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21. 发明授权

US08581270B2 Organic light-emitting display apparatus 有权
标题翻译：有机发光显示装置
公开(公告)号：US08581270B2
公开(公告)日：2013-11-12
申请号：US13069039
申请日：2011-03-22
申请人： Jin-Woo Park , Myung-Jong Jung , Tae-Min Kang , Sang-Woo Pyo , Beom-Joon Kim , Hyo-Yeon Kim
发明人： Jin-Woo Park , Myung-Jong Jung , Tae-Min Kang , Sang-Woo Pyo , Beom-Joon Kim , Hyo-Yeon Kim
IPC分类号： H01L29/20
CPC分类号： H01L51/5096 , H01L27/3211 , H01L51/5036
摘要： An organic light-emitting display apparatus is disclosed. The organic light-emitting display apparatus includes a first sub-pixel, a second sub-pixel, and a third sub-pixel, where each of said first, second and third sub-pixels displays a different color, a substrate, a first electrode disposed on the substrate, a second electrode disposed on the first electrode, facing the first electrode, an organic emission layer disposed between the first electrode and the second electrode, including a first organic emission layer, a second organic emission layer, and a third organic emission layer, and an electron acceptor layer disposed between the first electrode and the second electrode configured to contact the organic emission layer, where the first organic emission layer is disposed in the first sub-pixel, the second organic emission layer is disposed in the second sub-pixel, and the third organic emission layer is commonly disposed over the first sub-pixel, the second sub-pixel, and the third sub-pixel, and where the electron acceptor layer is disposed between the first organic emission layer and the third organic emission layer in the first sub-pixel and between the second organic emission layer and the third organic emission layer in the second sub-pixel.
摘要翻译：公开了一种有机发光显示装置。有机发光显示装置包括第一子像素，第二子像素和第三子像素，其中所述第一，第二和第三子像素中的每一个显示不同的颜色，衬底，第一电极设置在所述基板上的第二电极，设置在所述第一电极上的面对所述第一电极的第二电极，设置在所述第一电极和所述第二电极之间的有机发射层，包括第一有机发射层，第二有机发射层和第三有机发射层发射层和设置在第一电极和第二电极之间的电子受体层，其被配置为接触有机发射层，其中第一有机发射层设置在第一子像素中，第二有机发射层设置在第二子像素中子像素，并且第三有机发射层通常设置在第一子像素，第二子像素和第三子像素上，并且其中电子受体层为dis 在第一子像素中的第一有机发射层和第三有机发射层之间以及第二子像素中的第二有机发射层和第三有机发射层之间。

22. 发明申请

US20110237027A1 Method Of Forming Package-On-Package And Device Related Thereto 有权
标题翻译：形成封装封装和相关设备的方法
公开(公告)号：US20110237027A1
公开(公告)日：2011-09-29
申请号：US13027511
申请日：2011-02-15
申请人： Tae-Hun Kim , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim , Sun-Hye Lee
发明人： Tae-Hun Kim , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim , Sun-Hye Lee
IPC分类号： H01L21/50
CPC分类号： H01L23/5226 , H01L21/78 , H01L23/3128 , H01L23/481 , H01L24/14 , H01L24/81 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/13022 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/94 , H01L2225/06541 , H01L2225/06565 , H01L2225/1005 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/01019 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2224/11 , H01L2924/00012
摘要： Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.
摘要翻译：提供了一种形成封装封装的方法。使用晶片级成型工艺形成覆盖晶片的封装。晶片包括多个半导体芯片和穿过半导体芯片的多个通孔硅通孔（TSV）。密封剂可以具有与TSV对齐的开口。密封剂和半导体芯片被分割以形成多个半导体封装。另一个半导体封装堆叠在从半导体封装中选择的一个上。另一个半导体封装电连接到TSV。

23. 发明申请

US20070137571A1 Deposition apparatus 有权
标题翻译：沉积装置
公开(公告)号：US20070137571A1
公开(公告)日：2007-06-21
申请号：US11637375
申请日：2006-12-11
申请人： Hun Kim , Jin-Woo Park
发明人： Hun Kim , Jin-Woo Park
IPC分类号： C23C16/00
CPC分类号： C23C14/042
摘要： A deposition apparatus including: a chamber; a mask assembly including a mask arranged to deposit a material on a substrate included in the chamber and a mask frame for supporting the mask; and a magnet unit including a first magnet unit which contacts (or adheres or chucks or secures) the mask assembly to the substrate by magnetic force; and a second magnet unit corresponding to the mask frame, in order to ensure that the mask more closely contacts the substrate.
摘要翻译：一种沉积设备，包括：室; 掩模组件，其包括掩模，所述掩模布置成将材料沉积在包括在所述室中的基板上;掩模框架，用于支撑所述掩模; 以及包括第一磁体单元的磁体单元，所述第一磁体单元通过磁力将所述掩模组件接触（或粘附或固定）到所述基板）以及对应于掩模框架的第二磁体单元，以确保掩模更接近基板。

