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21. 发明授权

US07585205B2 Substrate polishing apparatus and method 有权
标题翻译：基材抛光装置及方法
公开(公告)号：US07585205B2
公开(公告)日：2009-09-08
申请号：US11905687
申请日：2007-10-03
申请人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
发明人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
IPC分类号： B24B49/00
CPC分类号： B24B37/04 , B24B55/02 , Y10S451/914
摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.
摘要翻译：一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

22. 发明申请

US20090291624A1 SUBSTRATE POLISHING APPARATUS AND METHOD 有权
标题翻译：基板抛光装置和方法
公开(公告)号：US20090291624A1
公开(公告)日：2009-11-26
申请号：US12534465
申请日：2009-08-03
申请人： Seiji KATSUOKA , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
发明人： Seiji KATSUOKA , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
IPC分类号： B24B37/04 , B24B41/06
CPC分类号： B24B37/04 , B24B55/02 , Y10S451/914
摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.
摘要翻译：一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

23. 发明申请

US20080085658A1 Substrate polishing apparatus and method 有权
标题翻译：基材抛光装置及方法
公开(公告)号：US20080085658A1
公开(公告)日：2008-04-10
申请号：US11905687
申请日：2007-10-03
申请人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
发明人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
IPC分类号： B24B55/02
CPC分类号： B24B37/04 , B24B55/02 , Y10S451/914
摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.
摘要翻译：一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

24. 发明申请

US20110237163A1 SUBSTRATE POLISHING APPARATUS AND METHOD 审中-公开
标题翻译：基板抛光装置和方法
公开(公告)号：US20110237163A1
公开(公告)日：2011-09-29
申请号：US13152374
申请日：2011-06-03
申请人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
发明人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
IPC分类号： B24B37/04 , B24B7/24 , B24B57/00 , B24B41/06 , B24B53/00 , B24B1/00
CPC分类号： B24B37/04 , B24B55/02 , Y10S451/914
摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.
摘要翻译：一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

25. 发明申请

US20080178800A1 Substrate processing unit and substrate processing apparatus 有权
公开(公告)号：US20080178800A1
公开(公告)日：2008-07-31
申请号：US12076834
申请日：2008-03-24
申请人： Seiji Katsuoka , Masahiko Sekimoto , Teruyuki Watanabe , Ryo Kato , Toshio Yokoyama , Kenichi Suzuki , Kenichi Kobayashi
发明人： Seiji Katsuoka , Masahiko Sekimoto , Teruyuki Watanabe , Ryo Kato , Toshio Yokoyama , Kenichi Suzuki , Kenichi Kobayashi
IPC分类号： B05C3/02
CPC分类号： H01L21/288 , C23C2/003 , C23C18/1619 , C23C18/163 , C23C18/1642 , H01L21/6708 , H01L21/67742 , H01L21/6838 , H01L21/76849
摘要： A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

26. 发明申请

US20050281947A1 Substrate processing unit and substrate processing apparatus 有权
标题翻译：基板处理单元和基板处理装置
公开(公告)号：US20050281947A1
公开(公告)日：2005-12-22
申请号：US11115214
申请日：2005-04-27
申请人： Seiji Katsuoka , Masahiko Sekimoto , Teruyuki Watanabe , Ryo Kato , Toshio Yokoyama , Kenichi Suzuki , Kenichi Kobayashi
发明人： Seiji Katsuoka , Masahiko Sekimoto , Teruyuki Watanabe , Ryo Kato , Toshio Yokoyama , Kenichi Suzuki , Kenichi Kobayashi
IPC分类号： B05B15/12 , B05C3/09 , B05C9/06 , B05C11/10 , B05C13/00 , B05C15/00 , B05D3/12 , B65H1/00 , C23C2/00 , C23C18/16 , C23C18/31 , C25D17/06 , H01L21/00 , H01L21/288 , H01L21/68 , H01L21/683 , H01L21/768
CPC分类号： H01L21/288 , C23C2/003 , C23C18/1619 , C23C18/163 , C23C18/1642 , H01L21/6708 , H01L21/67742 , H01L21/6838 , H01L21/76849
摘要： A substrate processing unit, by employing the processing unit to carry out different processings with different processing liquids, can make a reduction in the space for carrying out the entire process of substrate processing and a reduction in the energy necessary for substrate transportation. The substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; an pan surrounding the periphery of the substrate holder; an cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing the top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids; wherein the pan and the cell each have an individual liquid discharge line.
摘要翻译：基板处理单元通过使用处理单元对不同的处理液进行不同的处理，可以减少用于进行基板处理的整个处理的空间并降低基板输送所需的能量。基板处理单元包括：用于保持基板的可垂直移动的基板保持器; 围绕衬底保持器的周边的锅; 位于基板保持器下方并在锅内的电池，在其内部具有化学处理部分; 以及能够封闭电池的顶部开口的电池盖，具有用于分开喷射至少两种类型的处理液体的多个喷嘴; 其中所述锅和所述池各自具有单独的液体排出管线。

