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21. 发明授权

US09012590B2 Electrostatic dissipative TPU and compositions thereof 有权
标题翻译：静电消散TPU及其组合物
公开(公告)号：US09012590B2
公开(公告)日：2015-04-21
申请号：US12895996
申请日：2010-10-01
申请人： Qiwei Lu , Donald A. Meltzer , Yona Eckstein
发明人： Qiwei Lu , Donald A. Meltzer , Yona Eckstein
IPC分类号： C08G18/00 , C08G18/42 , C08G18/32 , C08G18/66 , C08G18/76 , C08K5/00 , C08K5/41
CPC分类号： C08K5/43 , C08G18/3215 , C08G18/34 , C08G18/4202 , C08G18/4238 , C08G18/664 , C08G18/7671 , C08K5/0075 , C08K5/41 , C08K5/42 , C08L23/02 , C08L25/06 , C08L27/06 , C08L27/16 , C08L33/00 , C08L33/20 , C08L67/00 , C08L69/00 , C08L71/02 , C08L75/06 , C08L77/00 , C08L81/04 , H01M2/1653 , H01M2/1673 , H01M8/1044 , H01M8/1046 , H01M10/0525 , H01M10/0568 , H01M2008/1095 , H01M2300/0082
摘要： The present invention relates to an electrostatic dissipative thermoplastic polyurethane composition made by reacting (a) at least one polyester polyol intermediate with (b) at least one diisocyanate and (c) at least one chain extender. The polyester polyol intermediate, may be derived from at least one dialkylene glycol and at least one dicarboxylic acid, or an ester or anhydride thereof. The invention further provides for methods of making said thermoplastic polyurethane composition, polymer blends containing said thermoplastic and polymer articles made from said thermoplastic.
摘要翻译：本发明涉及通过（a）至少一种聚酯多元醇中间体与（b）至少一种二异氰酸酯和（c）至少一种扩链剂反应制备的静电耗散热塑性聚氨酯组合物。聚酯多元醇中间体可以衍生自至少一种二亚烷基二醇和至少一种二羧酸或其酯或酸酐。本发明进一步提供制备所述热塑性聚氨酯组合物的方法，所述聚合物共混物含有由所述热塑性塑料制成的所述热塑性塑料和聚合物制品。

22. 发明申请

US20110092648A1 Electrostatic Dissipative TPU and Compositions Thereof 有权
标题翻译：静电耗散TPU及其组合物
公开(公告)号：US20110092648A1
公开(公告)日：2011-04-21
申请号：US12895996
申请日：2010-10-01
申请人： Qiwei Lu , Donald A. Meltzer , Yona Eckstein
发明人： Qiwei Lu , Donald A. Meltzer , Yona Eckstein
IPC分类号： C08L75/06 , C08G18/34 , C08L77/00
CPC分类号： C08K5/43 , C08G18/3215 , C08G18/34 , C08G18/4202 , C08G18/4238 , C08G18/664 , C08G18/7671 , C08K5/0075 , C08K5/41 , C08K5/42 , C08L23/02 , C08L25/06 , C08L27/06 , C08L27/16 , C08L33/00 , C08L33/20 , C08L67/00 , C08L69/00 , C08L71/02 , C08L75/06 , C08L77/00 , C08L81/04 , H01M2/1653 , H01M2/1673 , H01M8/1044 , H01M8/1046 , H01M10/0525 , H01M10/0568 , H01M2008/1095 , H01M2300/0082
摘要： The present invention relates to an electrostatic dissipative thermoplastic polyurethane composition made by reacting (a) at least one polyester polyol intermediate with (b) at least one diisocyanate and (c) at least one chain extender. The polyester polyol intermediate, may be derived from at least one dialkylene glycol and at least one dicarboxylic acid, or an ester or anhydride thereof. The invention further provides for methods of making said thermoplastic polyurethane composition, polymer blends containing said thermoplastic and polymer articles made from said thermoplastic.
摘要翻译：本发明涉及通过（a）至少一种聚酯多元醇中间体与（b）至少一种二异氰酸酯和（c）至少一种扩链剂反应制备的静电耗散热塑性聚氨酯组合物。聚酯多元醇中间体可以衍生自至少一种二亚烷基二醇和至少一种二羧酸或其酯或酸酐。本发明进一步提供制备所述热塑性聚氨酯组合物的方法，所述聚合物共混物含有由所述热塑性塑料制成的所述热塑性塑料和聚合物制品。

