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    • 25. 发明申请
    • Binding Processing Apparatus
    • 装订处理装置
    • US20080075560A1
    • 2008-03-27
    • US10571754
    • 2004-11-10
    • Atsushi KurabayashiToru YoshieTakao Hasegawa
    • Atsushi KurabayashiToru YoshieTakao Hasegawa
    • B42B5/08
    • B42B5/08
    • A binding processing apparatus 1 is provided with a punch mechanism 2 and a binding processing mechanism 3 for executing a binding processing by a binder. When a sheet P is fed from a printing apparatus 50 of a copier or the like, the sheet is butted to a stopper plate 9 of the punch mechanism, sheet aligning sliders 10 push both left and right sides thereof to position and punch holes are formed by a punch block 7 and a die 8. Thereafter, the sheet is fed to a sheet tray 15 of the binding processing mechanism, one set of the sheets are aligned and a ring shape binder is pinched by a pusher 17 to fit the ring shape binder to the punch holes of the sheets, and a brochure subjected to a binding processing is discharged to a stack tray 4. A binder cartridge 16 can contain a number of the binders and the binding processing can be executed continuously.
    • 装订处理装置1设置有冲压机构2和用于通过粘合剂执行装订处理的装订处理机构3。 当从复印机等的打印装置50送出纸张P时,将纸张对接到打孔机构的止动板9上,纸张排列滑块10将其左侧和右侧推动到位置,并且形成冲孔 通过冲压块7和模具8。 此后,将片材供给到装订处理机构的片材托盘15,将一组片材排列,并且由推动器17夹住环形粘合剂以将环形粘合剂装配到片材的冲孔,并且 承受装订处理的小册子被排出到堆叠托盘4。 粘合剂盒16可以包含多个粘合剂,并且可以连续执行粘合处理。
    • 27. 发明授权
    • Layout device
    • 布局设备
    • US06971074B2
    • 2005-11-29
    • US10404062
    • 2003-04-02
    • Takao HasegawaTsunehiro Koyama
    • Takao HasegawaTsunehiro Koyama
    • G06F17/50G06F9/45H01L21/82
    • G06F17/5036G06F17/5068
    • A layout device includes a processing type setting part for classifying a layout of a semiconductor integrated circuit in every area in accordance with the percentage voltage drop in the circuit, and for extracting a processing target portion composed of a group of areas, including an area having a percentage voltage drop exceeding a predetermined threshold; a layout generating part for applying layout change processing to alleviate differences of the percentage voltage drops among the areas for circuit components, such as power supply wiring and connecting points in the processing target portion.
    • 布局装置包括处理类型设定部分,用于根据电路中的电压降百分比对每个区域中的半导体集成电路的布局进行分类,并且提取由一组区域组成的处理目标部分,该部分区域包括具有 超过预定阈值的百分比电压降; 布局生成部,其用于应用布局变更处理,以减轻电路部件的区域中的电压百分比的差异,例如处理对象部分中的电源布线和连接点。