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    • 22. 发明授权
    • Fluidic structures
    • 流体结构
    • US07517043B2
    • 2009-04-14
    • US11014356
    • 2004-12-16
    • John S. FitchScott ElrodJurgen DanielJames W. StasiakSteven A. BuhlerBabur B. HadimiogluJoy RoyMichael C. WeisbergJames C. Zesch
    • John S. FitchScott ElrodJurgen DanielJames W. StasiakSteven A. BuhlerBabur B. HadimiogluJoy RoyMichael C. WeisbergJames C. Zesch
    • B41J2/015
    • B01L3/0268B01L2200/12B01L2300/0819B01L2400/0433B01L2400/0605B01L2400/084
    • Various fluidic techniques can employ ducting structures, such as microstructures, that extend between other components, such as plate-like structures. A ducting structure can, for example, include an inlet opening toward or near one plate-like structure, an outlet opening toward or near another plate-like structure, and a duct in which fluid flows after being received through the inlet opening and before being provided through the outlet opening. In some implementations, a ducting structure is photo-defined, such as by exposing a photoimageable structure and then removing either exposed or unexposed regions. In some implementations, a ducting structure is a freestanding polymer microstructure. In some implementations, ducting structures are microstructures that extend approximately the same length between first and second plate-like structures, and have a ratio of length to maximum cavity diameter of approximately two or more. A printhead implementation includes an array of such microstructures supported between drive side and drop side assemblies.
    • 各种流体技术可以采用在诸如板状结构的其他部件之间延伸的管道结构,例如微结构。 管道结构可以例如包括朝向或靠近一个板状结构的入口开口,朝向或接近另一个板状结构的出口,以及在通过入口开口之后流体流动的管道 通过出口开口提供。 在一些实施方案中,管道结构是光限定的,例如通过曝光可光成像的结构,然后去除暴露或未曝光的区域。 在一些实施方案中,管道结构是独立的聚合物微结构。 在一些实施方案中,管道结构是在第一和第二板状结构之间延伸大致相同长度的微结构,并且具有大约两个或更多个长度与最大腔直径的比率。 打印头实现包括支撑在驱动侧和液滴侧组件之间的这种微结构的阵列。
    • 28. 发明授权
    • Bipolar transistors with high voltage MOS transistors in a single
substrate
    • 在单个衬底中具有高压MOS晶体管的双极晶体管
    • US5229308A
    • 1993-07-20
    • US878141
    • 1992-05-04
    • Tuan A. VoMohamad M. MojaradiSteven A. Buhler
    • Tuan A. VoMohamad M. MojaradiSteven A. Buhler
    • H01L21/8249
    • H01L21/8249Y10S148/009
    • A method of manufacturing a semiconductor device having a bipolar transistor for ordinary logic operation, as well as a high voltage MOS transistor which are provided in a single semiconductor substrate. The process includes the steps of making high voltage MOS transistors which comprises the steps of n-well fabrication, first drift region fabrication, second drift region fabrication, source and drain contact region fabrication and making bipolar transistors within the same silicon substrate as the high voltage MOS transistors which includes the step of base region fabrication where the steps for fabricating the second drift region of the high voltage MOS transistor and the base region of the bipolar transistor are combined so that both regions are created simultaneously.
    • 一种用于普通逻辑运算的半导体器件的制造方法以及设置在单个半导体衬底中的高压MOS晶体管。 该方法包括制造高电压MOS晶体管的步骤,其包括以下步骤:n阱制造,第一漂移区制造,第二漂移区制造,源极和漏极接触区域制造以及在与高电压相同的硅衬底内制造双极晶体管 MOS晶体管包括基极区制造步骤,其中组合用于制造高压MOS晶体管的第二漂移区和双极晶体管的基极区的步骤,使得两个区域同时产生。
    • 30. 发明授权
    • Method of forming micromachined fluid ejectors using piezoelectric actuation
    • 使用压电驱动形成微机械流体喷射器的方法
    • US08359748B2
    • 2013-01-29
    • US12273573
    • 2008-11-19
    • Baomin XuSteven A. BuhlerStephen D. WhiteScott Jong Ho Limb
    • Baomin XuSteven A. BuhlerStephen D. WhiteScott Jong Ho Limb
    • B21D53/76H04R17/00
    • B41J2/14233B41J2/161B41J2/1623B41J2/1628B41J2/1629B41J2/1634B41J2/1639B41J2/1642B41J2/1643B41J2/1646B41J2002/14475Y10T29/42Y10T29/49401
    • A method of forming a fluid ejector includes forming a recess well into a silicon wafer on a first side of the silicon wafer, and filling the recess well with a sacrificial material. A thin layer structure is deposited onto the first side of a silicon wafer covering the filled recess well. Then a thin film piezoelectric is bonded or deposited to the thin layer structure, and a hole is formed in the thin layer structure exposing at least a portion of the sacrificial material. The sacrificial material is removed from the recess well, wherein the hole in the thin layer in the recess well with the sacrificial material removed, form a fluid inlet. An opening area in the silicon wafer is formed on a second side of the silicon wafer. Then a nozzle plate is formed having a recess portion and an aperture within the recess portion. The nozzle plate is attached to the second side of the silicon wafer, with the recess portion positioned within the open area. The thin layer structure and the recess portion of the nozzle plate define a depth of a fluid cavity defined by the thin layer structure, the recess portion of the nozzle plate and the sidewalls of the silicon wafer.
    • 形成流体喷射器的方法包括在硅晶片的第一侧上将凹槽形成凹槽,并用牺牲材料填充凹槽。 在覆盖填充的凹槽的硅晶片的第一侧上沉积薄层结构。 然后,薄膜压电体被结合或沉积到薄层结构上,并且在该薄层结构中形成一个露出至少一部分牺牲材料的孔。 牺牲材料从凹槽中移除,其中凹槽中的薄层中的孔与除去牺牲材料的孔形成流体入口。 硅晶片的开口区域形成在硅晶片的第二侧上。 然后形成在凹部内具有凹部和孔的喷嘴板。 喷嘴板附接到硅晶片的第二侧,凹部位于开放区域内。 喷嘴板的薄层结构和凹部限定由薄层结构,喷嘴板的凹部和硅晶片的侧壁限定的流体腔的深度。