27. 发明授权

US07368016B2 Substrate processing unit and substrate processing apparatus 有权
标题翻译：基板处理单元和基板处理装置
公开(公告)号：US07368016B2
公开(公告)日：2008-05-06
申请号：US11115214
申请日：2005-04-27
申请人： Seiji Katsuoka , Masahiko Sekimoto , Teruyuki Watanabe , Ryo Kato , Toshio Yokoyama , Kenichi Suzuki , Kenichi Kobayashi
发明人： Seiji Katsuoka , Masahiko Sekimoto , Teruyuki Watanabe , Ryo Kato , Toshio Yokoyama , Kenichi Suzuki , Kenichi Kobayashi
IPC分类号： B05B15/04 , B05B7/06 , B05C3/00 , B05C13/02 , B08B3/00 , B08B3/02
CPC分类号： H01L21/288 , C23C2/003 , C23C18/1619 , C23C18/163 , C23C18/1642 , H01L21/6708 , H01L21/67742 , H01L21/6838 , H01L21/76849
摘要： A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.
摘要翻译：基板处理单元包括：用于保持基板的可垂直移动的基板保持器; 围绕衬底保持器的周边的平底锅; 位于基板保持器下方并在锅内的电池，在其内部具有化学处理部分; 以及能够封闭电池的顶部开口的电池盖，具有用于分别喷射至少两种类型的处理液体的多个喷嘴，其中锅和电池单元各自具有单独的液体排出管线。

28. 发明授权

US07735450B2 Substrate holding apparatus 有权
标题翻译：基板保持装置
公开(公告)号：US07735450B2
公开(公告)日：2010-06-15
申请号：US12076834
申请日：2008-03-24
申请人： Seiji Katsuoka , Masahiko Sekimoto , Teruyuki Watanabe , Ryo Kato , Toshio Yokoyama , Kenichi Suzuki , Kenichi Kobayashi
发明人： Seiji Katsuoka , Masahiko Sekimoto , Teruyuki Watanabe , Ryo Kato , Toshio Yokoyama , Kenichi Suzuki , Kenichi Kobayashi
IPC分类号： B05C13/02
CPC分类号： H01L21/288 , C23C2/003 , C23C18/1619 , C23C18/163 , C23C18/1642 , H01L21/6708 , H01L21/67742 , H01L21/6838 , H01L21/76849
摘要： A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.
摘要翻译：基板处理单元包括：用于保持基板的可垂直移动的基板保持器; 围绕衬底保持器的周边的平底锅; 位于基板保持器下方并在锅内的电池，在其内部具有化学处理部分; 以及能够封闭电池的顶部开口的电池盖，具有用于分别喷射至少两种类型的处理液体的多个喷嘴，其中锅和电池单元各自具有单独的液体排出管线。

