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    • 22. 发明授权
    • Methods of forming inductors on integrated circuits
    • 在集成电路上形成电感器的方法
    • US08042260B2
    • 2011-10-25
    • US12250385
    • 2008-10-13
    • Peter J. HopperPeter JohnsonPeter SmeysAndrei Papou
    • Peter J. HopperPeter JohnsonPeter SmeysAndrei Papou
    • H01F7/06
    • H01L23/5227H01F17/0006H01F41/046H01L2924/0002Y10T29/4902Y10T29/49071Y10T29/49073Y10T29/49075Y10T29/49124Y10T29/4913H01L2924/00
    • The claimed invention pertains to methods of forming one or more inductors on a semiconductor substrate. In one embodiment, a method of forming an array of inductor core elements on a semiconductor substrate that includes integrated circuits is disclosed. A first set of spaced apart metallic core elements are formed over the substrate. Isolation sidewalls are then formed on side surfaces of the core elements. Afterward, a second set of metallic core elements are formed over the substrate. The first and second sets of core elements are substantially co-planar and interleaved such that only the isolation sidewalls separate adjacent core elements. Particular embodiments involve other processing operations, such as the selective electroplating of different types of metal to form core elements and/or the deposition and etching away of an isolation layer to form isolation sidewalls on the core elements.
    • 所要求保护的发明涉及在半导体衬底上形成一个或多个电感器的方法。 在一个实施例中,公开了一种在包括集成电路的半导体衬底上形成电感器芯元件阵列的方法。 第一组间隔开的金属芯元件形成在衬底上。 然后在芯元件的侧表面上形成隔离侧壁。 之后,在衬底上形成第二组金属芯元件。 第一和第二组芯元件基本上是共面的和交错的,使得只有隔离侧壁分隔相邻的芯元件。 具体实施例涉及其他处理操作,例如不同类型的金属的选择性电镀以形成核心元件和/或沉积和蚀刻离开隔离层以在核心元件上形成隔离侧壁。