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21. 发明申请

US20140296714A1 ULTRASONIC PROBE, BIOINFORMATION MEASUREMENT DEVICE, AND BIOINFORMATION MEASUREMENT METHOD 审中-公开
标题翻译：超声探头，生物测量装置和生物测量方法
公开(公告)号：US20140296714A1
公开(公告)日：2014-10-02
申请号：US14123514
申请日：2012-05-31
申请人： Shigehiro Kuroki , Shiro Yamashita
发明人： Shigehiro Kuroki , Shiro Yamashita
IPC分类号： A61B8/02
CPC分类号： A61B8/02 , A61B5/024 , A61B5/0402 , A61B8/04 , A61B8/065 , A61B8/0883 , A61B8/14 , A61B8/4444 , A61B8/469 , A61B8/5223 , A61B8/565
摘要： With an ultrasonograph, medical information of a heart could not be accurately obtained as the cardiac apex of the heart could not be recorded clearly. A biomedical information measuring device capable of obtaining accurate medical information is created by measuring an apexcardiogram in M-mode using a linear probe, and improving a data processing device so as to establish an algorithm useful in accurate evaluation so as to solve the above problem.
摘要翻译：使用超声波诊断仪，无法准确获得心脏的心脏信息，因为心脏的心脏顶点无法清晰记录。通过使用线性探测器以M模式测量多个心尖图，并且改进数据处理装置，以便建立可用于精确评价的算法，从而获得准确的医疗信息，从而生成能够获得准确的医疗信息的生物医学信息测量装置，从而解决上述问题。

22. 发明申请

US20090233468A1 Electronic device and on-vehicle module 有权
标题翻译：电子设备和车载模块
公开(公告)号：US20090233468A1
公开(公告)日：2009-09-17
申请号：US12285893
申请日：2008-10-16
申请人： Shiro Yamashita , Hideto Yoshinari
发明人： Shiro Yamashita , Hideto Yoshinari
IPC分类号： H01R12/00
CPC分类号： H05K1/119 , H05K1/0366 , H05K1/056 , H05K1/141 , H05K3/308 , H05K3/42 , H05K2201/09827 , H05K2201/09854 , H05K2201/10189 , H05K2201/10446 , H05K2201/1059 , H05K2201/10803 , Y10S439/941
摘要： In a module, press-fit connection using a pin terminal including a connection part separated into two parts and a flat plane parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal is performed. A through-hole of a board is structured so that an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board and the length of the middle part of the through-hole connected to the pin terminal is shorter than the length of the flat plane of the pin terminal.
摘要翻译：在模块中，使用包括分离成两部分的连接部分的引脚端子和在分离部分中与长度方向平行的平面并且垂直于引脚端子的分离方向的压配合连接。板的通孔的结构使得板的厚度方向中间部分处的通孔的内径小于板的正面和反面以及中间部分的长度连接到引脚端子的通孔比引脚端子的平面的长度短。

23. 发明授权

US07401393B2 Method for removing solder bumps from LSI 失效
标题翻译：从LSI去除焊锡凸块的方法
公开(公告)号：US07401393B2
公开(公告)日：2008-07-22
申请号：US10847991
申请日：2004-05-17
申请人： Motoko Kimura , Takeshi Miitsu , Takeshi Takahashi , Kaoru Katayama , Shiro Yamashita
发明人： Motoko Kimura , Takeshi Miitsu , Takeshi Takahashi , Kaoru Katayama , Shiro Yamashita
IPC分类号： B23P19/00 , H05K3/34
CPC分类号： B23K1/018 , Y10T29/49144 , Y10T29/49149 , Y10T29/49815 , Y10T29/49822
摘要： The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.
摘要翻译：本发明提供一种去除附着在LSI上的焊料的方法。在该方法中，将用于使熔融焊料粘附到其上的板状第一构件安装在加热器的顶部。将LSI放置在第一构件的顶部上，其上焊接有焊料的表面朝下。用于向LSI添加负载的第二构件放置在LSI的顶部。将加热器加热以加热第一构件和LSI，并熔化焊料。熔融的焊料被转移到第一部件。抽吸机构定位在距离第二构件的顶表面预定距离的位置。第二部件和LSI被吸引机构吸引，LSI被从第一部件拉出。从而从LSI中除去焊料。

