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    • 25. 发明授权
    • Light emitting element including center electrode and thin wire electrode extending from periphery of the center electrode
    • 发光元件包括从中心电极的周边延伸的中心电极和细线电极
    • US08237180B2
    • 2012-08-07
    • US12656176
    • 2010-01-20
    • Kazuyuki IizukaMasahiro Arai
    • Kazuyuki IizukaMasahiro Arai
    • H01L27/15
    • H01L33/387H01L33/0079H01L33/405
    • A light emitting element includes a semiconductor laminated structure including a first semiconductor layer of first conductivity type, a second semiconductor layer of second conductivity type different from the first conductivity type, and an active layer sandwiched between the first semiconductor layer and the second semiconductor layer, a surface electrode including a center electrode disposed on one surface of the semiconductor laminated structure and a thin wire electrode extending from a periphery of the center electrode, and a contact part disposed on a part of another surface of the semiconductor laminated structure extruding a part located directly below the surface electrode, in parallel along the thin wire electrode, and including a plurality of first regions forming the shortest current pathway between the thin wire electrode and a second region allowing the plural first regions to be connected. The surface electrode has an arrangement that the shortest current pathway between the center electrode and the contact part is longer than the shortest current pathway between the thin wire electrode and the first region, and the shortest current pathway between an end part of the thin wire electrode and the contact part is not shorter than the shortest current pathway between the thin wire electrode and the first region.
    • 发光元件包括半导体层叠结构,包括第一导电类型的第一半导体层,不同于第一导电类型的第二导电类型的第二半导体层和夹在第一半导体层和第二半导体层之间的有源层, 包括设置在半导体层叠结构的一个表面上的中心电极的表面电极和从中心电极的周边延伸的细线电极,以及设置在半导体叠层结构的另一表面的一部分上的接触部分,其挤出位于 在细线电极的正下方,与细线电极并联,并且包括形成细线电极与允许多个第一区域连接的第二区域之间的最短电流通路的多个第一区域。 表面电极具有这样的布置:中心电极和接触部分之间的最短电流通路比细线电极和第一区域之间的最短电流通路长,并且细线电极端部之间的最短电流通路 并且接触部分不小于细线电极和第一区域之间的最短电流通路。
    • 26. 发明授权
    • Light-emitting element
    • 发光元件
    • US08120046B2
    • 2012-02-21
    • US12585827
    • 2009-09-25
    • Kazuyuki IizukaMasahiro Arai
    • Kazuyuki IizukaMasahiro Arai
    • H01L33/00
    • H01L33/405H01L33/0079H01L33/387
    • A light-emitting element includes a semiconductor laminated structure including a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type different from the first conductivity type and an active layer sandwiched by the first and second semiconductor layers, a first electrode on one surface side of the semiconductor laminated structure, a conductive reflective layer on an other surface side of the semiconductor laminated structure for reflecting light emitted from the active layer, a contact portion partially formed between the semiconductor laminated structure and the conductive reflective layer and being in ohmic contact with the semiconductor laminated structure, and a second electrode on a part of a surface of the conductive reflective layer on the semiconductor laminated structure without contacting the semiconductor laminated structure for feeding current to the contact portion.
    • 发光元件包括半导体叠层结构,其包括第一导电类型的第一半导体层,不同于第一导电类型的第二导电类型的第二半导体层和由第一和第二半导体层夹持的有源层, 在半导体层叠结构的一个表面侧的第一电极,在用于反射从有源层发射的光的半导体层叠结构的另一个表面侧上的导电反射层,部分地形成在半导体层叠结构和导电反射层之间的接触部 并且与半导体层叠结构欧姆接触,并且在半导体层叠结构上的导电反射层的一部分表面上的第二电极,而不接触用于将电流馈送到接触部分的半导体层叠结构。
    • 28. 发明申请
    • Light emitting device and method for fabricating the same
    • 发光元件及其制造方法
    • US20100065869A1
    • 2010-03-18
    • US12461008
    • 2009-07-29
    • Masahiro AraiKazuyuki Iizuka
    • Masahiro AraiKazuyuki Iizuka
    • H01L33/00H01L21/28
    • H01L33/0079H01L33/387H01L33/46
    • A light emitting device includes a semiconductor multilayer structure having a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and an active layer. A reflecting layer is provided at a side of one surface of the semiconductor multilayer structure and reflects a light emitted from the active layer. A supporting substrate of Si or Ge is provided at an opposite side of the reflecting layer with respect to the side of the semiconductor multilayer structure and supports the semiconductor multilayer structure via a metal bonding layer. A back surface electrode is provided at an opposite side of the supporting substrate with respect to a side of the metal bonding layer and includes Au alloyed with the support substrate. A hardness of the back surface electrode is higher than a hardness of the Au.
    • 发光器件包括具有第一导电类型的第一半导体层,第二导电类型的第二半导体层和有源层的半导体多层结构。 反射层设置在半导体多层结构的一个表面的一侧,并且反射从有源层发射的光。 在反射层的相对于半导体多层结构侧的相反侧设置有Si或Ge的支撑基板,并且经由金属接合层支撑半导体多层结构。 背面电极相对于金属接合层的一侧设置在支撑基板的相对侧,并且包括与支撑基板合金化的Au。 背面电极的硬度高于Au的硬度。
    • 30. 发明申请
    • Semiconductor light-emitting device
    • 半导体发光装置
    • US20090206354A1
    • 2009-08-20
    • US12230234
    • 2008-08-26
    • Nobuaki KitanoMasahiro AraiKazuyuki Iizuka
    • Nobuaki KitanoMasahiro AraiKazuyuki Iizuka
    • H01L33/00
    • H01L33/405H01L33/0079H01L33/387H01L2924/0002H01L2924/00
    • A semiconductor light-emitting device includes a support structure, and a light-emitting structure. The support structure includes a support substrate, and a support substrate side bonding layer disposed on one surface of the support substrate. The light-emitting structure includes a light-emitting structure side bonding layer bonded to the support substrate side bonding layer, a reflection region disposed on the support substrate side bonding layer opposite the support substrate, and a semiconductor multilayer structure including a light-emitting layer disposed on the reflection region opposite the light-emitting structure side bonding layer for emitting a light with a predetermined wavelength, and a light-extraction surface disposed on the light-emitting layer opposite the reflection region for reflecting diffusely the light. The reflection region includes a transparent layer of a material with a lower refractive index than that of the semiconductor multilayer structure, and a reflection layer of a metallic material. The transparent layer has such a thickness that interference caused by multiple reflection of light inputted to the transparent layer can be suppressed.
    • 半导体发光器件包括支撑结构和发光结构。 支撑结构包括支撑基板和设置在支撑基板的一个表面上的支撑基板侧接合层。 发光结构包括结合到支撑基板侧接合层的发光结构侧接合层,设置在与支撑基板相对的支撑基板侧接合层上的反射区域,以及包括发光层 设置在与发光结构侧接合层相对的反射区域,用于发射具有预定波长的光;以及光提取表面,设置在与反射区域相对的发光层上,用于漫反射地反射光。 反射区域包括具有比半导体多层结构的折射率低的材料的透明层和金属材料的反射层。 透明层具有能够抑制由输入到透明层的光的多次反射引起的干涉的厚度。