24. 发明申请

US20050151468A1 Organic electroluminescent device 有权
标题翻译：有机电致发光器件
公开(公告)号：US20050151468A1
公开(公告)日：2005-07-14
申请号：US10992367
申请日：2004-11-19
申请人： Jin-Woo Park , Seoung-Yoon Ryu , Hun Kim , Yasuhiro Chiba
发明人： Jin-Woo Park , Seoung-Yoon Ryu , Hun Kim , Yasuhiro Chiba
IPC分类号： H05B33/22 , H01L51/50 , H01L51/52 , H05B33/02 , H05B33/12 , H05B33/14 , H05B33/26 , H05B33/28
CPC分类号： H01L51/5234 , H01L2251/5315 , Y10T428/24802 , Y10T428/24917 , Y10T428/26
摘要： An organic electroluminescent device, including a substrate, a first electrode layer formed on the substrate, and a second electrode layer formed on the first electrode layer. An organic layer, having a light-emitting layer, is interposed between the first electrode layer and the second electrode layer, and a transparent layer is formed on the second electrode layer. Damage to the organic layer may be prevented while maintaining a transmittance of the second electrode layer.
摘要翻译：一种有机电致发光器件，包括衬底，形成在衬底上的第一电极层和形成在第一电极层上的第二电极层。具有发光层的有机层介于第一电极层和第二电极层之间，在第二电极层上形成透明层。可以防止对有机层的损伤，同时保持第二电极层的透射率。

25. 发明授权

US06784612B2 Organic EL display device and method of encapsulating the same 失效
标题翻译：有机EL显示装置及其封装方法
公开(公告)号：US06784612B2
公开(公告)日：2004-08-31
申请号：US10067818
申请日：2002-02-08
申请人： Jin-Woo Park , Seung-Yong Song , Hun Kim
发明人： Jin-Woo Park , Seung-Yong Song , Hun Kim
IPC分类号： H01J162
CPC分类号： H01L51/5259 , H01L51/5246 , H01L51/525 , Y10S428/917
摘要： An organic electroluminescent (EL) display device includes an organic EL element formed on a substrate. The organic EL element includes a lower electrode, an organic EL layer and an upper electrode that are sequentially stacked on the substrate. A flat panel is attached to the substrate to encapsulate the organic EL element. At least one through hole is formed in the organic EL display device so as to allow gas inside the organic EL display device to flow out during an encapsulation process. A cap is provided to shut the one or more through holes.
摘要翻译：有机电致发光（EL）显示装置包括形成在基板上的有机EL元件。有机EL元件包括依次层叠在基板上的下电极，有机EL层和上电极。将平板连接到基板以封装有机EL元件。在有机EL显示装置中形成至少一个通孔，以便在封装过程中使有机EL显示装置内的气体流出。提供盖以关闭一个或多个通孔。

26. 发明授权

US08754515B2 Stacked packages having through hole vias 有权
标题翻译：具有通孔通孔的堆叠封装
公开(公告)号：US08754515B2
公开(公告)日：2014-06-17
申请号：US13614931
申请日：2012-09-13
申请人： Tae-Hun Kim , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim , Sun-Hye Lee
发明人： Tae-Hun Kim , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim , Sun-Hye Lee
IPC分类号： H01L23/02 , H01L21/00 , H01L25/065 , H01L25/10 , H01L25/00 , H01L21/78 , H01L23/48 , H01L23/00 , H01L23/31
CPC分类号： H01L23/5226 , H01L21/78 , H01L23/3128 , H01L23/481 , H01L24/14 , H01L24/81 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/13022 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/94 , H01L2225/06541 , H01L2225/06565 , H01L2225/1005 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/01019 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2224/11 , H01L2924/00012
摘要： Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.
摘要翻译：提供了一种形成封装封装的方法。使用晶片级成型工艺形成覆盖晶片的封装。晶片包括多个半导体芯片和穿过半导体芯片的多个通孔硅通孔（TSV）。密封剂可以具有与TSV对齐的开口。密封剂和半导体芯片被分割以形成多个半导体封装。另一个半导体封装堆叠在从半导体封装中选择的一个上。另一个半导体封装电连接到TSV。

