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热词
    • 24. 发明授权
    • Heat sink
    • 散热器
    • US06399877B1
    • 2002-06-04
    • US09576306
    • 2000-05-23
    • Takahiro Sakamoto
    • Takahiro Sakamoto
    • H05K720
    • H01L23/427H01L2924/0002H01L2924/00
    • A heat sink is provided that can efficiently dissipate heat-producing components, e.g. semiconductor devices, thus realizing small, slim, high-performance electronic equipment. The heat sink includes a plate section, a heat dissipation fin section, and a heat pipe. The plate section has an elevated section on which heat-producing components, or semiconductor devices, are mounted. The heat dissipation fin section includes a plurality of fins formed on one side of the plate section. The heat pipe is arranged over the heat-producing component mounting area and the heat dissipation fin section. The front area of the plate section is larger than that of the heat dissipation fin section.
    • 提供散热器,其可以有效地散发发热部件,例如, 半导体器件,从而实现小型,超薄,高性能的电子设备。 散热片包括板部,散热片部和热管。 板部分具有升高的部分,其上安装有发热部件或半导体器件。 散热片部分包括形成在板部分一侧的多个翅片。 热管布置在发热部件安装区域和散热片部分上。 板部分的前部区域大于散热片部分的前部区域。