29. 发明申请

US20090092469A1 SUBSTRATE PROCESSING UNIT, SUBSTRATE TRANSFER METHOD, SUBSTRATE CLEANSING PROCESS UNIT, AND SUBSTRATE PLATING APPARATUS 审中-公开
标题翻译：基板加工单元，基板转印方法，基板清洗工艺单元和基板镀膜装置
公开(公告)号：US20090092469A1
公开(公告)日：2009-04-09
申请号：US11996432
申请日：2006-08-25
申请人： Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Kenichi Suzuki , Kenichi Kobayashi , Ryo Kato
发明人： Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Kenichi Suzuki , Kenichi Kobayashi , Ryo Kato
IPC分类号： H01L21/677 , B08B7/00 , C25D17/06
CPC分类号： H01L21/68707 , H01L21/6723 , H01L21/67742 , H01L21/67745 , H01L21/68728
摘要： To provide a substrate processing unit, a substrate transfer method, a substrate cleansing process unit, and a substrate plating apparatus that make it possible for a substrate carry-in mechanism such as a robot arm to quickly release hold on the substrate after carrying in the substrate so as to shorten the time for holding the substrate and improve throughput. The substrate processing unit 10 includes a substrate holding mechanism 10 for holding the substrate 11 in a specified holding position, and a processing mechanism 32 for applying a specified process to the substrate held with the substrate holding mechanism in which a substrate guide mechanism 20 is provided with a guide pin 15 for guiding the substrate to vicinity of a holding position. The substrate holding mechanism has a plural number of rollers 14 on an outer periphery of the holding position of the substrate, with the plural number of rollers adapted to hold the substrate by supporting the periphery of the substrate from sides thereof in the vicinity of the holding position, and the roller has an integral structure made up of a large diameter portion and a small diameter portion formed above the large diameter portion, with an upper portion of the large diameter portion having a shoulder portion for the substrate in transfer to be temporarily placed on, and with the shoulder portion formed with a sloped surface sloping down toward its periphery.
摘要翻译：为了提供一种基板处理单元，基板转印方法，基板清洁处理单元和基板电镀设备，其使得诸如机器人臂之类的基板输入机构可以在携带该基板处理单元之后快速地释放保持在基板上以缩短保持基板的时间并提高生产量。基板处理单元10包括用于将基板11保持在指定的保持位置的基板保持机构10和用于对被设置有基板引导机构20的基板保持机构保持的基板进行规定处理的处理机构32 具有用于将基板引导到保持位置附近的引导销15。基板保持机构在基板的保持位置的外周具有多个辊14，多个辊适于通过从保持基板附近的侧面支撑基板的周边来保持基板并且所述辊具有由形成在所述大直径部分上方的大直径部分和小直径部分构成的整体结构，所述大直径部分的上部具有用于传送的基板的肩部临时放置并且肩部形成有朝向其周边倾斜的倾斜表面。

30. 发明授权

US07235135B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US07235135B2
公开(公告)日：2007-06-26
申请号：US10458184
申请日：2003-06-11
申请人： Mitsuru Miyazaki , Seiji Katsuoka , Teruyuki Watanabe , Yasuyuki Motojima
发明人： Mitsuru Miyazaki , Seiji Katsuoka , Teruyuki Watanabe , Yasuyuki Motojima
IPC分类号： B05C3/00
CPC分类号： H01L21/288 , H01L21/67051 , H01L21/6715 , H01L21/67219 , H01L21/76843 , H01L21/76849 , H01L21/76873 , Y10T29/41
摘要： The present invention relates to a substrate processing apparatus and a substrate processing method suitable for processing a substrate with a plurality of liquids. A substrate processing apparatus comprises a substrate holding device for holding a substrate, a container having an opening portion disposed so that the opening portion is opposed to a surface, to be processed, of the substrate, a driving device for moving the container or the substrate holding device between a position at which the container approaches the substrate or a position at which the substrate enters the container, and a position at which the container is positioned away from the substrate, a first treatment liquid supply device for bringing the surface, to be processed, of the substrate which has approached or entered the container into a first treatment liquid, a covering member for covering the opening portion of the container at the position at which the container is positioned away from the substrate, and a second treatment liquid supply device for bringing the surface, to be processed, of the substrate into a second treatment liquid in a state in which the opening portion of the container is covered with the covering member.
摘要翻译：本发明涉及适用于处理具有多种液体的基板的基板处理装置和基板处理方法。基板处理装置包括用于保持基板的基板保持装置，具有开口部的容器，该开口部设置成使得开口部与待处理的表面相对，基板的移动容器或基板的驱动装置保持装置在容器接近基板的位置或基板进入容器的位置之间，以及容器位于远离基板的位置，第一处理液供给装置，用于使表面成为已经接近或进入容器的基板被处理成第一处理液体;覆盖部件，用于在容器位于远离基板的位置处覆盖容器的开口部分;以及第二处理液体供应装置用于使基板的待处理表面在开口的状态下进入第二处理液容器的离子被覆盖部件覆盖。

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