会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 23. 发明专利
    • Device interconnects
    • GB2458907A
    • 2009-10-07
    • GB0805848
    • 2008-04-01
    • SHARP KK
    • ALTEBAEUMER THOMAS HEINZ-HELMUTDAY STEPHENLANG CHRISTIANHEFFERNAN JONATHAN
    • H01L23/538H01L21/60H01L25/065
    • In a method of fabricating a device structure an insulating layer (3b) is formed over a first set of devices disposed over a substrate (3). One or more vias are formed in the insulating layer and a second set of devices (6) is disposed over the insulating layer. The devices of the second set comprise respective electrical contacts (6a) and are disposed over the insulating layer (3b) such that a side on which a contact (6a) can be accessed faces the substrate (3). One or more electrical contacts are formed between the first set of devices and the second set of devices (6) through the via(s). The second set of devices and at least one via are positioned such that one or more of the vias lies at least partially within the footprint of two devices, each belonging to a different device layer. This reduces the area of the substrate not occupied by devices. At least one device of the second set (6) comprises electrical contacts (6a) that can be accessed on two opposing sides and is disposed over the insulating layer (3b) such that one of the sides on which contacts can be accessed faces the substrate. This allows any desired number of layers of devices to be stacked.
    • 29. 发明专利
    • Vertical cavity surface emitting laser
    • GB2399940A
    • 2004-09-29
    • GB0306778
    • 2003-03-25
    • SHARP KK
    • HOOPER STEWART EDWARDHEFFERNAN JONATHAN
    • H01S3/08H01S5/00H01S5/042H01S5/183H01S5/20H01S5/343
    • A semiconductor laser device 15 comprises a substrate 16. A first minor structure 17, an active region 18 and a second minor structure 19 are disposed in this order over the substrate 16. The second minor structure has a first portion 28 having a first width W1 and a second portion 29 having a second width W2 less than the first width W1. The first portion 28 of the second minor structure 19 is disposed between the second portion 29 of the second minor structure 19 and the active region 18. A contact 24 is disposed on the surface of the first portion of the second minor structure, where it is not covered by the second portion of the second minor structure. The contact 24 is thus provided at an intermediate location, in the thickness direction, of the second minor structure 19. Current injected into the laser device via the contact 24 does not need to pass through the entire thickness of the second minor structure, but has to pass only through the first portion of the second minor structure. The resistance of the current path through the laser device is therefore reduced. Contact 24 is formed on the etch stop layer 23.