24. 发明申请

US20070069344A1 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US20070069344A1
公开(公告)日：2007-03-29
申请号：US11528672
申请日：2006-09-28
申请人： Shiro Yamashita , Shinichi Fujiwara , Shosaku Ishihara , Hideto Joshinari
发明人： Shiro Yamashita , Shinichi Fujiwara , Shosaku Ishihara , Hideto Joshinari
IPC分类号： H01L23/495
CPC分类号： H01L23/142 , H01L23/367 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L2224/04034 , H01L2224/04042 , H01L2224/05553 , H01L2224/0603 , H01L2224/29111 , H01L2224/32225 , H01L2224/40091 , H01L2224/40095 , H01L2224/40225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73221 , H01L2224/73265 , H01L2224/77272 , H01L2224/83192 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/157 , H01L2924/30105 , H01L2924/351 , H01L2924/00 , H01L2924/01047 , H01L2924/00012 , H01L2224/37099
摘要： To prevent any uneven solder wetting in a main surface of electrodes of a semiconductor connected with a main surface of a planar lead and any displacement of the lead vis-a-vis the electrodes due to the reflow of the solder in a semiconductor module having the semiconductor element mounted on a substrate and the planar lead electrically connected therewith, the present invention provides an improved semiconductor module characterized in that the width of at least a part of the region of the main surface of the lead facing the semiconductor element is expanded wider than or equal to the width of the electrodes formed on the semiconductor element, and preferably the other part of the main surface of the lead soldered to an electrode formed on the substrate is split in the extending direction thereof.
摘要翻译：为了防止与平面引线的主表面连接的半导体的电极的主表面中的任何不均匀的焊料润湿以及由于焊料在具有安装在基板上的半导体元件和与其电连接的平面引线，本发明提供一种改进的半导体模块，其特征在于，面向半导体元件的引线的主表面的至少一部分区域的宽度被扩展到宽于或等于形成在半导体元件上的电极的宽度，优选焊接到形成在基板上的电极的引线的主表面的另一部分沿其延伸方向分开。

25. 发明申请

US20060068609A1 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US20060068609A1
公开(公告)日：2006-03-30
申请号：US11183972
申请日：2005-07-19
申请人： Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Isamu Yoshida , Masahiko Asano , Koji Sato , Shuji Eguchi , Kaoru Uchiyama
发明人： Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Isamu Yoshida , Masahiko Asano , Koji Sato , Shuji Eguchi , Kaoru Uchiyama
IPC分类号： H05K1/00
CPC分类号： H05K5/069 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/19105 , H01L2924/3025 , H05K1/0313 , H05K3/3447 , H05K5/0069 , H05K2201/0999 , H05K2201/10189 , H05K2201/10977 , H05K2201/2009 , Y10S439/935 , H01L2924/00
摘要： An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.
摘要翻译：一种电子设备包括具有通孔并使用玻璃化转变温度超过150℃的树脂作为基底的电路板，具有开口的金属外壳和安装在所述开口的连接器金属壳体，其中连接器的销插入通孔中，销和通孔与导电构件连接，并且还在导电构件上设置用于固定连接器和板的加强构件，从而改善电子设备的可靠性。

26. 发明申请

US20050100274A1 Light dispersion compensating element and composite type light dispersion compensating element using that element and light dispersion compensating method using that element 审中-公开
标题翻译：使用该元件的光色散补偿元件和复合型光色散补偿元件以及使用该元件的光色散补偿方法
公开(公告)号：US20050100274A1
公开(公告)日：2005-05-12
申请号：US10398576
申请日：2001-10-12
申请人： Shiro Yamashita , Noboru Higashi
发明人： Shiro Yamashita , Noboru Higashi
IPC分类号： G02B5/26 , G02B5/28 , G02B6/34 , H04B10/2507 , H04B10/2525 , H04B10/40 , H04B10/50 , H04B10/60 , G02B6/26 , G02B6/02
CPC分类号： G02B5/288 , G02B6/29364 , G02B6/29367 , G02B6/29394 , G02B6/29395 , H04B10/25133
摘要： In the past, the occurrence of wavelength dispersion in signals transmitted through optical fibers caused considerable problems in terms of communications at a communications bit rate of 10 Gbps or more, and particularly optical communications at 40 Gbps or more. In the present invention, an optical dispersion compensating element can be realized having a group velocity delay time vs. wavelength characteristics curve in which the extreme value of group velocity delay time is large over a broad bandwidth by composing a compound optical dispersion compensating element containing optical dispersion compensating elements in which a reflector Or multi-layer film element is disposed in opposition to the incident surface of a multi-layer film element capable of performing dispersion compensation by utilizing group velocity delay time vs. wavelength characteristics, and connecting a plurality of elements capable of performing dispersion compensation in series. According to the present invention, dispersion compensation for each channel as well as dispersion compensation of a plurality of channels is performed.
摘要翻译：在过去，通过光纤传输的信号中的波长色散的发生在通信比特率为10Gbps以上，特别是40Gbps以上的光通信的通信方面引起相当大的问题。在本发明中，通过组合包含光学的复合光学色散补偿元件，可以实现具有群速度延迟时间对波长特性曲线的光学色散补偿元件，其中组宽度带宽上的组速度延迟时间的极值大散射补偿元件，其中反射器或多层膜元件与通过利用组速度延迟时间对波长特性进行色散补偿的多层膜元件的入射表面相对设置，并且连接多个元件能够串联进行色散补偿。根据本发明，执行每个通道的色散补偿以及多个通道的色散补偿。