27. 发明授权

US08192546B2 Deposition apparatus 有权
标题翻译：沉积装置
公开(公告)号：US08192546B2
公开(公告)日：2012-06-05
申请号：US11637375
申请日：2006-12-11
申请人： Hun Kim , Jin-Woo Park
发明人： Hun Kim , Jin-Woo Park
IPC分类号： C23C16/00
CPC分类号： C23C14/042
摘要： A deposition apparatus including: a chamber; a mask assembly including a mask arranged to deposit a material on a substrate included in the chamber and a mask frame for supporting the mask; and a magnet unit including a first magnet unit which contacts (or adheres or chucks or secures) the mask assembly to the substrate by magnetic force; and a second magnet unit corresponding to the mask frame, in order to ensure that the mask more closely contacts the substrate.
摘要翻译：一种沉积设备，包括：室; 掩模组件，其包括掩模，所述掩模布置成将材料沉积在包括在所述室中的基板上;掩模框架，用于支撑所述掩模; 以及包括第一磁体单元的磁体单元，所述第一磁体单元通过磁力将所述掩模组件接触（或粘附或固定）到所述基板）以及对应于掩模框架的第二磁体单元，以确保掩模更接近基板。

28. 发明授权

US09048452B2 Method for manufacturing transparent electrode of organic light emitting display device and organic light emitting display device using the transparent electrode 有权
标题翻译：用于制造有机发光显示装置的透明电极的方法和使用该透明电极的有机发光显示装置
公开(公告)号：US09048452B2
公开(公告)日：2015-06-02
申请号：US13935354
申请日：2013-07-03
申请人： Hun Kim , Jin-Woo Park , Jai-Hyuk Choi
发明人： Hun Kim , Jin-Woo Park , Jai-Hyuk Choi
IPC分类号： H01L21/00 , H01L51/52
CPC分类号： H01L51/5203 , H01L51/0021 , H01L51/5206 , H01L2251/306
摘要： A method for manufacturing an organic light emitting display device includes mounting in a chamber a substrate where a transparent electrode is to be formed and a SnO member that is a source of forming the transparent electrode, injecting argon gas and oxygen into the chamber, and evaporating the SnO member to be deposited on the substrate.
摘要翻译：一种有机发光显示装置的制造方法，其特征在于，在室内安装有要形成透明电极的基板和作为形成透明电极的源的SnO构件，将氩气和氧气注入到室内，所述SnO构件被沉积在所述衬底上。

29. 发明申请

US20130001800A1 METHOD OF FORMING PACKAGE-ON-PACKAGE AND DEVICE RELATED THERETO 有权
标题翻译：形成包装的方法和与之相关的装置
公开(公告)号：US20130001800A1
公开(公告)日：2013-01-03
申请号：US13614931
申请日：2012-09-13
申请人： Tae-Hun KIM , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim , Sun-Hye Lee
发明人： Tae-Hun KIM , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim , Sun-Hye Lee
IPC分类号： H01L23/48
CPC分类号： H01L23/5226 , H01L21/78 , H01L23/3128 , H01L23/481 , H01L24/14 , H01L24/81 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/13022 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/94 , H01L2225/06541 , H01L2225/06565 , H01L2225/1005 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/01019 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2224/11 , H01L2924/00012
摘要： Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.
摘要翻译：提供了一种形成封装封装的方法。使用晶片级成型工艺形成覆盖晶片的封装。晶片包括多个半导体芯片和穿过半导体芯片的多个通孔硅通孔（TSV）。密封剂可以具有与TSV对齐的开口。密封剂和半导体芯片被分割以形成多个半导体封装。另一个半导体封装堆叠在从半导体封装中选择的一个上。另一个半导体封装电连接到TSV。

30. 发明授权

US08293580B2 Method of forming package-on-package and device related thereto 有权
标题翻译：形成包装封装的方法和与其相关的装置
公开(公告)号：US08293580B2
公开(公告)日：2012-10-23
申请号：US13027511
申请日：2011-02-15
申请人： Tae-Hun Kim , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim , Sun-Hye Lee
发明人： Tae-Hun Kim , Jin-Woo Park , Dae-Young Choi , Mi-Yeon Kim , Sun-Hye Lee
IPC分类号： H01L21/00 , H01L23/02
CPC分类号： H01L23/5226 , H01L21/78 , H01L23/3128 , H01L23/481 , H01L24/14 , H01L24/81 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/13022 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/94 , H01L2225/06541 , H01L2225/06565 , H01L2225/1005 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/01019 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2224/11 , H01L2924/00012
摘要： Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.
摘要翻译：提供了一种形成封装封装的方法。使用晶片级成型工艺形成覆盖晶片的封装。晶片包括多个半导体芯片和穿过半导体芯片的多个通孔硅通孔（TSV）。密封剂可以具有与TSV对齐的开口。密封剂和半导体芯片被分割以形成多个半导体封装。另一个半导体封装堆叠在从半导体封装中选择的一个上。另一个半导体封装电连接到TSV。

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