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21. 发明专利

GB2350077B Wafer polishing apparatus 未知
公开(公告)号：GB2350077B
公开(公告)日：2002-05-01
申请号：GB9926539
申请日：1999-11-09
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU
IPC分类号： B24B37/013 , B24B37/30 , B24B49/10 , B24B49/16 , H01L21/321 , B24B37/04
摘要： The present invention is a wafer polishing apparatus with a device that detects the polishing end according to a change in rotation resistance of a wafer during polishing. The wafer polishing apparatus comprises a head body and a carrier which are connected with each other by a connecting bar which is provided with a strain gage, and determines strain in a horizontal direction of the connecting bar by the strain gage so as to determine a rotation torque of the carrier, whereby accurately detects the polishing end. Since a retainer ring is mounted to the outer periphery of the carrier via an O ring, the impact at contacting of the wafer with the retainer ring can be absorbed by the O ring, thus the wafer is prevented from damage. Because the retainer ring is mounted to the carrier without a gap, the outer periphery of the wafer is enclosed by the retainer ring, and the wafer can be polished in a state where its center is held on the central axis of the carrier. Therefore, the polishing precision of the wafer can be improved.

22. 发明专利

GB2349839B Apparatus for polishing wafers 未知
公开(公告)号：GB2349839B
公开(公告)日：2001-11-21
申请号：GB9929982
申请日：1999-12-17
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing wafers wherein a retainer ring 40 is held by a carrier 32 of a wafer-holding head 20 by using an O-ring 31. Further, a protection sheet 80 for a wafer 2 is held by the retainer ring so as to cover the surface of an air-blow member 34 of the carrier. While the wafer is being held and polished, therefore, the back surface of the wafer does not come into direct contact with the carrier, and the protection sheet is interposed between the back surface of the wafer and the carrier.

23. 发明专利

GB2351462A Wafer polishing head 未知
公开(公告)号：GB2351462A
公开(公告)日：2001-01-03
申请号：GB0006002
申请日：2000-03-13
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU
IPC分类号： H01L21/304 , B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , B24B49/16
摘要： A wafer polishing head comprises a body portion 40, a wafer carrier 20 and a retainer ring 30, the wafer carrier 20 and the retainer ring 30 being movable relative to each other and to the body portion 40 by means of air bags 51 and 61, wherein the air bag 51 for moving the wafer carrier 20 is arranged around the outer periphery of the body portion 40 and the air bag 61 for moving the retainer ring 30 is arranged at the central portion of the head body 40. The air bags 51 and 61 may be made from rubber sheet.

24. 发明专利

DE19960458A1 未知
公开(公告)号：DE19960458A1
公开(公告)日：2000-11-30
申请号：DE19960458
申请日：1999-12-15
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304 , B24B29/02
摘要： An apparatus for polishing wafers wherein a retainer ring 40 is held by a carrier 32 of a wafer-holding head 20 by using an O-ring 31. Further, a protection sheet 80 for a wafer 2 is held by the retainer ring so as to cover the surface of an air-blow member 34 of the carrier. While the wafer is being held and polished, therefore, the back surface of the wafer does not come into direct contact with the carrier, and the protection sheet is interposed between the back surface of the wafer and the carrier.

25. 发明专利

GB2349839A Apparatus for polishing wafers 未知
公开(公告)号：GB2349839A
公开(公告)日：2000-11-15
申请号：GB9929982
申请日：1999-12-17
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing wafers wherein a retainer ring 40 is held by a carrier 32 of a wafer-holding head 20 by an O-ring 31. Further, a protection sheet 80 for a wafer 2 is held by the retainer ring 40 so as to cover the surface of an air-blow member 34 of the carrier 32.

26. 发明专利

DE19755716A1 Device for determining the quantity of material removed e.g. from a semiconductor wafer 未知
公开(公告)号：DE19755716A1
公开(公告)日：1998-06-18
申请号：DE19755716
申请日：1997-12-15
申请人： TOKYO SEIMITSU CO LTD
发明人： INABA TAKAO , NUMOTO MINORU
IPC分类号： G01B21/08 , B24B37/013 , B24B37/07 , B24B49/10 , H01L21/304
摘要： the device has a grinding/polishing element moved relative to a table (44) holding the wafer (50) whilst one surface of the wafer is pressed against a surface of the grinding/polishing element (14). A differential transformer (60) has a coil and a core (64). The coil moves in contact with the table. A supporting element (66) supports the core of the transformer so as to hold the core at a constant distance from the surface of the grinding/polishing element. The quantity of material removed from the plate is determined by measuring the displacement of the coil wrt. the core as the plate is being ground/polished.

