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    • 22. 发明申请
    • MOBILE TELECOMMUNICATION TERMINAL FOR RECEIVING BROADCAST PROGRAM
    • 用于接收广播节目的移动电信终端
    • US20070071402A1
    • 2007-03-29
    • US11537541
    • 2006-09-29
    • Hyun ParkHyung Kim
    • Hyun ParkHyung Kim
    • H04N5/91
    • H04H60/27
    • The present invention relates to a method for receiving a broadcase program in a mobile communication terminal. The present invention includes receiving a broadcast program in the mobile communication terminal, recording the broadcast program when a first event occurs, playing back the recorded broadcast program when a second event occurs, manipulating the recorded broadcast program playback to eliminate a time lag between the recorded broadcast program playback and the received broadcast program, and determining whether the time lag between the recorded broadcast program playback and the received broadcast program is eliminated.
    • 本发明涉及一种用于在移动通信终端中接收广义程序的方法。 本发明包括在移动通信终端中接收广播节目,当发生第一事件时记录广播节目,当发生第二个事件时播放记录的广播节目,操纵所记录的广播节目播放以消除所记录的广播节目之间的时滞 广播节目播放和所接收的广播节目,并且确定是否消除了所记录的广播节目播放与所接收的广播节目之间的时差。
    • 23. 发明申请
    • CMOS image sensor and method of fabricating the same
    • CMOS图像传感器及其制造方法
    • US20070023764A1
    • 2007-02-01
    • US11491236
    • 2006-07-24
    • Hyung Kim
    • Hyung Kim
    • H01L33/00
    • H01L27/14689H01L27/14609H01L27/14636
    • A CMOS image sensor and a method of fabricating the same are provided. In the CMOS image sensor, a device isolation layer is formed in a substrate to define an active region, and a photodiode is formed in the active region. A floating diffusion region is formed at a position spaced apart from the photodiode, and first and second gates are overlapped with one end of the photodiode and one end of the floating diffusion region, respectively. A third gate is disposed between the first gate and the second gate and overlapped with an upper portion of the device isolation layer and a predetermined portion of the floating diffusion region. An insulating layer is formed on the resulting structure where the third gate is formed. A buried contact has a first contact and a second contact, which are sequentially stacked to pass through the insulating layer and the third gate and to connect the third gate to the floating diffusion region disposed under the third gate.
    • 提供CMOS图像传感器及其制造方法。 在CMOS图像传感器中,器件隔离层形成在衬底中以限定有源区,并且在有源区中形成光电二极管。 浮动扩散区形成在与光电二极管间隔开的位置处,第一和第二栅极分别与光电二极管的一端和浮动扩散区的一端重叠。 第三栅极设置在第一栅极和第二栅极之间,并与器件隔离层的上部和浮动扩散区域的预定部分重叠。 在形成第三栅极的结构上形成绝缘层。 埋入触点具有顺序层叠以通过绝缘层和第三栅极并将第三栅极连接到设置在第三栅极下方的浮动扩散区域的第一触点和第二触点。
    • 27. 发明申请
    • Direct-illumination backlight apparatus having transparent plate acting as light guide plate
    • 具有用作导光板的透明板的直接照明背光装置
    • US20060187651A1
    • 2006-08-24
    • US11136529
    • 2005-05-25
    • Hyung KimJung ParkHo AhnYoung JeongYoung ParkHun HahmBum Kim
    • Hyung KimJung ParkHo AhnYoung JeongYoung ParkHun HahmBum Kim
    • G01D11/28
    • G02B6/0021G02B6/0038G02B6/0041G02F1/133603
    • A direct-illumination backlight apparatus uses LEDs as a light source. This backlight apparatus comprises: a flat reflective plate; an LED light source arranged on the reflective plate; a transparent plate arranged above the LED light source; a scattering pattern arranged on an underside of the transparent plate in a position corresponding to the LED light source; and a light guide made of transparent material, and arranged around the scattering pattern to introduce light incident from below into the transparent plate so that the light is internally reflected by the transparent plate. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel. This can remove any dark area above the LED light source in the transparent plate and thus reduce the thickness of the direct-illumination backlight apparatus.
    • 直接照明背光装置使用LED作为光源。 该背光装置包括:平面反射板; 布置在所述反射板上的LED光源; 布置在LED光源上方的透明板; 散布图案,布置在与LED光源相对应的位置的透明板的下侧上; 以及由透明材料制成的导光体,并且布置在散射图案周围以将从下方入射的光引入透明板,使得光被透明板内部反射。 该光导用于从LED光源引入部分光,使得部分光被捕获在透明板的内部,散射图用于将捕获的光束分散在LED光源正上方的位置,从而 散射的光束从透明板向LCD面板逸出。 这可以去除透明板中的LED光源上方的任何暗区,从而减小直射照明背光装置的厚度。
    • 28. 发明申请
    • Side-emission typy LED package
    • 侧排型式LED封装
    • US20060171151A1
    • 2006-08-03
    • US11318837
    • 2005-12-28
    • Young ParkHyung KimJung ParkHo AhnYoung JeongHun HahmBum Kim
    • Young ParkHyung KimJung ParkHo AhnYoung JeongHun HahmBum Kim
    • F21V5/00
    • H01L33/60F21K9/68H01L33/54
    • A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.
    • 提供了侧面发射型LED封装。 LED封装包括LED芯片,下部结构和上部结构。 下部结构具有下反射镜和透明密封构件。 下部结构支持LED芯片。 下镜从LED芯片向上和向外延伸,从而将来自LED芯片的光线向上反射。 透明密封件形成在下反射镜内部的LED芯片周围。 上部结构组合到下部结构的上部,以将由下部结构向上反射的光反射到径向横向方向。 如上所述,下部结构和上部结构彼此分开设置并组合,从而提高了密封构件的模制效率,并且可以容易地制造侧面发射型LED封装。
    • 29. 发明申请
    • Led backlight apparatus
    • LED背光装置
    • US20060146530A1
    • 2006-07-06
    • US11134430
    • 2005-05-23
    • Jung ParkHun HahmHo AhnBum KimYoung ParkHyung KimYoung Jeong
    • Jung ParkHun HahmHo AhnBum KimYoung ParkHyung KimYoung Jeong
    • F21V7/00
    • G02F1/133603G02F1/133605
    • This invention relates to an LED backlight apparatus. The LED backlight apparatus comprises: a housing having an upper opening; a reflective sheet provided on a bottom inside the housing; a plurality of LED light sources arranged above the reflective sheet at a predetermined distance to emit light toward the reflective sheet; and a light source support connected to a side wall of the housing to support the LED light sources. The light sources are arranged opposite to the reflective sheet so that light beams emitted from the LED light sources reflect from the reflective sheet before entering a diffuser plate behind the LED light sources from the reflective sheet, thereby potentially reducing the thickness of the backlight apparatus while ensuring a distance for the light beams to sufficiently mix together before entering the differ plate.
    • 本发明涉及一种LED背光装置。 LED背光装置包括:具有上开口的壳体; 设置在所述壳体内的底部的反射片; 多个LED光源,以预定距离布置在反射片上方,以向反射片发射光; 以及连接到壳体的侧壁以支撑LED光源的光源支撑件。 光源与反射片相对布置,使得从LED光源发射的光束从反射片反射到反射片之后,从LED反射片进入漫射板后面,从而潜在地减小背光装置的厚度,同时 确保在进入不同板之前使光束充分混合在一起的距离。