23. 发明授权

US07378455B2 Molding composition and method, and molded article 失效
标题翻译：成型组合物和成型品
公开(公告)号：US07378455B2
公开(公告)日：2008-05-27
申请号：US11172308
申请日：2005-06-30
申请人： Qiwei Lu , Michael O'Brien , Michael Vallance
发明人： Qiwei Lu , Michael O'Brien , Michael Vallance
IPC分类号： C08F2/50 , B29C41/00 , B29C39/00
CPC分类号： C08G59/68 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , Y10T428/31511 , H01L2924/00014 , H01L2924/00
摘要： A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.
摘要翻译：用于封装固态器件的可固化方法包括（A）环氧树脂; （B）有效量的固化催化剂，其包含（B1）包含二芳基碘鎓六氟锑酸盐的第一潜阳离子固化催化剂; （B2）包含（B2a）二芳基碘鎓阳离子的第二潜在阳离子固化催化剂和（B2b）选自高氯酸盐，亚氨基二硫基氟化物阴离子，未取代和取代的（C 1 -C 12）全氟链烷酸酯，四氟硼酸酯，未取代和取代的四 - （C 1 -C 12 - ）烷基磺酸酯，（C 2 -C 12 -C 12 - 六氟磷酸盐，六氟砷酸盐，三（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）亚胺阴离子及其组合; 和（B3）选自自由基产生芳族化合物，过氧化合物，脂族羧酸的铜（II）盐，芳族羧酸的铜（II）盐，乙酰丙酮化的铜（II）及其组合）的固化助催化剂 ; 和（C）约70至约95重量％的无机填料，基于可固化组合物的总重量。组合物的固化催化剂允许使用增加的填料负载，这进而降低固化的组合物的吸湿和热膨胀。

24. 发明申请

US20070004872A1 Molding composition and method, and molded article 失效
标题翻译：成型组合物和成型品
公开(公告)号：US20070004872A1
公开(公告)日：2007-01-04
申请号：US11172300
申请日：2005-06-30
申请人： Qiwei Lu , Michael O'Brien , Gerardo Rocha-Galicia , Prameela Susarla
发明人： Qiwei Lu , Michael O'Brien , Gerardo Rocha-Galicia , Prameela Susarla
IPC分类号： C08L63/00 , C08L71/02
CPC分类号： C08G59/621 , C08L63/00 , C08L71/123 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , Y10T428/31511 , C08L2666/22 , H01L2924/00014 , H01L2924/00
摘要： A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.
摘要翻译：适用于封装固态器件的模塑组合物包括环氧树脂，硬化剂，包含小于5重量％的大于100微米的颗粒的聚（亚芳基醚）树脂和约70至约95重量％的二氧化硅填料，基于组合物的总重量。固化后，与常规模塑组合物相比，该组合物显示出改进的增加的铜附着力和减小的收缩率。

25. 发明申请

US20130310505A1 Flame Retardant Thermoplastic Polyurethane Compositions 有权
标题翻译：阻燃热塑性聚氨酯组合物
公开(公告)号：US20130310505A1
公开(公告)日：2013-11-21
申请号：US13983385
申请日：2012-02-29
申请人： Feina Cao , Greg S. Nestlerode , Qiwei Lu
发明人： Feina Cao , Greg S. Nestlerode , Qiwei Lu
IPC分类号： C08L75/04
CPC分类号： C08L75/04 , C08G18/42 , C08G18/48 , C08K5/5317 , C08L85/02
摘要： The present invention relates to flame retardant thermoplastic polyurethane (TPU) compositions that are prepared by compounding certain TPU's and with a polyphosphonate homopolymer or copolymer, and more specifically TPU compositions that pass ASTM E84 Class 1 and UL94 V0 ratings. The invention also relates to compositions that further include an inherently dissipative polymer to provide a TPU composition that has flame retardant properties, electrostatic discharge performance, good clarity and/or transparency, or any combination thereof.
摘要翻译：本发明涉及通过将某些TPU与聚膦酸酯均聚物或共聚物混合制备的阻燃热塑性聚氨酯（TPU）组合物，更具体地说是通过ASTM E84 Class 1和UL94 V0等级的TPU组合物。本发明还涉及进一步包括固有耗散聚合物以提供具有阻燃性能，静电放电性能，良好透明度和/或透明度的TPU组合物或其任何组合的组合物。