27. 发明专利

MY118577A APPARATUS FOR POLISHING WAFERS 未知
公开(公告)号：MY118577A
公开(公告)日：2004-12-31
申请号：MYPI9905530
申请日：1999-12-17
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU
IPC分类号： B24B7/22 , B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
摘要： AN APPARATUS FOR POLISHING WAFERS WHEREIN A RETAINER RING (40) IS HELD BY A CARRIER (32) OF A WAFER-HOLDING HEAD (20) BY USING ON O-RING (31). FURTHER, A PROTECTION SHEET (80) FOR A WAFER (2) IS HELD BY THE RETAINER RING SO AS TO COVER THE SURFACE OF AN AIR-BLOW MEMBER (34) OF THE CARRIER. WHILE THE WAFER IS BEING HELD AND POLISHED, THEREFORE, THE BACK SURFACE OF THE WAFER DOES NOT COME INTO DIRECT CONTACT WITH THE CARRIER, AND THE PROTECTION SHEET IS INTERPOSED BETWEEN THE BACK SURFACE OF THE WAFER AND THE CARRIER.FIGURE 1

28. 发明专利

DE69827062D1 未知
公开(公告)号：DE69827062D1
公开(公告)日：2004-11-25
申请号：DE69827062
申请日：1998-04-02
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU , INABA TAKAO , SAKAI KENJI , TERASHITA HISASHI , SATOH MANABU
IPC分类号： B24B37/30 , B24B49/16 , B24B37/04
摘要： The polishing apparatus (100) comprises a turn table (10), which polishes a semiconductor wafer (2), and a holding and pressing part (20), which holds and presses the semiconductor wafer (2) against a polishing surface (12a) of the turn table (10). The holding and pressing part (20) transmits a force from an air bag (62) to the semiconductor wafer (2) via a pressurized fluid layer (L) to thereby press the semiconductor wafer (2) against the polishing surface (12a) via the pressurized fluid layer (L), so that the semiconductor wafer (2) can be polished. Thereby, it is possible to uniformly polish the semiconductor wafer (2).

29. 发明专利

GB2380700A Wafer polishing apparatus 未知
公开(公告)号：GB2380700A
公开(公告)日：2003-04-16
申请号：GB0222814
申请日：1999-10-15
申请人： TOKYO SEIMITSU CO LTD
发明人： INABA TAKAO , NUMOTO MINORU , SAKAI KENJI
IPC分类号： B24B37/013 , B24B37/30 , B24B49/04 , B24B49/10 , B24B49/14 , B24B37/04 , H01L21/304
摘要： Wafer polishing apparatus comprises a rotatable polishing platen which carries a polishing cloth, a wafer carrier 412 and a pad 611 and 612 arranged around a wafer which contacts the cloth at a predetermined pressure. The apparatus also comprises a detector 51 and 52 which measures the position of the pad relative to the back of the wafer or the wafer carrier 412. A temperature sensor 72 measures the temperature in the neighbourhood of the detector 51 and 52. The amount of polishing performed is calculated based on the signal from the detector 51 and 52 corrected by the measured temperature. The amount of polishing may also be corrected using measurements from temperature sensors 73 and 74 lying between the detector 51 and 52 and the back of the wafer and between the detector 51 and 52 and the portion of the pad 612 facing the polishing cloth. The temperature sensors 72-74 compensate for the different amounts of thermal expansion experienced by the apparatus during polishing.

30. 发明专利

DE10012420A1 Wafer polishing head for polishing semiconductor wafers relying upon a chemical-mechanical polishing (CMP) method, has wafer carrier being moved relative to retainer ring and to body portion 未知
公开(公告)号：DE10012420A1
公开(公告)日：2000-12-28
申请号：DE10012420
申请日：2000-03-15
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU
IPC分类号： H01L21/304 , B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , B24B49/16 , H01L21/302
摘要： The head includes holder head with head body (40) that rotates and is arranged opposed to polishing table (4), a wafer carrier (20) loosely supported by the head body, and a retainer ring (30) supported by the head body arranged along the outer periphery of the carrier concentric with it so as to surround the periphery of the wafer (2) at time of polishing. The polishing table has a polishing pad (3) stretched on the upper surface to polish the semiconductor wafer, and a holder head (10) that holds the wafer, pushes it to the polishing pad with a predetermined force and rotates. A drive unit rotates head body. Wafer carrier has air blowing member that forms a pressurized air layer relative to the wafer and transmits a pushing force to the wafer through the air layer.

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