrode, and a second originating electrode. The electrodes are disposed such that a first gap is formed between the first originating electrode and the center electrode and a second gap is formed between the second originating electrode and the center electrode. A dielectric material surrounds the electrodes on the substrate. A first droplet is deposited asymmetrically across the first gap, and a second droplet is deposited asymmetrically across the second gap. Voltage potentials are placed across the first gap and second gap, respectively, whereby each droplet is moved toward the other such that they collide together, causing the droplets to merge and mix, and causing oscillations within the collided droplet.
摘要翻译：一种用于使用静电力并入和混合两个液滴的装置包括其上布置有第一起始电极，中心电极和第二起始电极的基板。电极被布置成使得在第一起始电极和中心电极之间形成第一间隙，并且在第二起始电极和中心电极之间形成第二间隙。电介质材料围绕衬底上的电极。第一液滴不对称地沉积在第一间隙上，并且第二液滴不对称地沉积穿过第二间隙。电压电位分别放置在第一间隙和第二间隙之间，由此每个液滴向另一个间隙移动，使得它们碰撞在一起，导致液滴合并和混合，并引起碰撞液滴内的振荡。

29. 发明授权

US08617899B2 Enhanced drop mixing using magnetic actuation 有权
标题翻译：使用磁力驱动增强液滴混合
公开(公告)号：US08617899B2
公开(公告)日：2013-12-31
申请号：US12031519
申请日：2008-02-14
申请人： Dirk De Bruyker , Ali Asgar Saleem Bhagat , Alan G. Bell , Michael I. Recht , Francisco E. Torres
发明人： Dirk De Bruyker , Ali Asgar Saleem Bhagat , Alan G. Bell , Michael I. Recht , Francisco E. Torres
IPC分类号： G01N25/20 , G01N27/00 , G01N25/00 , C12M1/02
CPC分类号： B01F13/0818 , B01F13/0071 , B01F13/0076 , B01F13/0077 , B01F2015/0221 , G01N25/48 , Y10T137/0318 , Y10T137/87652 , Y10T436/25 , Y10T436/2575
摘要： A method and device for merging and mixing at least two separate and distinct fluid drops on a substrate, includes a drop merging area on the surface, where a first magnetic material is placed at a first location. A first drop of fluid is then placed at the first location on the surface, resulting in the first magnetic material being at least partially positioned within the first drop of fluid. A second drop of fluid is then placed at a second location on the surface of the drop merging area. A magnetic field is applied by a varying magnetic field generator to at least a portion of the drop merge area of the substrate, which includes at least the first location on the substrate. The varying magnetic field will act on the first magnetic material to move the first magnetic material within the first drop of fluid, causing a stirring of the fluid. A drop merging force from a drop merging mechanism is applied to at least one of the first drop of fluid and the second drop of fluid within the drop merge area. This causes at least one of the first drop of fluid and the second drop of fluid to move toward the other and make contact. The internal stirring of the fluid in the first drop of fluid by the movement of the magnetic material enhances the mixing of the constituents of the first drop of fluid and the constituents of the second drop of fluid.
摘要翻译：用于在衬底上合并和混合至少两个独立且不同的液滴的方法和装置包括在表面上的液滴合并区域，其中第一磁性材料放置在第一位置。然后将第一滴流体放置在表面上的第一位置处，导致第一磁性材料至少部分地定位在第一液滴内。然后将第二滴流体放置在滴液合并区域的表面上的第二位置。通过变化的磁场发生器将磁场施加到衬底的下落合并区域的至少一部分，其至少包括衬底上的第一位置。变化的磁场将作用在第一磁性材料上以使第一磁性材料在第一液滴内移动，引起流体的搅拌。来自液滴合并机构的液滴合并力被施加到液滴合并区域中的第一液体流体和第二液体流中的至少一个。这使得第一液体流体和第二液体液滴中的至少一个朝向另一个流体移动并进行接触。通过磁性材料的运动在第一滴流体中内部流体的内部搅拌增强了第一滴流体的组分与第二滴流体的组分的混合。

30. 发明申请

US20110107928A1 DIGITAL PRINTING PLATE AND SYSTEM WITH ELECTROSTATICALLY LATCHED DEFORMABLE MEMBRANES 有权
标题翻译：数字打印板和系统与静电拼接可变形膜
公开(公告)号：US20110107928A1
公开(公告)日：2011-05-12
申请号：US12957113
申请日：2010-11-30
申请人： Dirk De Bruyker , JengPing Lu , Jürgen H. Daniel , Eugene M. Chow , Armin R. Völkel
发明人： Dirk De Bruyker , JengPing Lu , Jürgen H. Daniel , Eugene M. Chow , Armin R. Völkel
IPC分类号： B41M1/10
CPC分类号： B41M1/10 , B41M1/04 , B41M1/06 , H05K3/207 , H05K2201/091 , H05K2203/105
摘要： A printing surface includes a substrate having latching electrodes on a first surface, a spacer layer on the first surface of the substrate, the spacer layer patterned to form wells such that the latching electrodes reside in the wells, a deformable membrane, the membrane having conductive regions, on the spacer layer to enclose the wells, each enclosed well and its associated region of the membrane forming a pixel membrane, and actuation circuitry to actuate the electrodes to cause selected ones of the pixel membranes to remain in a deflected state when the pixel membranes receive an impulse to return to an undeflected state.
摘要翻译：打印表面包括在第一表面上具有锁定电极的基板，在基板的第一表面上的间隔层，图案化的间隔层以形成孔，使得锁定电极驻留在孔中，可变形的膜，该膜具有导电区域，在间隔层上包围孔，每个封闭的井及其膜的相关区域形成像素膜，以及致动电路，用于致动电极，以使像素膜中选定的像素膜保持在偏转状态，当像素膜受到冲击以返回到未偏转的状态。

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