26. 发明申请

US20130142979A1 Thermoformed IC Trays Of Poly(Phenylene Ether) Compositions 审中-公开
标题翻译：聚（苯醚）组合物的热成型IC托盘
公开(公告)号：US20130142979A1
公开(公告)日：2013-06-06
申请号：US13805035
申请日：2011-06-27
申请人： Kurt S. Edwards , Chuan Tat Choo , Qiwei Lu , Kenneth Sienkowski , Kong Chin Chew , Vanessa Mirabile
发明人： Kurt S. Edwards , Chuan Tat Choo , Qiwei Lu , Kenneth Sienkowski , Kong Chin Chew , Vanessa Mirabile
IPC分类号： H01L21/673
CPC分类号： H01L21/67336 , C08K3/04 , C08K3/041 , C08K3/042 , C08L53/02 , C08L71/12 , C08L71/123 , Y10T428/1397 , C08L2666/24 , C08L2666/04
摘要： The present invention relates to a component carrier tray, and more particularly, a thermoformed carrier tray for integrated circuit (IC) components such as IC chips. The trays of the present invention have the benefit of being suitable for all parts of the IC component manufacturing process, including being suitable for the steps of transporting, sorting, storing, baking, etc. Thus the trays of the present invention reduce the need for transferring IC components from one tray to another and as a result reduce manufacturing cost and risk of part damage. The trays of the present invention are particularly suitable for mid-temperature applications.
摘要翻译：本发明涉及一种分量载体托盘，更具体地说，涉及一种用于集成电路（IC）元件如IC芯片的热成型载体托盘。本发明的托盘具有适用于IC部件制造工艺的所有部件的优点，包括适于运输，分选，储存，烘烤等步骤。因此，本发明的托盘减少了对将IC组件从一个托盘转移到另一个托盘，从而降低制造成本和部件损坏的风险。本发明的托盘特别适用于中温应用。

27. 发明申请

US20090110845A1 METHODS FOR BONDING HIGH TEMPERATURE SENSORS 审中-公开
标题翻译：用于连接高温传感器的方法
公开(公告)号：US20090110845A1
公开(公告)日：2009-04-30
申请号：US11927756
申请日：2007-10-30
申请人： Qiwei Lu , Robert James Perry , Ying Fan , Kevin Warner Flanagan , James Norman Barshinger , Wendy Wen-Ling Lin , Irene Dris
发明人： Qiwei Lu , Robert James Perry , Ying Fan , Kevin Warner Flanagan , James Norman Barshinger , Wendy Wen-Ling Lin , Irene Dris
IPC分类号： B05D3/00 , B05D3/12 , B05D5/10 , B05D7/00
CPC分类号： C09J5/06 , G01N29/2475 , G01N2291/02854 , G01N2291/044 , H01L24/28 , H01L24/83 , H01L2224/8388 , H01L2924/01012 , H01L2924/01029 , H01L2924/351 , H01L2924/00
摘要： The invention provides a method of bonding a sensor to a surface comprising the steps of applying a thermoplastic film to a first surface of the sensor. The first surface of the sensor is contacted with a surface of an object to be monitored, wherein the composition effectively bonds the sensor to the object surface at a temperature up to approximately 250° C. The invention also provides a method of bonding a sensor to a surface comprising the steps of applying a thermoplastic film to a surface area of an object to be monitored. The first surface of a sensor is contacted with the object surface area, wherein the film effectively bonds the sensor to the object surface at a temperature up to approximately 250° C.
摘要翻译：本发明提供了一种将传感器结合到表面的方法，包括以下步骤：将热塑性膜施加到传感器的第一表面。传感器的第一表面与待监测物体的表面接触，其中组合物在高达约250℃的温度下将传感器有效地粘合到物体表面。本发明还提供了一种将传感器粘合到表面包括将热塑性膜施加到被监测物体的表面区域的步骤。传感器的第一表面与物体表面区域接触，其中膜在高达约250℃的温度下将传感器有效地粘合到物体表面。