27. 发明授权

US4306170A AT-Cut quartz resonator, with w/t=2.0 to 2.8, l/t<25 失效
标题翻译： AT-Cut石英谐振器，w / t = 2.0至2.8，l / t <25
公开(公告)号：US4306170A
公开(公告)日：1981-12-15
申请号：US69932
申请日：1979-08-27
申请人： Shunichi Motte , Naoyuki Echigo , Shiro Yamashita , Tsuneo Kuwabara , Kunihiro Takahashi
发明人： Shunichi Motte , Naoyuki Echigo , Shiro Yamashita , Tsuneo Kuwabara , Kunihiro Takahashi
IPC分类号： G04F5/06 , H03H9/02 , H03H9/19 , H01L41/08
CPC分类号： H03H9/02023 , G04F5/063 , H03H9/02157
摘要： An AT-cut quartz resonator is disclosed, wherein the length l, the width w and the thickness t of the quartz crystal plate are respectively chosen in the directions of an electrical axis (X-axis), an optical axis (Z'-axis) and a mechanical axis (Y'-axis), the width-to-thickness ratio w/t is chosen in the range of 2.0 to 2.8 and the length-to-thickness ratio l/t is chosen less than 25. Consequently, an AT-cut quartz resonator of miniature size having high Q-values of the major mode and excellent frequency-temperature characteristics of the vibration frequency is realized.
摘要翻译：公开了一种AT切割石英谐振器，其中石英晶体板的长度l，宽度w和厚度t分别沿电轴（X轴），光轴（Z'轴））和机械轴（Y'轴），宽/厚比w / t选择在2.0至2.8的范围内，并且长度与厚度之比1 / t选择为小于25.因此，实现了主模具有高Q值和振动频率优异频率特性的微型尺寸的AT切割石英谐振器。

28. 发明授权

US4071786A Thickness-shear crystal vibrator 失效
标题翻译：厚度剪切晶体振子
公开(公告)号：US4071786A
公开(公告)日：1978-01-31
申请号：US672460
申请日：1976-03-31
申请人： Shiro Yamashita
发明人： Shiro Yamashita
IPC分类号： G04G3/00 , H03H9/19 , H01L41/04
CPC分类号： H03H9/19
摘要： A thickness-shear crystal vibrator having a pair of driving electrodes on a pair of opposed planar surfaces. A pair of side surfaces adjacent the opposed surfaces has a pair of electrode leads disposed thereon which extend from the driving electrodes to the thickness center line or shear vibration modal line of the vibrator. The electrode leads are formed to extend over a bevel cut at the edge portion of the opposed side planar surfaces and ends of the electrode leads are both connected to a respective conductive supporting member.
摘要翻译：一种厚度剪切晶体振子，在一对相对的平面上具有一对驱动电极。邻近相对表面的一对侧表面具有一对设置在其上的电极引线，其从驱动电极延伸到振动器的厚度中心线或剪切振动模态线。电极引线形成为在相对的侧平面的边缘部分的斜切部分上延伸，并且电极引线的端部都连接到相应的导电支撑构件。

29. 发明授权

US09306020B2 Power module and method of manufacturing the power module 有权
标题翻译：电源模块及其制造方法
公开(公告)号：US09306020B2
公开(公告)日：2016-04-05
申请号：US14123909
申请日：2012-06-28
申请人： Shinichi Fujino , Hideto Yoshinari , Shiro Yamashita
发明人： Shinichi Fujino , Hideto Yoshinari , Shiro Yamashita
IPC分类号： H01L29/66 , H01L29/45 , H01L25/18 , H01L23/00 , H01L23/36 , H01L23/433 , H01L23/495 , H01L23/482 , H01L29/417 , H01L23/488 , H01L23/492 , H01L23/473
CPC分类号： H01L29/45 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/4824 , H01L23/488 , H01L23/492 , H01L23/49524 , H01L23/49531 , H01L23/49575 , H01L24/05 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/95 , H01L25/18 , H01L29/41708 , H01L2224/04042 , H01L2224/05552 , H01L2224/05554 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29101 , H01L2224/32245 , H01L2224/40095 , H01L2224/40137 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83192 , H01L2224/83801 , H01L2224/83815 , H01L2224/84801 , H01L2224/85005 , H01L2224/92247 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/37099
摘要： A power module includes a semiconductor device having at least one electrode surface on each side thereof, a first conductive member connected to the electrode surface provided on one side of the semiconductor device with solder, and a second conductive member connected to the electrode surface provided on the other side of the semiconductor device with solder, with at least one of the electrode surfaces provided on the one side of the semiconductor device being double comb-shaped.
摘要翻译：功率模块包括半导体器件，其每侧具有至少一个电极表面，第一导电元件，连接到设置在半导体器件的一侧上的焊料的电极表面，以及连接到设置在该半导体器件上的电极表面的第二导电元件具有焊料的半导体器件的另一侧，其中设置在半导体器件的一侧上的至少一个电极表面是双梳状的。

30. 发明申请

US20130324848A1 BIOMETRIC INFORMATION MEASURING DEVICE AND BIOMETRIC INFORMATION MEASURING SYSTEM 审中-公开
标题翻译：生物量信息测量装置和生物信息测量系统
公开(公告)号：US20130324848A1
公开(公告)日：2013-12-05
申请号：US13512291
申请日：2010-11-22
申请人： Shigehiro Kuroki , Shiro Yamashita
发明人： Shigehiro Kuroki , Shiro Yamashita
IPC分类号： A61B5/0245 , A61B5/044 , A61B7/00 , A61B5/04 , A61B5/024 , A61B8/04 , A61B8/02 , A61B8/00 , A61B8/08 , A61B5/021 , A61B5/00
CPC分类号： A61B5/0245 , A61B5/021 , A61B5/02416 , A61B5/026 , A61B5/04012 , A61B5/044 , A61B5/7475 , A61B7/00 , A61B8/02 , A61B8/04 , A61B8/0883 , A61B8/461 , A61B8/463 , A61B8/5223
摘要： Though mechanocardiogram is considered to have a high medical value, mechanocardiogram recording device is large in size and very expensive, obtained data lacks reliability, a measurement algorithm has not been settled, use of an apexcardiogram for diagnosis is not useful for diagnosis of the circulatory system, and there has been no measuring equipment capable of measuring pexcardiogram which contribute to determination of heal condition of a living body to be measured. For measurement of heartbeat of a living body, measuring device which allows simple measurement of apexcardiogram at bedside has been developed using a pressure sensor and/or wave sensor capable of measuring change in pressure at multiple portions adjacent to one another, and simple electronic circuit. Data processing algorithm for obtaining health information of a living body to be measured with high reliability from measured apexcardiogram and a biometric information measuring device having a new data processing algorithm on board have been developed to solve the problem.
摘要翻译：虽然机械心电图被认为具有很高的医学价值，机械心电图记录装置的尺寸大且非常昂贵，但获得的数据缺乏可靠性，测量算法尚未解决，使用心尖图诊断不利于诊断循环系统，并且没有能够测量有助于测定要测量的活体的愈合状态的心脏图的测量设备。为了测量生物体的心跳，使用能够测量彼此相邻的多个部分的压力变化的压力传感器和/或波长传感器以及简单的电子电路，已经开发了允许在床边简单测量心尖型心电图的测量装置。已经开发了用于从测量的心尖图心得到具有高可靠性测量的生物体的健康信息的数据处理算法和具有新的数据处理算法的生物体信息测量装置，以解决问题。

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