28. 发明申请

US20070004819A1 Molding composition and method, and molded article 失效
标题翻译：成型组合物和成型品
公开(公告)号：US20070004819A1
公开(公告)日：2007-01-04
申请号：US11172308
申请日：2005-06-30
申请人： Qiwei Lu , Michael O'Brien , Michael Vallance
发明人： Qiwei Lu , Michael O'Brien , Michael Vallance
IPC分类号： C08F2/46 , C08L63/00 , C08L71/02
CPC分类号： C08G59/68 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , Y10T428/31511 , H01L2924/00014 , H01L2924/00
摘要： A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.
摘要翻译：用于封装固态器件的可固化方法包括（A）环氧树脂; （B）有效量的固化催化剂，其包含（B1）包含二芳基碘鎓六氟锑酸盐的第一潜阳离子固化催化剂; （B2）包含（B2a）二芳基碘鎓阳离子的第二潜在阳离子固化催化剂和（B2b）选自高氯酸盐，亚氨基二硫基氟化物阴离子，未取代和取代的（C 1 -C 12）全氟链烷酸酯，四氟硼酸酯，未取代和取代的四 - （C 1 -C 12 - ）烷基磺酸酯，（C 2 -C 12 -C 12 - 六氟磷酸盐，六氟砷酸盐，三（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）亚胺阴离子及其组合; 和（B3）选自自由基产生芳族化合物，过氧化合物，脂族羧酸的铜（II）盐，芳族羧酸的铜（II）盐，乙酰丙酮化的铜（II）及其组合）的固化助催化剂 ; 和（C）约70至约95重量％的无机填料，基于可固化组合物的总重量。组合物的固化催化剂允许使用增加的填料负载，这进而降低固化的组合物的吸湿和热膨胀。

29. 发明授权

US09657172B2 Flame retardant thermoplastic polyurethane compositions 有权
公开(公告)号：US09657172B2
公开(公告)日：2017-05-23
申请号：US13983385
申请日：2012-02-29
申请人： Feina Cao , Greg S. Nestlerode , Qiwei Lu
发明人： Feina Cao , Greg S. Nestlerode , Qiwei Lu
IPC分类号： C08G18/42 , C08L75/04 , C08G18/48 , C08K5/5317
CPC分类号： C08L75/04 , C08G18/42 , C08G18/48 , C08K5/5317 , C08L85/02
摘要： The present invention relates to flame retardant thermoplastic polyurethane (TPU) compositions that are prepared by compounding certain TPU's and with a polyphosphonate homopolymer or copolymer, and more specifically TPU compositions that pass ASTM E84 Class 1 and UL94 V0 ratings. The invention also relates to compositions that further include an inherently dissipative polymer to provide a TPU composition that has flame retardant properties, electrostatic discharge performance, good clarity and/or transparency, or any combination thereof.

30. 发明授权

US09650514B2 Electrostatic dissipative polycarbonate compositions 有权
公开(公告)号：US09650514B2
公开(公告)日：2017-05-16
申请号：US14110469
申请日：2012-04-19
申请人： Qiwei Lu , Feina Cao
发明人： Qiwei Lu , Feina Cao
IPC分类号： C08G18/67 , C08L51/00 , C08L69/00 , C08G18/48 , C08K3/26 , C09D17/00 , C08J3/22 , C08K3/34 , C08L75/04 , C08G18/42 , C08G18/44 , C08G18/66 , C08G18/76
CPC分类号： C08L75/04 , C08G18/4277 , C08G18/44 , C08G18/4833 , C08G18/664 , C08G18/6674 , C08G18/7671 , C08L69/00 , C08L2205/02
摘要： The present invention relates to electrostatic dissipative polycarbonate compositions that are prepared by combining an aromatic polycarbonate polymer with a thermoplastic polyurethane based inherently dissipative polymer and a compatibilizer component that comprises a second thermoplastic polyurethane. This second thermoplastic polyurethane is a reaction product of (a) at least one polyol intermediate, (b) at least one diisocyanate, and (c) at least one chain extender, wherein (a), the polyol intermediate comprises a polycaprolactone polyol, a polycarbonate polyol, or combinations thereof.

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